EP1SGX25DF67216 - Stratix GX FPGA, 25K LE, 672-BGA | Altera
MPN: EP1SGX25DF67216 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $268 | $2,680.00 |
| 100 | $245 | $24,500.00 |
| 500 | $220 | $110,000.00 |
| 1,000 | $198 | $198,000.00 |
Drop-in alternatives for EP1SGX25DF67216 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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View Datasheet →EP1SGX25DF67216 Maximum Ratings & Electrical Characteristics
| Family | Stratix GX |
| Logic Elements | 25,660 |
| Total RAM Bits | 1,944,576 |
| Number of PLLs | 4 |
| Number of Transceiver Channels | 8 (4 in each of 2 banks) |
| Max Transceiver Data Rate | 3.1875 Gbps per channel |
| Min Transceiver Data Rate | 500 Mbps |
| Core Supply Voltage | 1.5 V |
| Auxiliary Supply Voltage | 3.3 V |
| I/O Supply Voltage | 1.5 V / 1.8 V / 2.5 V / 3.3 V (per bank) |
| Package | 672-ball FineLine BGA (DF672) |
| Mounting Type | Surface Mount (BGA) |
| Operating Temperature | Industrial, -40C to +100C (I-suffix family) |
| On-Die Termination | Yes, 100-ohm differential |
| Pre-emphasis / Equalization | Programmable (transmitter pre-emphasis; receiver adaptive equalization) |
| Configuration Schemes | Passive serial, fast passive parallel, JTAG, Altera enhanced configuration |
| RoHS Status | Lead-free / RoHS compliant (per Altera product family documentation) |
EP1SGX25DF67216 672-ball fineline bga (df672) Pin Configuration Guide
Complete pinout information for EP1SGX25DF67216 (672-ball fineline bga (df672) package) with [DATA_NEEDED: user I/O count for DF672 package] pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1SGX25DF67216.
Refer to the datasheet for full pin configuration.
Estimated pin count: [DATA_NEEDED: user I/O count for DF672 package] pins (digital package)
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1SGX25DF67216 is suitable for 6 applications: PCI Express Endpoint Card, Gigabit Ethernet Switch Line Card, 1G/2G Fibre Channel Storage Controller, Serial RapidIO Switch / Endpoint, SD-SDI / HD-SDI Broadcast Video Transport, Defence / Aerospace Signal Processor.
PCI Express Endpoint Card
The EP1SGX25DF67216 fits PCIe 1.1 endpoint designs at x1/x4 lane widths because its hard-IP PCIe block consumes 2.5 Gbps transceivers and 8B/10B encoding without building the PHY/MAC/transaction layer in soft logic. The 25,660 logic elements and 1,944,576 bits of RAM comfortably host DMA engines, BAR mapping, MSI interrupt controllers, and the application layer, while the 8 transceiver channels support up to x8 endpoints for higher-throughput designs. Compared with a Virtex-II Pro + RocketIO solution, the Stratix GX cut BOM cost by integrating the SERDES and CDR on-die, reducing board area and signal-integrity risk.
Recommended
Gigabit Ethernet Switch Line Card
Gigabit Ethernet line cards using 1000BASE-X SFP/SFP+ cages or 1000BASE-T PHY interfaces benefit from the EP1SGX25DF67216 because its transceivers run cleanly at 1.25 Gbps with 8B/10B PCS support, while the FPGA fabric implements GMII/RGMII conversion, MAC filtering, and L2 switching logic. The 672-ball BGA provides sufficient I/O for SGMII/SFP cage control, MDIO management, and switch fabric back-pressure signals, and 1.94 Mbit of RAM is enough for 4 deep packet-inspection queues. Compared with discrete MAC + PHY implementations, this single-chip approach halves board area and BOM cost.
