EP1SGX40GF1020C6B - 41k LE Stratix GX FPGA | Altera | 1020-FBGA
MPN: EP1SGX40GF1020C6B ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $1850 | $1,850.00 |
| 10 | $1750 | $17,500.00 |
| 25 | $1690 | $42,250.00 |
| 50 | $1640 | $82,000.00 |
| 100 | $1590 | $159,000.00 |
Drop-in alternatives for EP1SGX40GF1020C6B — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP1SGX40GF1020C6
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View Datasheet →EP1SGX40G
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View Datasheet →EP1SGX40DF1020C6BN
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View Datasheet →EP1SGX40FF1020C6
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View Datasheet →EP1SGX25FF1020C6
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View Datasheet →EP1SGX40GF1020C6B Maximum Ratings & Electrical Characteristics
| Series | Stratix GX |
| Family | Stratix GX (1st generation) |
| Logic Elements (LE) | ~41,250 |
| Embedded Memory | 3.4 Mbits (TriMatrix) |
| DSP Blocks | 14 (18x18 multipliers) |
| Maximum User I/O | 624 |
| High-Speed Transceivers | 20 channels, up to 3.125 Gbps |
| Core Voltage | 1.425 V to 1.575 V (1.5 V nominal) |
| Speed Grade | C6 (commercial, -6) |
| Temperature Grade | B (industrial, -40C to +85C) |
| Package | 1020-BBGA, FCBGA (Flip-Chip) |
| Package Body | 33 x 33 mm |
| Configuration | SRAM, JTAG/PS/PPS/PPA |
| Process Technology | 0.13 um CMOS |
| Mounting Type | Surface Mount (BGA) |
EP1SGX40GF1020C6B 33 x 33 mm Pin Configuration Guide
Complete pinout information for EP1SGX40GF1020C6B (33 x 33 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1SGX40GF1020C6B.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1SGX40GF1020C6B is suitable for 6 applications: Serial Backplane Line Card (RapidIO / PCI Express), 10-Gigabit Ethernet Aggregation Switch, Wireless Base-Station Channel Card, High-Performance ASIC Prototyping, Military Signal Processing (Industrial Temp Variant), Test & Measurement Instrumentation.
Serial Backplane Line Card (RapidIO / PCI Express)
The EP1SGX40GF1020C6B's 20 embedded transceivers at up to 3.125 Gbps per channel and 624 user I/O pins make it ideal for serial-backplane line cards in telecom switches and ATCA/cPCI platforms. According to the manufacturer datasheet, the device supports PCI Express x1/x4 endpoint plus root-port configurations, RapidIO physical layer, and custom serial protocols with on-chip 8b/10b encoding. The 1.5 V core and 3.3 V/2.5 V auxiliary rails coexist with standard line-card power trees, and the 33x33 mm 1020-FBGA package drops into typical 6U line-card PCB footprints. Designers gain roughly 14 GMACS DSP throughput and 3.4 Mbits TriMatrix memory for on-board packet buffering, CRC, and forwarding logic without external SRAM.
Recommended
10-Gigabit Ethernet Aggregation Switch
For 10-Gigabit Ethernet aggregation switches and metro-edge routers, the EP1SGX40GF1020C6B provides enough transceiver channels and logic density to implement XAUI-to-XGMII bridging, MAC aggregation, and basic L2/L3 forwarding. The 20 transceivers can bond four 3.125 Gbps lanes per 10G port via XAUI, and the 41,250 logic elements fit multi-port 10G MACs with shallow buffer FIFOs in the 3.4 Mbit TriMatrix memory. Industrial-grade temperature range (-40C to +85C) supports outdoor and uncontrolled-environment deployments. The Quartus II design flow supplies IP cores for 10G MAC, XAUI PHY, and I2C management interfaces, shortening development time versus a discrete ASIC approach.
Recommended
Wireless Base-Station Channel Card
In W-CDMA, WiMAX, and LTE base-station channel cards, the EP1SGX40GF1020C6B delivers the DSP horsepower needed for digital up/down-conversion, crest-factor reduction (CFR), and digital pre-distortion (DPD). The 14 dedicated DSP blocks with 18x18 multipliers and 36-bit accumulators yield roughly 14 GMACS, matching mid-tier DPD engine requirements for multi-carrier power amplifiers. The 624 user I/O fan out to DACs/ADCs, antenna switches, and CPRI/OBSAI links to the baseband card. Industrial temperature range and high I/O count make the device a strong fit for compact, multi-sector base stations deployed in outdoor cabinets.
Recommended
High-Performance ASIC Prototyping
ASIC prototyping is a classic use case for the EP1SGX40GF1020C6B because its 41,250 logic elements, 3.4 Mbit TriMatrix memory, and 624 user I/O pins accommodate mid-complexity ASIC RTL with margin for additional verification logic. Designers partition the ASIC across one or two SGX40 devices, run at-speed verification in real hardware, and reuse the prototype as a software-development vehicle once ASIC silicon returns from the foundry. Per the manufacturer datasheet, Quartus II supports incremental compile and LogicLock regions to stabilise prototype timing closure across RTL revisions.
