10M04DCU324I7P - MAX 10 FPGA 4K LE UFBGA-324 | Intel / Altera
MPN: 10M04DCU324I7P ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $15.59 | $15.59 |
| 10 | $14.5 | $145.00 |
| 100 | $12.85 | $1,285.00 |
| 500 | $11.4 | $5,700.00 |
| 1,000 | $9.95 | $9,950.00 |
10M04DCU324I7P Overview
An FPGA (Field Programmable Gate Array) is a programmable logic device that lets engineers implement arbitrary digital logic through a configuration bitstream, occupying the hierarchy: FPGA -> programmable logic device -> digital IC -> semiconductor. The MAX 10 family targets glue-logic, motor control, and I/O-expansion roles where a microcontroller alone is insufficient but a high-density Cyclone or Stratix part is over-spec. The 10M04 is the lowest-density member of the MAX 10 lineup, sitting below the 10M08, 10M16, and 10M50.
Key features include 4,000 Logic Elements (LEs), 193,536 bits of user flash, integrated ADC block, on-chip temperature sensor, and support for single-supply operation from a 3.0V/3.3V external rail. The device also offers embedded SRAM configured as M9K blocks, phase-locked loops (PLLs) for clock generation, and hardened multipliers for DSP. The UFBGA-324 package exposes 246 general-purpose user I/Os while the remaining balls are allocated to power, ground, and configuration signals.
From an architecture standpoint, MAX 10 devices use a look-up-table (LUT) based fabric with non-volatile flash configuration cells, eliminating the need for external boot PROM. The dual-configuration flash image feature allows in-field firmware updates without external storage. The internal configuration controller reloads the bitstream from flash at power-up, achieving sub-10ms startup typical for the 10M04 density.
Typical applications include industrial I/O expansion, motor drive control, sensor aggregation front-ends, protocol bridging (UART/SPI/I2C to Ethernet), and low-density glue-logic replacement. Designers also use the 10M04 for portable instrumentation and display controllers where low static power and instant-on behavior are valuable.
When designing with the 10M04DCU324I7P, ensure the PCB supports the 0.8mm ball pitch required by the UFBGA-324 package, with microvia or laser-drilled via stackups. Verify that Quartus Prime supports the 10M04 device family and that the chosen speed grade (-7) meets timing closure targets. This page synthesizes distributor pricing, same-family drop-in variants, and PCB layout guidance not found in the manufacturer datasheet alone.
Drop-in alternatives for 10M04DCU324I7P — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with 10M04DCU324I7P (same form factor and footprint) — differing in Package, Speed Grade, Process Technology, Configuration Memory, Operating Temperature Grade.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
10M04DCU324I7G
✅ Drop-In✓ In Stock
$9.15 / Unit
View Datasheet →10M04DCU324C8G
✅ Drop-In✓ In Stock
$13.8 / Unit
View Datasheet →10M04DCU324A7G
✅ Drop-In✓ In Stock
$9.85 / Unit
View Datasheet →10M04DAU324I7G
✅ Drop-In✓ In Stock
$13.5 / Unit
View Datasheet →10M04DAU324C8G
✅ Drop-In✓ In Stock
Contact for price
View Datasheet →10M04DCU324I7P Maximum Ratings & Electrical Characteristics
| Family | MAX 10 |
| Logic Elements (LE) | 4,000 |
| User Flash Memory | 193,536 bits |
| Maximum User I/O | 246 |
| Package | 324-ball UFBGA (UBGA-324) |
| Process Technology | 55 nm |
| Core Voltage | 1.2 V |
| Operating Temperature Grade | Industrial (-40C to +100C TJ) |
| Speed Grade | -7 |
| Mounting Type | Surface Mount (BGA) |
| Configuration Method | On-chip flash (non-volatile) |
| RoHS Status | Compliant (Pb-free package) |
10M04DCU324I7P 324-ball ufbga (ubga-324) Pin Configuration Guide
Pin configuration for 10M04DCU324I7P (324-ball ufbga (ubga-324) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10M04DCU324I7P.
Refer to the datasheet for full pin configuration.
Typical Applications
10M04DCU324I7P is suitable for 6 applications: Industrial I/O Expansion, Motor Drive Control, Sensor Aggregation Front-End, Protocol Bridging (UART/SPI/I2C to Ethernet), Portable Instrumentation Displays, Glue-Logic Replacement for Legacy Systems.
Industrial I/O Expansion
The 10M04DCU324I7P excels at industrial I/O expansion roles where a microcontroller needs additional GPIOs, PWM channels, or custom protocol interfaces. With 246 available user I/Os on the UFBGA-324 footprint and 4,000 LEs of fabric, designers can implement debouncing, level translation glue-logic, and parallel-to-serial aggregation in a single chip. The industrial temperature grade (-40C to +100C TJ) supports factory-floor enclosures where ambient temperatures reach 70C with self-heating headroom. The on-chip non-volatile flash configuration means no external boot PROM, reducing BOM and PCB area versus SRAM-based FPGAs in retrofit I/O cards.
Recommended
Motor Drive Control
The 10M04DCU324I7P supports field-oriented control (FOC) and trapezoidal commutation algorithms for BLDC and stepper motor drives. The on-chip ADC samples motor-phase currents, while embedded multipliers handle Park/Clarke transforms and PI loop calculations. Industrial temperature grade (-40C to +100C TJ) is essential for inverter enclosures that reach 85C ambient. The 246 user I/Os provide ample headroom for PWM outputs, encoder inputs, and protection signals. MAX 10 instant-on from internal flash also enables fail-safe startup before MCU firmware boots, useful in safety-critical drive stages.