Recommended
1G/2G Fibre Channel Storage Controller
Fibre Channel 1G (1.0625 Gbps) and 2G (2.125 Gbps) speeds sit comfortably inside the EP1SGX25DF67216's 500 Mbps to 3.1875 Gbps transceiver envelope, and the hard-coded 8B/10B encoder plus the on-die CDR eliminate the external FC PHY chip common in early 2000s SAN designs. The 4 PLLs synthesize the per-port reference clocks and the FC-1 framing/primitive signalling without taxing the soft-logic block, while 1,944,576 bits of RAM buffer FC frames for cut-through or store-and-forward modes. Storage OEMs leveraged the part for RAID HBAs, FC-to-SATA bridges, and tape-backup accelerators.
Recommended
Serial RapidIO Switch / Endpoint
Serial RapidIO (SRIO) at 1.25, 2.5, and 3.125 Gbps uses the same 8B/10B PCS layer that the EP1SGX25DF67216 transceivers already implement, allowing a designer to focus on the SRIO logical/transport/physical layers in soft logic rather than the serializer. With 8 transceiver channels, the device can implement an SRIO 4x port switch fabric or a 1x/4x endpoint with margin for DSP preprocessing, message-passing FIFOs, and DMA. Industrial SRIO uses include base-station baseband cards, DSP cluster aggregation, and high-speed backplane interconnects in defence systems.
Recommended
SD-SDI / HD-SDI Broadcast Video Transport
SD-SDI (270 Mbps) and HD-SDI (1.485 Gbps / 1.485/1.001 Gbps) over coax are well within the EP1SGX25DF67216's 500 Mbps to 3.1875 Gbps data-rate window, and the on-die SERDES eliminates external SDI cable equalizers/buffers in some designs. The FPGA fabric implements scrambling (NRZI to NRZ), line-number/crc insertion, embedded audio demux, and ANC data extraction, while 1.94 Mbit of RAM buffers multi-line video frames for genlock and frame-sync functions. Broadcast OEMs used the Stratix GX family for cross-converters, up/down/cross-format scalers, and routing switchers where the integration of transceivers with a large programmable fabric shortened time to market.
Recommended
Defence / Aerospace Signal Processor
Defence and aerospace signal-processing back-ends running at 2.5 Gbps such as radar digitizers, electronic-warfare receivers, and secure-radio baseband use the EP1SGX25DF67216 because the transceivers interface directly to high-speed ADCs/DACs and FPGA mezzanine cards (FMC/VITA 57), while 25,660 logic elements implement FFT, channelization, and digital down-conversion. The 672-ball BGA with 1.0-mm pitch supports ruggedized underfill and lidless assemblies required for MIL-STD-810 thermal and vibration profiles. Long-term support from Rochester Electronics makes the part viable for defence programs that need 10+ year lifecycle continuity.
Recommended
Recommended Products Summary
Engineering reference data for EP1SGX25DF67216 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1SGX25DF672C7N | EP1SGX25DF672C6 | EP1SGX25CF672C7 | EP1SGX25CF672C6N | EP1SGX10DF672C6N |
|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | 672-ball FineLine BGA (DF672) | 672-ball FineLine BGA (DF672) - same | 672-ball FineLine BGA (DF672) - same | 672-ball FineLine BGA (CF672) - same | 672-ball FineLine BGA (CF672) - same | 672-ball FineLine BGA (DF672) - same |
| Logic Elements | 25,660 | 25,660 | 25,660 | 25,660 | 25,660 | 10,570 (-59% vs target) |
| Transceiver Channels | 8 (4 per bank) | 8 | 8 | 8 | 8 | 4 (-50% vs target) |
| Max Transceiver Data Rate | 3.1875 Gbps | 3.1875 Gbps | 3.1875 Gbps | 3.1875 Gbps | 3.1875 Gbps | 3.1875 Gbps |
| Total RAM Bits | 1,944,576 | 1,944,576 | 1,944,576 | 1,944,576 | 1,944,576 | 920,448 (-53% vs target) |
