EP1S25F1020I6N - Stratix 25,660-Cell FPGA 1020-BGA | Intel / Altera
MPN: EP1S25F1020I6N ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $1713.38 | $1,713.38 |
| 10 | $1542.04 | $15,420.40 |
| 100 | $1370.7 | $137,070.00 |
| 500 | $1199.36 | $599,680.00 |
| 1,000 | $1028.03 | $1,028,030.00 |
Drop-in alternatives for EP1S25F1020I6N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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EP1S25F1020I6
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View Datasheet →EP1S25F1020C7N
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EP1S25F1020C6N
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View Datasheet →EP1S25F1020C6
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View Datasheet →EP1S25F1020C5N
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View Datasheet →EP1S25F1020I6N Maximum Ratings & Electrical Characteristics
| Family | Stratix |
| Logic Cells | 25,660 |
| Logic Array Blocks (LABs) | 2,566 |
| Embedded Memory | 1,944,576 bits |
| User I/Os | 706 |
| Maximum User I/O Pins | 706 |
| Core Voltage | 1.5 V |
| Technology Node | 130 nm CMOS |
| Package | 1020-ball FC-FBGA (33 × 33 mm, 1 mm pitch) |
| Pin Count | 1020 |
| Operating Temperature | 0 °C to +85 °C (industrial, I6) |
| Mounting Type | Surface Mount (BGA) |
| Device Family | Stratix FPGA |
| Logic Family | CMOS |
| Lead-Free / RoHS | RoHS compliant per Altera / Intel product page |
EP1S25F1020I6N 1020-ball fc-fbga (33 × 33 mm, 1 mm pitch) Pin Configuration Guide
Complete pinout information for EP1S25F1020I6N (1020-ball fc-fbga (33 × 33 mm, 1 mm pitch) package) with 1020 pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1S25F1020I6N.
Refer to the datasheet for full pin configuration.
Estimated pin count: 1020 pins (digital package)
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1S25F1020I6N is suitable for 6 applications: Wireline Communications Line Cards, Video Broadcast and Image Processing, High-Performance ASIC Prototyping, Test and Measurement Instrumentation, Military / Aerospace Signal Processing, Industrial Control and High-Speed Industrial Networking.
Wireline Communications Line Cards
The EP1S25F1020I6N's 25,660 logic cells, 1.94 Mbit of embedded TriMatrix memory, and 706 user I/Os make it well suited to early-2000s wireline line-card designs such as SONET/SDH framers, multi-gigabit Ethernet MACs, and ATM/PoS switching fabrics. The 1020-ball FC-FBGA exposes the wide parallel data buses and multiple high-speed clock domains these systems require, while the Stratix DSP blocks accelerate packet-header parsing and forward-error-correction datapaths. Industrial (I6) temperature screening ensures operation in central-office environments where ambient temperatures regularly exceed 40 °C. Compared with a CPLD, the EP1S25 provides the density needed for multi-channel framer designs; compared with an ASIC, it allows last-minute protocol revisions across SONET, Ethernet, and OTN.
Recommended
Video Broadcast and Image Processing
Broadcast video designs in the Stratix era required hundreds of thousands of logic cells to handle uncompressed SDI / HD-SDI / 3G-SDI streams at 270 Mb/s, 1.485 Gb/s, and 2.97 Gb/s data rates. The EP1S25F1020I6N integrates 1.94 Mbit of on-chip memory for line buffering, plus DSP blocks that accelerate chroma-keying, color-space conversion (RGB ↔ YCbCr), and deinterlacing pipelines. The 706 user I/Os comfortably host multiple 10-bit / 20-bit parallel video buses alongside the LVDS / LVPECL serializers used by SDI. The 130 nm CMOS node delivers deterministic timing across the wide bus widths that broadcast systems require, and the FC-FBGA-1020 footprint supports the controlled-impedance routing essential to multi-gigabit SDI links.
