A3PE3000-1FGG324 - 3M-Gate Flash FPGA, 221 I/O | Microchip
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Drop-in alternatives for A3PE3000-1FGG324 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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A3PE3000-FGG324
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View Datasheet →A3PE3000-1FGG324 Maximum Ratings & Electrical Characteristics
| Family | ProASIC3E (Flash FPGA) |
| System Gates | 3,000,000 |
| Logic Cells | 75,264 |
| User I/Os | 221 |
| Embedded SRAM | 504 kbits true dual-port |
| Core Supply Voltage | 1.5 V |
| Process Technology | 130-nm, 7-layer metal (6 copper) flash-based CMOS |
| Maximum System Frequency | 272 MHz (family) |
| Speed Grade | -1 |
| Package | 324-ball FBGA (FGG324), 1.00 mm pitch |
| Mounting Type | Surface Mount |
| Configuration | Nonvolatile flash, Instant On, Level 0 support, single-chip |
| Logic Family | CMOS |
| Operating Temperature | 0 C to +70 C (commercial) |
| Reprogrammability | Yes, retains programmed design when powered off |
| On-Chip User Nonvolatile Memory | Yes (FlashROM) |
| Design Security | Flash-based, inherent bitstream security |
A3PE3000-1FGG324 324-ball fbga (fgg324), 1.00 mm pitch Pin Configuration Guide
Complete pinout information for A3PE3000-1FGG324 (324-ball fbga (fgg324), 1.00 mm pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for A3PE3000-1FGG324.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
A3PE3000-1FGG324 is suitable for 6 applications: Industrial Automation Control, Communications and Networking Line Cards, Secure Aerospace and Defense Systems, Medical Instrumentation, Test and Measurement Equipment, Video and Display Processing.
Industrial Automation Control
The A3PE3000-1FGG324 fits industrial automation controllers that need deterministic, instantly-available logic at power-up. Its 3 million system gates and 75,264 logic cells absorb motor sequencing, safety interlock, and fieldbus protocol logic, while 504 kbits of true dual-port SRAM implement FIFOs between communication MACs and the CPU backplane. Because the flash configuration is nonvolatile, the FPGA is functional within microseconds of 1.5 V core power (Instant On, Level 0), eliminating the boot sequence SRAM FPGAs require - important for machinery that must resume deterministically after power dips. With 221 user I/Os in the 324-FBGA, designers bridge 3.3 V and 2.5 V I/O banks to PLC backplanes without external glue logic. Place decoupling per bank and verify timing at the -1 grade in Libero SoC; industrial vibration tolerance favors the solder-ball FBGA over fine-pitch QFP alternatives.
Recommended
Communications and Networking Line Cards
Line-card and transport equipment benefit from the A3PE3000-1FGG324's combination of 272 MHz-class fabric performance and on-chip dual-port SRAM. The 75,264 logic cells implement framing, scramblers, and per-channel statistics, while 504 kbits of true dual-port SRAM buffer traffic between packet processors and PHYs. The flash fabric avoids external configuration PROMs on dense cards where every square centimeter counts, and its inherent bitstream security protects proprietary protocol IP on field-deployed hardware. With 221 user I/Os available on the 1.00 mm-pitch 324-FBGA, the device fans out to multiple SERDES-adjacent parallel buses. Designers should budget core current at the 1.5 V rail based on Libero power estimates and route I/O banks to match 3.3 V/2.5 V signaling domains. For temperature-controlled central offices, the commercial-grade part typically suffices; harsh outdoor cabinets should use the I variant.
Recommended
Secure Aerospace and Defense Systems
Defense and avionics subsystems choose ProASIC3E flash FPGAs for single-chip, instant-on, secure operation. The A3PE3000-1FGG324's nonvolatile configuration means the design is loaded at the factory and never streamed over a visible bus at each power cycle, mitigating bitstream interception compared with SRAM FPGAs; the on-chip FlashROM stores identifiers and key material. Three million system gates implement sensor preprocessing, bus bridging (MIL-STD-1553-style interfaces in RTL), and cryptographic wrappers, while 504 kbits of dual-port SRAM support circular buffers for radar or SIGINT data paths. Programatic screening matters here: select the M-graded variants (for example A3PE3000L-1FGG484M) where military temperature and screening are contractual, using this commercial part for lab development and benign environments. Libero SoC project compatibility lets the same RTL migrate seamlessly across grades and packages within the family.
Recommended
Medical Instrumentation
Diagnostic and laboratory medical instruments use the A3PE3000-1FGG324 to integrate acquisition sequencer, filter front-end control, and interface logic in one instantly-on chip. The 3M-gate fabric and 504 kbits of dual-port SRAM handle ADC sample streaming into ping-pong buffers, while 221 user I/Os connect sensor arrays, display drivers, and USB/Ethernet bridge ASICs. Nonvolatile flash configuration eliminates the customer-visible boot delay and the reliability concern of an external configuration flash that could fail in fielded clinical devices; the single-chip solution also simplifies IEC 60601 documentation of the digital section. Designs in patient-adjacent equipment should favor the industrial-temperature A3PE3000-1FGG324I where sterilization or uncontrolled ambient temperatures occur, keeping the same PCB footprint. Use Libero power analysis to size the 1.5 V core regulator for quiet analog-rail coexistence, and segregate noisy I/O banks from sensitive front-end pins.