| PLL Count | 4 | 4 | 4 | 4 | 4 | 4 |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Speed Grade | -6 (industrial) | -7 (commercial) | -6 (commercial) | -7 (commercial) | -6 (commercial) | -6 (commercial) |
| Lifecycle | Obsolete | Obsolete (active stock via Rochester) | Obsolete | Obsolete | Obsolete | Obsolete |
Key Differentiators
- Same-die drop-in replacement for the same 672-ball BGA footprint (vs EP1SGX25DF672C7N)
- Larger logic capacity at same pin count and 8 transceivers (vs EP1SGX10DF672C6N)
- Industrial temperature range variant of the same family (vs EP1SGX25DF672C6)
Design Notes
The EP1SGX25DF67216 requires a 1.5-V VCCINT core rail capable of sourcing 1.2-1.8 A depending on toggle rate, a 3.3-V VCCPD rail at ~150 mA, and per-bank VCCIO supplies. Each active transceiver channel draws approximately 80-120 mA from the VCCR/VCCT analog supplies; with 8 channels engaged, allocate a separate 2.5-V filtered analog LDO. Decoupling recommendation per Stratix GX handbook: 100 nF X7R placed within 100 mils of every supply pin, plus 10 uF bulk per rail. Estimated: with 8 transceivers active at 3.1875 Gbps and 50% logic utilization, total power consumption is approximately 5-7 W; the FineLine BGA thermal pad must be soldered to a 1-oz copper pour of at least 1 square inch to keep junction temperature below 100 C in still air.
Each transceiver differential pair (RXP/RXN, TXP/TXN) must be routed as a 100-ohm differential transmission line on a 4-layer PCB with continuous reference ground beneath the BGA. Use 5-8 mil trace width and 6-8 mil gap on a 0.8-1.0 mil dielectric above the ground plane; 0.5-oz copper reduces skin-effect loss at 3.1875 Gbps. Keep the AC-coupling capacitors (typically 100 nF X7R, 0402) within 200 mils of the receiver pins. Series capacitors on TX and parallel capacitors on RX per Stratix GX pin connection guidelines. The CDR lock range is sensitive to reference-clock jitter; use a crystal oscillator with sub-1 ps RMS phase noise at 156.25 MHz (or 100-650 MHz) to avoid lock failure.
Three common pitfalls when designing with the EP1SGX25DF67216: (1) power-on sequence - VCCINT must ramp before VCCPD, otherwise configuration latches can be latched-up. (2) Configuration mode - the MSEL pins select Active Serial, Passive Serial, Fast Passive Parallel, or JTAG; pull-up/pull-down resistors on MSEL[0..3] are mandatory even in JTAG-only designs. (3) JTAG chain - if the EP1SGX25DF67216 shares a JTAG chain with other devices, the Stratix GX requires the most recent Quartus II version to recognize the silicon ID; older versions of Quartus below 7.2 will fail to enumerate the part. Estimated: configuration flash memory should be a 16-Mbit or larger EPCS16/64 device, programmed via Quartus II Programmer or JTAG indirect mode.
The 672-ball FineLine BGA has a junction-to-ambient thermal resistance (theta_JA) of approximately 12-15 C/W on a 4-layer JEDEC test board with the center thermal pad soldered. At 5 W total power, this yields a 60-75 C junction-temperature rise above ambient, which is acceptable for industrial applications (max junction 100 C). For extended-temperature (100 C ambient) or ruggedized applications, use 1-oz copper pours on all four PCB layers stitched with 0.3-mm thermal vias in the BGA center pad. Reduce power by gating unused transceivers (placing the channel in PWDN mode via the Quartus transceiver toolkit) and minimizing logic utilization with clock gating.
Compliance Information
Stratix GX family is RoHS compliant and lead-free per Altera product documentation. Not AEC-Q100 qualified (industrial temperature grade, but not automotive qualified). The N suffix on EP1SGX25DF672C7N indicates lead-free / Pb-free finish.
