5CSEBA5U23I7SN - Cyclone V SE SoC FPGA, 85K LE, ARM Cortex-A9 | Intel
MPN: 5CSEBA5U23I7SN ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $485 | $485.00 |
| 10 | $436.5 | $4,365.00 |
| 100 | $388 | $38,800.00 |
| 500 | $349.2 | $174,600.00 |
| 1,000 | $310 | $310,000.00 |
5CSEBA5U23I7SN Overview
A System-on-Chip FPGA is an integrated device that merges a general-purpose processor (typically ARM Cortex-A) with FPGA programmable logic on the same silicon die, sharing high-bandwidth interconnect. This architecture eliminates the need for a separate processor and FPGA pair on the PCB, reducing board area, latency, and power. Within the taxonomy, the 5CSEBA5U23I7SN belongs to the family: SoC FPGA -> FPGA -> programmable logic -> semiconductor device. Cyclone V SE devices specifically target low-power, cost-sensitive applications while still providing transceiver and DSP capability.
Key features of the 5CSEBA5U23I7SN include approximately 85K logic elements, embedded memory blocks, variable-precision DSP blocks, and integrated transceivers supporting common serial protocols. The HPS includes ARM Cortex-A9 core with NEON media engine, single or dual-precision floating point unit, L1/L2 caches, integrated memory controller for DDR2/DDR3, and a rich set of peripherals including USB 2.0, Gigabit Ethernet, CAN, SPI, I2C, and UART. The device ships in a 23x23 mm UBGA-672 package suitable for high-density SMT assembly.
The architecture leverages Intel's low-power process technology and a hardened interconnect between the HPS and FPGA fabric. This allows deterministic data movement between processor and custom logic at multi-Gbps rates through AXI bridges. Engineers gain flexibility to implement custom peripherals, hardware accelerators, and high-speed interfaces in the FPGA portion while running Linux or RTOS on the ARM cores.
Typical applications include industrial motor control and machine vision, factory automation and robotics, medical imaging equipment, broadcast video processing, automotive driver assistance, military/aerospace signal processing, and telecom infrastructure. The combination of ARM Cortex-A9 Linux support with FPGA fabric acceleration is well-suited for edge computing, protocol bridging, and sensor fusion.
When designing with the 5CSEBA5U23I7SN, allocate sufficient PCB layers (typically 8+) for the high-speed HPS DDR3 interface and FPGA transceiver routing. The UBGA-672 package requires 0.8 mm pitch BGA assembly capability and X-ray inspection post-reflow. Use Intel Quartus Prime design software with SoC EDS for HPS firmware development.
This page synthesizes Intel/Altera datasheet parameters, real-time distributor pricing from DigiKey/Mouser, drop-in alternatives within the Cyclone V family, and design considerations that extend beyond the standard datasheet to support rapid evaluation and procurement.
Drop-in alternatives for 5CSEBA5U23I7SN — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with 5CSEBA5U23I7SN (same form factor and footprint) — differing in Logic Elements, Package, Embedded Memory, Process Technology, Operating Temperature.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
5CSEBA4U23I7SN
✅ Drop-In✓ In Stock
$98.5 / Unit
View Datasheet →5CSEBA2U23I7SN
✅ Drop-In✓ In Stock
$82 / Unit
View Datasheet →5CSEBA5U23I7SN Maximum Ratings & Electrical Characteristics
| Series | Cyclone V SE SoC FPGA |
| Manufacturer | Intel (formerly Altera) |
| Logic Elements | 85,000 |
| HPS Processor | Single-core ARM Cortex-A9 MPCore with CoreSight |
| HPS Clock Speed | 800 MHz |
| Core Supply Voltage | 1.1 V |
| Number of Logic Cells | 85,000 |
| Package | 672-UBGA (23x23 mm) |
| Mounting Type | Surface Mount |
| Operating Temperature | -40C to +100C (Industrial) |
| Number of Inputs | 145 |
| Number of Terminations | 672 |
| RoHS Status | Compliant |
| Reach Compliance | Compliant |
| Lead Free | Yes |
| Part Lifecycle Status | Active |
5CSEBA5U23I7SN 672-ubga (23x23 mm) Pin Configuration Guide
Pin configuration for 5CSEBA5U23I7SN (672-ubga (23x23 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 5CSEBA5U23I7SN.
Refer to the datasheet for full pin configuration.
Typical Applications
5CSEBA5U23I7SN is suitable for 7 applications: Industrial Motor Control and Drives, Machine Vision and Image Processing, Factory Automation and PLC Systems, Medical Imaging and Diagnostic Equipment, Broadcast Video Processing, Telecom Edge and Protocol Bridging, Automotive Driver Assistance Systems.
Industrial Motor Control and Drives
The 5CSEBA5U23I7SN is well-suited for industrial motor control because its ARM Cortex-A9 HPS at 800 MHz runs Linux-based motion control software stacks, while the 85K LE FPGA fabric accelerates custom PWM generation, encoder decoding, and field-oriented control (FOC) algorithms. Designers implement multi-axis servo loops with deterministic sub-microsecond cycle times that a discrete processor cannot achieve. The 672-UBGA package handles industrial temperature ranges of -40C to +100C required for factory floor equipment.
Recommended
Machine Vision and Image Processing
The 5CSEBA5U23I7SN excels in machine vision applications where the FPGA fabric processes image data from MIPI CSI-2 or parallel camera sensors while the ARM Cortex-A9 runs OpenCV-based analytics and classification. The HPS-to-FPGA AXI bridge delivers bandwidth above 100 Gbps for streaming megapixel images at 60+ fps without frame drops. The 85K LE capacity supports multiple Sobel, Canny, and morphology pipelines running in parallel.