Recommended
Sensor Aggregation Front-End
The 10M04DCU324I7P serves as a sensor aggregation front-end for industrial IoT gateways, multiplexing SPI, I2C, and UART sensor buses onto a single high-speed uplink. The 246 user I/Os support dozens of sensor channels on the UFBGA-324 package, while 4,000 LEs implement custom filtering, threshold detection, and pre-processing. The on-chip ADC digitizes analog sensor outputs alongside digital buses. Industrial temperature grade and non-volatile configuration make the 10M04 suited to remote, unattended deployments where instant-on and reliability outweigh raw throughput.
Recommended
Protocol Bridging (UART/SPI/I2C to Ethernet)
The 10M04DCU324I7P implements legacy-to-modern protocol bridges, converting UART, SPI, or I2C traffic to Ethernet or USB for industrial retrofit applications. With 4,000 LEs, the device can host a soft MAC, packet buffers, and a translation state machine. The 246 user I/Os support multiple simultaneous upstream ports and a single high-speed downstream link. Non-volatile flash configuration means the bridge boots instantly on power-up without waiting for an MCU to load FPGA firmware - critical for transparent in-line installations where host systems expect immediate link readiness.
Recommended
Portable Instrumentation Displays
The 10M04DCU324I7P drives portable instrumentation displays, generating timing for TFT panels, multiplexing button matrices, and buffering measurement data. The 246 user I/Os support wide RGB interface panels, while on-chip SRAM and DSP blocks accelerate pixel processing. Instant-on from internal flash is valuable in battery-powered instruments where every millisecond of boot time draws current. The industrial temperature grade ensures the display controller operates across cold-start and warm-soak conditions typical of field measurement tools.
Recommended
Glue-Logic Replacement for Legacy Systems
The 10M04DCU324I7P replaces dozens of discrete 74-series logic gates, multiplexers, and bus transceivers on legacy industrial PCBs. With 4,000 LEs and 246 user I/Os, one device absorbs functions that previously required multiple TTL packages. The non-volatile configuration eliminates the PAL/EPROM pair of classic glue-logic designs. Industrial temperature grade matches the legacy component specs, allowing drop-in replacement of older CPLD-based solutions with no firmware or hardware rework in the surrounding circuit.
Recommended
Recommended Products Summary
Engineering reference data for 10M04DCU324I7P — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10M04DCU324I7G | 10M04DCU324C8G | 10M04DCU324A7G | 10M04DAU324I7G | 10M04DAU324C8G |
|---|---|---|---|---|---|---|
| Package | UFBGA-324 | UFBGA-324 | UFBGA-324 | UFBGA-324 | UFBGA-324 | UFBGA-324 |
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Logic Elements | 4,000 | 4,000 | 4,000 | 4,000 | 4,000 | 4,000 |
| Max User I/O | 246 | 246 | 246 | 246 | 246 | 246 |
| Temperature Grade | Industrial (-40C to +100C TJ) | Industrial | Commercial (0C to +85C) | Automotive / Industrial (per variant) | Industrial | Commercial |
| Speed Grade | -7 | -7 | -8 | -7 | -7 | -8 |
| On-Chip ADC | Yes (D-suffix) | Yes | Yes | Yes | No (A-suffix) | No (A-suffix) |
Key Differentiators
- D-suffix variant includes integrated ADC for mixed-signal designs (vs 10M04DAU324I7G)
- Industrial temperature grade with full Quartus Prime support (vs 10M04DCU324C8G)
- Same-family drop-in compatibility with 4K LE fabric preserved (vs 10M02DCU324I7G)
Design Notes
The UFBGA-324 package requires PCB stackup support for 0.8mm ball pitch. Use microvia (laser-drilled) or via-in-pad technology with ENIG or ENEPIG surface finish to ensure reliable solder joints. Per IPC-7093 design guidelines for fine-pitch BGA, escape routing on the top layer plus one microvia per ball is the standard approach. Apply NSMD (Non-Solder Mask Defined) pads rather than SMD for better thermal fatigue performance on industrial-temperature applications.
The 10M04DCU324I7P requires multiple supply rails: 3.0V or 3.3V VCCIO for I/O banks, 1.2V VCCINT for core logic, and 2.5V VCCA for analog blocks. Decoupling per manufacturer datasheet: place 100nF X7R ceramic capacitors within 2mm of every VCC pin pair, plus 10uF bulk capacitors on each rail. Estimated: total quiescent current for the 10M04 typically draws 30-50mA in active configuration at room temperature, but design the 1.2V regulator for at least 500mA peak capacity to cover configuration inrush.
The UFBGA-324 package has theta_JA of approximately 15-20 C/W on a standard 4-layer JEDEC test board, rising to 25-35 C/W on a 2-layer consumer PCB. At industrial temperature grade (-40C to +100C TJ), ensure the worst-case ambient plus self-heating stays below the junction limit. Estimated: at typical 0.5W dissipation and 30 C/W theta_JA, junction rise is 15C above ambient, leaving 70C headroom at 85C ambient. Forcing airflow becomes necessary if utilization exceeds 70% of logic resources.
Do not confuse the 10M04 (4K LE) with the 10M08 or 10M16 - bitstream files are not interchangeable across densities even within the same package. Verify in Quartus Prime that the selected device matches the target OPN before programming. The U324 package is also distinct from the F256 and F484 variants of the 10M04 - ball maps differ, requiring different PCB layouts. JTAG pin assignments (TCK, TMS, TDI, TDO) must be routed to a debug header or kept accessible for factory programming.
Compliance Information
RoHS compliant per distributor listings (P and G suffix denote lead-free). AEC-Q100 not applicable to FPGA in industrial grade; verify specific automotive qualification only if A7G variant is selected.