Recommended
High-Performance ASIC Prototyping
FPGA-based ASIC prototyping relies on the highest-density devices available, and the EP1S25F1020I6N with 25,660 logic cells was a workhorse platform for prototyping ASICs of roughly 100k–200k gate-equivalents in the early-to-mid 2000s. Its 1.94 Mbit of TriMatrix memory accurately models the SRAM blocks in the target ASIC, and 706 user I/Os expose enough board-level pins to map complex SoC peripherals. Multiple EP1S25F1020I6N devices can be tiled on a multi-FPGA prototyping board using LVDS-based chip-to-chip links. The industrial temperature grade (-6 / I6) and the well-characterized Stratix timing models in Quartus make this part particularly attractive for replicating worst-case industrial ASIC behavior.
Recommended
Test and Measurement Instrumentation
Test and measurement equipment of the Stratix era — digital storage oscilloscopes, logic analyzers, protocol analyzers, and arbitrary waveform generators — depends on wide acquisition memory, deterministic sampling, and multi-channel parallel DSP. The EP1S25F1020I6N's 1.94 Mbit of embedded memory can buffer acquisition windows at full sample rate, and its DSP blocks run FIR / FFT / DFT cores that compute frequency-domain and time-domain analysis in real time. The 706 user I/Os accept the wide parallel LVDS buses from front-end ADCs and connect to the high-throughput DDR memory controller pins at the back end. The industrial temperature grade (0 to 85 °C) suits laboratory and bench environments, while the FC-FBGA-1020 footprint supports the controlled-impedance routing required at the gigabit sample rates of that generation.
Recommended
Military / Aerospace Signal Processing
Defense and aerospace programs in the Stratix era used the EP1S25F1020I6N for radar signal processing, electronic-countermeasure (ECM) waveform generation, and software-defined radio (SDR) baseband. The industrial temperature grade and the deterministic 130 nm CMOS timing closure made the part attractive for line-replaceable modules (LRMs) and ruggedized subsystems. The 706 user I/Os simultaneously drive LVDS data converters (ADCs / DACs) and high-speed optical links, while the embedded TriMatrix memory holds radar-range and Doppler-history buffers. Although a Mil/Aero temperature screening (the EP1S25F1020I7N family) is required for full military qualification, the EP1S25F1020I6N is widely used in defense subsystems that only need industrial screening.
Recommended
Industrial Control and High-Speed Industrial Networking
High-end industrial-control systems — programmable logic controllers (PLCs), motion controllers, and high-speed industrial networking gateways — use FPGAs to bridge multiple real-time Ethernet protocols (EtherCAT, PROFINET, EtherNet/IP) and to handle parallel deterministic I/O. The EP1S25F1020I6N's 25,660 logic cells and 706 user I/Os let one device terminate multiple industrial Ethernet ports while still servicing digital I/O subsystems, encoder counters, and PWM channels for motor control. Industrial temperature screening (0 to 85 °C) covers factory-floor conditions. The 1.5 V core and well-documented Stratix power-supply design simplify the multi-rail power architecture these systems require.
Recommended
Recommended Products Summary
Engineering reference data for EP1S25F1020I6N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1S25F1020I6 | EP1S25F1020C7N | EP1S25F1020C6N | EP1S25F1020C6 | EP1S25F1020C5N | EP1S25B672C7N |
|---|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | FC-FBGA-1020 (33×33 mm, 1 mm pitch) | FC-FBGA-1020 (same) | FC-FBGA-1020 (same) | FC-FBGA-1020 (same) | FC-FBGA-1020 (same) | FC-FBGA-1020 (same) | BGA-672 (different) |
| Logic Cells | 25,660 | 25,660 (same die) | 25,660 | 25,660 | 25,660 | 25,660 | 25,660 |
| User I/Os | 706 | 706 | 706 | 706 | 706 | 706 | 426 (BGA-672) |