Recommended
Test and Measurement Equipment
Bench and modular instruments (logic analyzers, protocol testers, arbitrary waveform front ends) exploit the A3PE3000-1FGG324's instant-on flash fabric so the instrument is measurement-ready the moment power is applied - no configuration download delay after the trigger is armed. The 75,264 logic cells implement pattern generators, edge detectors, and time-stamping counters, and 504 kbits of true dual-port SRAM realize deep capture FIFOs with independent read/write ports. With 221 user I/Os on the 1.00 mm FBGA, one device drives probe pod headers, calibration relays, and the host interface concurrently. The -1 speed grade supports the family's 272 MHz-class fabric timing for counter and serializer blocks; where setup margins are tight, the drop-in A3PE3000-2FGG324 provides faster timing without PCB change. Maintain solid ground-ball coverage under the package and simulate simultaneous-switching noise on the probe-facing banks.
Recommended
Video and Display Processing
Professional video switchers, camera interfaces, and display controllers use the A3PE3000-1FGG324 for pixel-path glue logic, crosspoint control, and timing generation. The 3-million-gate fabric implements SD/HD parallel video formatting, frame-sync logic, and blanking insertion, while 504 kbits of dual-port SRAM support line-store buffering between asynchronous video domains. The 221 user I/Os accommodate multiple 3.3 V parallel video buses plus control interfaces, and the nonvolatile flash configuration keeps displays live immediately at power-up - an advantage over SRAM FPGAs that show a dark interval during configuration. Because video is timing-critical, verify pixel-clock paths at the -1 grade in Libero, or drop in the pin-compatible A3PE3000-2FGG324 for additional margin. Plan bank assignments so high-toggle video I/Os share ground returns, and use the FBGA's distributed power balls to minimize rail collapse during 272 MHz-class fabric switching.
Recommended
Recommended Products Summary
Engineering reference data for A3PE3000-1FGG324 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | A3PE3000-FGG324 | A3PE3000-1FGG324I | A3PE3000-2FGG324I | A3PE3000L-1FGG324 |
|---|---|---|---|---|---|
| Package | 324-ball FBGA (FGG324), 1.00 mm pitch | 324-ball FBGA - same | 324-ball FBGA - same | 324-ball FBGA - same | 324-ball FBGA - same |
| Brand | Microchip Technology (Microsemi/Actel) | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 3,000,000 | 3,000,000 | 3,000,000 | 3,000,000 | 3,000,000 |
| User I/Os | 221 | 221 | 221 | 221 | 221 |
| Embedded SRAM | 504 kbits | 504 kbits | 504 kbits | 504 kbits | 504 kbits |
| Speed Grade | -1 | Standard (faster than -1) | -1 | -2 (faster) | -1 |
| Temperature Range | Commercial, 0 C to +70 C | Commercial | Industrial | Industrial | Commercial |
| Power Profile | Standard core power | Standard | Standard | Standard | Low-power (L variant) |
| Core Supply | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
Key Differentiators
- Nonvolatile flash configuration - no external PROM required (vs SRAM-based FPGAs (cross-brand))
- Lower power at identical logic resources (vs A3PE3000-1FGG324I (standard vs L fabric))
- Faster timing without PCB change (vs A3PE3000-2FGG324I)
- Trade-off: commercial temperature limits (vs A3PE3000-1FGG324I)
Design Notes
Size the 1.5 V core regulator from a Libero SoC SmartPower estimate, not from the family maximum: core current scales with toggle rate and clock tree usage. Power the 1.5 V rail before or with the I/O VCCI rails and confirm I/O bank voltages (3.3 V / 2.5 V per bank) sum within the regulator budget. Because the fabric is flash-based, there is no configuration inrush surge like SRAM FPGAs - steady-state current dominates, simplifying hot-swap design on backplanes.
The 1.00 mm-pitch 324-ball FBGA is typically routed on at least 6 layers with via-in-pad or dog-bone escapes. Distribute decoupling capacitors (a mix of bulk 10 uF and high-frequency 0.1 uF/0.01 uF) across the underside of the package, one pair per power ball cluster, connected with short, wide traces to the power plane. Follow the ProASIC3E datasheet (DS0098) layout guidelines and reference the Microchip bonding/layout application notes for escape-rout patterns on 1.00 mm BGA fan-out.
Do not mix up speed-grade and temperature suffixes when ordering: A3PE3000-1FGG324 (commercial, -1), A3PE3000-1FGG324I (industrial, -1), and A3PE3000-2FGG324I (industrial, -2) are distinct orderable parts. Designing timing to the -1 grade then shipping an industrial I part is fine, but substituting a slower grade after layout will fail timing. Also remember this commercial part is rated 0 C to +70 C only - do not deploy it unqualified into industrial-temperature enclosures.
Compliance Information
Compliance status was not explicitly stated in the retrieved web data. Modern Microchip ProASIC3E production is generally RoHS-compliant, but confirm on the Microchip product page environmental datasheet before release.