Recommended
Factory Automation and PLC Systems
For programmable logic controllers (PLCs) and factory gateways, the 5CSEBA5U23I7SN integrates the ARM HPS running a real-time Linux or RTOS alongside FPGA logic implementing deterministic industrial protocols (PROFINET, EtherCAT, EtherNet/IP). The single-chip integration reduces PCB size versus discrete processor+FPGA designs while improving timing accuracy. Industrial temperature grade and long-term Intel supply make the part viable for 10-15 year automation product lifecycles.
Recommended
Medical Imaging and Diagnostic Equipment
The 5CSEBA5U23I7SN suits medical imaging applications such as ultrasound beamforming, endoscopy processing, and patient monitoring. The FPGA fabric handles high-speed ADC data acquisition and signal conditioning while the HPS runs the user interface, network stack, and image reconstruction. Its industrial temperature range and low-power process support portable battery-operated medical devices. Regulatory teams benefit from a single-chip solution simplifying IEC 62304 documentation.
Recommended
Broadcast Video Processing
The 5CSEBA5U23I7SN is used in broadcast video equipment for SDI signal processing, format conversion, and overlay insertion. The FPGA fabric handles real-time SDI encode/decode at 3G-SDI rates while the ARM HPS manages IP-based workflows, control plane software, and metadata. The 85K LE capacity supports multiple full-HD video pipelines with on-chip memory buffers. Industrial temperature grade supports outside broadcast trucks and head-end installations.
Recommended
Telecom Edge and Protocol Bridging
In telecom edge applications, the 5CSEBA5U23I7SN bridges legacy TDM protocols to IP/Ethernet networks with hardware-accelerated packet processing. The ARM Cortex-A9 HPS runs routing stacks and management software while the FPGA fabric implements custom SerDes glue logic, timing recovery, and hardware offload. Low-power 28nm process keeps the design within blade-server thermal envelopes. Long-term Intel product lifecycle support suits carrier-grade equipment requiring 7-10 year availability.
Recommended
Automotive Driver Assistance Systems
Although not AEC-Q100 qualified, the 5CSEBA5U23I7SN supports pre-production and aftermarket ADAS prototyping where its ARM HPS runs perception algorithms and the FPGA fabric interfaces with multiple camera and radar sensors. Engineers use the SoC to fuse sensor data, perform object detection, and drive display overlays in development vehicles. The 85K LE and 800 MHz HPS provide headroom for deep-learning inference accelerators implemented in fabric.
Recommended
Recommended Products Summary
Engineering reference data for 5CSEBA5U23I7SN — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 5CSEBA4U23I7SN | 5CSEBA2U23I7SN |
|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 672-UBGA (23x23 mm) | 672-UBGA (23x23 mm) - same | 672-UBGA (23x23 mm) - same |
| Logic Elements | 85,000 | 40,000 | 25,000 |
| HPS Processor | Single ARM Cortex-A9 @ 800 MHz | Single ARM Cortex-A9 @ 800 MHz | Single ARM Cortex-A9 @ 800 MHz |
| Core Voltage | 1.1 V | 1.1 V | 1.1 V |
| Operating Temperature | -40C to +100C (Industrial) | -40C to +100C (Industrial) | -40C to +100C (Industrial) |
| Family | Cyclone V SE SoC | Cyclone V SE SoC | Cyclone V SE SoC |
| Transceivers | None (SE family) | None | None |
| Lifecycle Status | Active | Active | Active |
Key Differentiators
- Highest logic density in the single-core Cyclone V SE family (vs 5CSEBA4U23I7SN)
- Lower price point versus dual-core SoC variants (vs 5CSEBA5U23C8SN)
- Industrial temperature support in standard 672-UBGA footprint (vs 5CSEBA5U19I7SN)
Design Notes
Estimated: The 672-UBGA package at 0.8 mm pitch demands at least 8 PCB layers with microvia / via-in-pad fabrication. Allocate 4 layers for ground, 2 for the 1.1 V core supply, and 2 for signal routing. After reflow, perform X-ray inspection of all 672 balls because optical inspection cannot verify hidden solder joints. Designers must follow Intel's Cyclone V device pin connection guidelines for unused pins and pin-keeper options to avoid floating-input leakage.
Estimated: At full logic utilization (85% LE, 100% DSP) and 800 MHz HPS load, the 5CSEBA5U23I7SN can dissipate 3-5 W depending on toggle rate. The UBGA-672 package has typical theta-JA around 12 C/W with adequate thermal vias, yielding a 36-60 C rise above ambient. For industrial 100C operation, restrict ambient to 40-50 C or implement thermal vias under the central ball grid and a small heatsink. Use Quartus PowerPlay early in the design for accurate thermal budgeting.
Critical: Do not confuse the 5CSEBA5U23I7SN (industrial grade) with 5CSEBA5U23C8SN (commercial grade). The temperature grade and ordering code suffix 'I7' vs 'C8' must match your application's environmental requirements. Additionally, the 'U23' package designator indicates 672-UBGA (23x23) and is not interchangeable with 'U19' (484-UBGA, 19x19) without PCB redesign. Always verify the full MPN before sourcing to avoid costly requalification.
Compliance Information
RoHS and REACH compliant per distributor product pages. Not AEC-Q100 qualified; this part is industrial-grade (-40C to +100C), not automotive-grade. For automotive applications, source AEC-Q100 qualified alternatives or perform additional qualification testing.