Recommended
Military Signal Processing (Industrial Temp Variant)
While the EP1SGX40GF1020C6B is only industrial-temperature rated, it still fits commercial-military / ground-mobile signal-processing platforms where extreme cold-soak or extended temperature is not required. Radar preprocessing, image preprocessing, electronic-warfare receivers, and SIGINT subsystems benefit from the 20 transceivers for IF sampling and 14 DSP blocks for FFT/chirp generation. Design teams should consider the EP1SGX40FF1020I7 industrial-variant or MIL-PRF-38535-screened alternatives when true flight-grade hardware is mandated. For ruggedised ground systems the B-suffix device suffices.
Recommended
Test & Measurement Instrumentation
The EP1SGX40GF1020C6B can be used in high-end test-and-measurement instruments - protocol analysers, logic-analyzer back-ends, and arbitrary waveform generators - where 624 user I/O and 20 transceivers provide flexible I/O at sample rates up to several hundred MHz LVDS. Per the Stratix GX datasheet, the LVDS I/O capability delivers multi-channel TDM data acquisition with deterministic latency. Industrial temperature and 1020-FBGA 33x33 mm footprint allow the device to share the same PCB layout across instrument families, reducing non-recurring engineering cost across a product line.
Recommended
Recommended Products Summary
Engineering reference data for EP1SGX40GF1020C6B — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1SGX40GF1020C6 | EP1SGX40G | EP1SGX40DF1020C6BN | EP1SGX40FF1020C6 | EP1SGX25FF1020C6 |
|---|---|---|---|---|---|---|
| Package | 1020-FBGA (33x33 mm) | 1020-FBGA (33x33 mm) | 1020-FBGA (33x33 mm) | 1020-FBGA (33x33 mm) | 1020-FBGA (33x33 mm) | 1020-FBGA (33x33 mm) |
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Logic Elements | ~41,250 | ~41,250 | ~41,250 | ~41,250 | ~41,250 | ~25,660 |
| DSP Blocks | 14 | 14 | 14 | 14 | 14 | 10 |
| Embedded Memory (Mbits) | 3.4 | 3.4 | 3.4 | 3.4 | 3.4 | 2.0 |
| Maximum Transceiver Rate (Gbps) | 3.125 | 3.125 | 3.125 | 3.125 | 3.125 | 3.125 |
| User I/O (max) | 624 | 624 | 624 | 624 | 624 | [DATA_NEEDED] |
| Speed Grade | C6 | C6 | C6 | C6 | C6 | C6 |
Key Differentiators
- Highest-density 1st-gen Stratix GX with 20 transceivers and 624 I/O in 1020-FBGA (vs EP1SGX25FF1020C6)
- Drop-in compatible with the broader 1020-FBGA Stratix GX family (vs EP1SGX40DF1020C6BN)
- Industrial-temperature B-suffix variant supported by the 33x33 mm BGA (vs EP1S40F1020C5 (older Stratix without GX transceivers))
Design Notes
Estimated: At 3.125 Gbps with all 20 transceivers active and the 41,250 LE fabric running at 50% utilisation, the EP1SGX40GF1020C6B core 1.5 V rail draws roughly 2.5 A. Add a low-ESR decoupling network of 100 uF bulk + 10 uF + 0.1 uF capacitors on each VCCINT/VCCIO bank, and isolate the analog PLLs (VCC_PLL) with a ferrite bead and additional 0.1 uF + 10 uF decoupling per Stratix GX pin connection guidelines.
Estimated: With theta_JA of approximately 12 C/W for a 1020-FBGA in still air and the ~4 W worst-case power dissipation at full transceiver utilisation, the junction rises about 48 C above ambient. Provide thermal vias under the central ball grid and at least 4 layers of solid copper ground pour beneath the package. For chassis with restricted airflow, attach a small heatsink with thermal interface material to the top of the BGA.
Use a 1.0 mm pitch BGA fanout with microvia-in-pad or dog-bone escape. Maintain 100 ohm differential impedance on transceiver lanes with length matching within 5 mils per pair. Per Stratix GX layout guidelines, isolate transceiver balls from digital I/O with a continuous GND ring and route reference planes unbroken beneath all serial lanes to control return-path discontinuities.
Common pitfalls: (1) forgetting that configuration requires a separate EPC16/EPC64 configuration memory or JTAG programmer on the board; (2) ignoring the 1.5 V core supply sequencing requirement - VCCINT must come up before or simultaneously with VCCPD and VCCIO; (3) using wrong bitstream compression option, which corrupts configuration on obsolete Quartus versions - always set 'Auto' compression in the programmer options; (4) mismatching LVDS reference voltage biasing, which prevents link training at 3.125 Gbps.
Compliance Information
RoHS/REACH declarations not present in provided web data; verify with Rochester Electronics or Altera/Intel documentation archive. AEC-Q100 is not applicable to FPGAs. Lead-free and halogen-free status unknown without datasheet revision letter.