| Embedded Memory (bits) | 1,944,576 | 1,944,576 | 1,944,576 | 1,944,576 | 1,944,576 | 1,944,576 | 1,944,576 |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Operating Temperature | 0 to +85 °C (industrial) | 0 to +85 °C (industrial) | 0 to +70 °C (commercial) | 0 to +70 °C (commercial) | 0 to +70 °C (commercial) | 0 to +70 °C (commercial) | 0 to +70 °C (commercial) |
| Speed Grade | -6 (I6) | -6 | -7 (slower) | -6 (same) | -6 (same) | -5 (faster) | -7 (slower) |
| RoHS / Pb-Free | Pb-free (N suffix) | Non-Pb-free | Pb-free (N suffix) | Pb-free (N suffix) | Non-Pb-free | Pb-free (N suffix) | Pb-free (N suffix) |
Key Differentiators
- Original Stratix flagship density with 25,660 logic cells (vs EP1S25B672C7N)
- Industrial (-I6) temperature screening at the -6 speed grade (vs EP1S25F1020C7N)
- Pb-free (N suffix) for RoHS-compliant assembly (vs EP1S25F1020I6)
- Largest package in the EP1S25 family — full I/O availability (vs EP1S25B672C7N)
Design Notes
The EP1S25F1020I6N ships in a 33 × 33 mm FC-FBGA with 1.00 mm pitch, which requires at least 6 PCB layers (signal / ground / power / signal) and via-in-pad or microvia technology for reliable assembly. Estimated: at 1.00 mm pitch with 0.5 mm drilled microvias, the stack-up should use 0.5–1 oz copper outer layers and a high-Tg (≥170 °C) FR-4 substrate. Decoupling: place 0.1 µF X7R capacitors within 3 mm of every VCC / VCCIO / VCCPD ball pair, and add 10 µF bulk capacitors at each power-supply island. Following Altera's Stratix hardware-design checklist is mandatory to meet signal-integrity targets on the 706 I/O channels.
The EP1S25F1020I6N requires a 1.5 V core rail plus multiple VCCIO bank rails (1.5 V, 1.8 V, 2.5 V, 3.3 V depending on the I/O standard) and the VCCA / VCCPD auxiliary supply used for configuration and JTAG. Estimated: at typical utilization (≈60% logic, ≈50% memory, all 706 I/Os at 25 MHz LVCMOS 3.3 V), the device draws approximately 1.5–2.0 A on the 1.5 V core. Power sequencing must follow the Stratix handbook: VCCINT (core) must ramp before or simultaneously with VCCPD; VCCIO can come up independently. Use a supervisor IC (e.g. a TPS3808-style voltage monitor) to hold nCONFIG low until all rails are within spec.
Although an FPGA, the EP1S25F1020I6N can dissipate significant power through its FC-BGA package. Estimated: at 2 W total power dissipation and a typical theta-JA of ≈12 °C/W for the 33 × 33 mm BGA on a 6-layer PCB with thermal vias, junction temperature rises ≈24 °C above ambient — manageable for the industrial 0–85 °C range but with limited margin at the high end. Place a 5 × 5 array of thermal vias (0.3 mm drill, 1.0 mm pitch) under the central BGA ground balls to spread heat into the inner ground plane. For systems that approach the package's rated power, attach a heatsink with thermal interface material to the top of the package.
Common pitfalls with the EP1S25F1020I6N include: (1) confusing the I6 industrial grade with the I7 extended-temperature grade — the I6 is 0–85 °C, not −40 to +100 °C; (2) leaving MSEL[2:0] / nCONFIG / nSTATUS / CONFIG_DONE floating instead of pulling them to the documented logic level for the desired configuration mode (AS / PS / JTAG / Fast Passive Parallel); (3) failing to include the 50 MHz configuration clock and 16-bit data bus for the EPC16 / EPCS configuration device; (4) mixing the FC-BGA with a non-flip-chip-compatible footprint (this is an FC-BGA, not a wire-bond BGA — paste-mask and reflow profile differ). Always re-verify pin assignments against the Quartus pinout file for the exact device variant.
Compliance Information
Per Altera / Intel product page, the EP1S25F1020I6N is RoHS-compliant per the N-suffix ordering code. Not AEC-Q100 qualified — this is a general-purpose industrial FPGA, not an automotive part. Conflict-minerals compliance is assumed per Intel's standard policy; refer to the Intel Conflict Minerals Statement for formal documentation. The part is officially obsolete per GlobalSpec and major distributor listings.
