EPF8820ARC208-C - FLEX 8000 FPGA, 8K Gates, 152 I/O | Altera
MPN: EPF8820ARC208-C ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $38.5 | $38.50 |
| 10 | $32.4 | $324.00 |
| 100 | $26.85 | $2,685.00 |
| 500 | $22.1 | $11,050.00 |
| 1,000 | $18.75 | $18,750.00 |
Drop-in alternatives for EPF8820ARC208-C — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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EPF8820ARC208-2
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View Datasheet →EPF8820ARC208-C Maximum Ratings & Electrical Characteristics
| Family | FLEX 8000 |
| Usable Gates | 8,000 |
| Logic Elements | 672 |
| Maximum User I/Os | 152 |
| Logic Array Blocks (LABs) | 8 to 16 LEs per LAB |
| Supply Voltage (VCCINT) | 4.75 V to 5.25 V |
| I/O Voltage (VCCIO) | 3.3 V or 5.0 V (MultiVolt) |
| Process Technology | 0.42 um CMOS, 5 metal layers |
| Configuration Technology | CMOS SRAM (volatile) |
| Operating Temperature | 0 C to +70 C (commercial) |
| Package | 208-RQFP Exposed Pad (28x28 mm, 0.5 mm pitch) |
| Mounting Type | Surface Mount |
| In-Circuit Reconfigurability | Yes (ICR) |
| Boundary-Scan Support | Yes (IEEE 1149.1 JTAG) |
| Configuration Devices Supported | EPC1, EPC1213, EPC1064, EPC1441 |
EPF8820ARC208-C 208-rqfp exposed pad (28x28 mm, 0.5 mm pitch) Pin Configuration Guide
Complete pinout information for EPF8820ARC208-C (208-rqfp exposed pad (28x28 mm, 0.5 mm pitch) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EPF8820ARC208-C.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EPF8820ARC208-C is suitable for 6 applications: 5V PCI Bus Interface Logic, Industrial Control Glue Logic, ASIC Prototyping and Pre-Silicon Validation, Telecommunications Line-Card Controllers, Legacy Peripheral Bridging and Protocol Conversion, Test and Measurement Instrumentation Front-Ends.
5V PCI Bus Interface Logic
The EPF8820ARC208-C's 152 user I/Os, MultiVolt 5V/3.3V I/O support, and 8K-gate logic capacity make it well suited to legacy 5V PCI bus interface logic where protocol translation and bus arbitration must be implemented in programmable hardware. The FLEX 8000 architecture provides deterministic FastTrack interconnect timing across all 152 pins, which is essential for meeting the PCI 33 MHz bus cycle requirements without cycle stealing. Place the device between the PCI connector and a downstream controller ASIC or microcontroller; use the JTAG (IEEE 1149.1) port for in-system test access. The 208-RQFP package exposes enough I/Os to drive a full 32-bit PCI bus plus side-band signals, and the SRAM-based configuration lets engineers iterate on bus-state machines without spinning the board.
Recommended
Industrial Control Glue Logic
The EPF8820ARC208-C is widely deployed as programmable glue logic in industrial control platforms, replacing dozens of 74-series TTL parts with a single 8K-gate FLEX 8000 device. With 152 user I/Os and MultiVolt I/O, the part can interface directly to 5V PLC backplanes and 3.3V sensor ASICs without external level shifters, reducing BOM count and PCB area. The commercial temperature grade (0C to +70C) covers most factory-floor enclosures; for harsher environments, choose the -I industrial grade variant. The in-circuit reconfigurability feature lets field engineers update control logic through the JTAG port without removing the board, which is critical for serviceability of installed industrial equipment.
Recommended
ASIC Prototyping and Pre-Silicon Validation
The EPF8820ARC208-C offers 8,000 usable gates in a 152-I/O device, making it a popular vehicle for ASIC prototyping before tape-out. Engineers map RTL blocks into FLEX 8000 logic elements to validate system architecture, firmware, and real-world timing long before the ASIC is fabricated, de-risking the entire design cycle. The FLEX 8000 architecture supports incremental design via in-circuit reconfigurability, allowing prototype revisions to be downloaded through the JTAG port in seconds. The 208-RQFP package also gives plenty of bread-board-friendly I/O for hooking up to legacy prototype target systems. For larger ASIC prototypes, multiple EPF8820ARC208-C devices can be cascaded through the JTAG chain.
Recommended
Telecommunications Line-Card Controllers
Telecommunications line cards in legacy TDM and early-generation VoIP systems often require 100+ I/Os of protocol adaptation, framing, and clock-domain crossing logic - exactly the workload the EPF8820ARC208-C was designed for. The 152 user I/Os accommodate multiple E1/T1 framers, HDB3 line codecs, and a control-plane microcontroller interface in a single device, simplifying board layout. MultiVolt I/O lets the same part interface to 5V legacy transceivers and 3.3V newer DSP chips without glue logic, while the 5V core supply matches the legacy telecom power bus. The commercial temperature grade covers central-office controlled environments; for outdoor enclosures, choose the -I industrial variant.
Recommended
Legacy Peripheral Bridging and Protocol Conversion
The EPF8820ARC208-C bridges legacy peripheral interfaces such as ISA, VME, and PC/104 to modern processors without an expensive ASIC development cycle. The 8K-gate capacity is sufficient for full bus-state machines, FIFOs, and interrupt controllers in a single device, while 152 I/Os handle wide legacy buses and side-band signals. The FLEX 8000 SRAM-based configuration means firmware updates for new peripheral protocols can be applied in the field through the JTAG port, extending the usable life of installed equipment. The 5V MultiVolt I/O directly drives ISA bus pull-ups and PC/104 cards without external buffers, keeping the BOM small.
Recommended
Test and Measurement Instrumentation Front-Ends
Bench-top and ATE (automatic test equipment) front-ends use FPGAs to implement programmable stimulus generation, response capture, and timing-and-control sequencing. The EPF8820ARC208-C's 152 I/Os provide enough pins to drive dozens of test points and DUT-side signals, while the 8K-gate capacity fits a complete pattern generator, expected-response comparator, and IEEE 1149.1 JTAG controller on one chip. MultiVolt I/O allows the same part to interface to 3.3V modern DUTs and 5V legacy instruments on the same board. The SRAM-based configuration means test sequences can be swapped in seconds through the JTAG port, supporting fast test-program development cycles.
Recommended
Recommended Products Summary
Engineering reference data for EPF8820ARC208-C — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPF8820ARC208-2 | EPF8820ARC208-3 | EPF8820ARC208-4 | EPF8820AQC208-4 |
|---|---|---|---|---|---|
| Package | 208-RQFP Exposed Pad (28x28 mm) | 208-RQFP Exposed Pad - same | 208-RQFP Exposed Pad - same | 208-RQFP Exposed Pad - same | 208-PQFP (28x28 mm) - same footprint |
| Brand | Altera | Altera | Altera | Altera | Altera |
| Usable Gates | 8,000 | 8,000 | 8,000 | 8,000 | 8,000 |
| Logic Elements | 672 | 672 | 672 | 672 | 672 |
| Maximum User I/Os | 152 | 152 | 152 | 152 | 152 |
| Supply Voltage | 4.75 V to 5.25 V | 4.75 V to 5.25 V | 4.75 V to 5.25 V | 4.75 V to 5.25 V | 4.75 V to 5.25 V |
| Speed Grade | Commercial grade (-C) | -2 speed grade | -3 speed grade | -4 speed grade | -4 speed grade |
| Temperature Grade | Commercial (0C to +70C) | Commercial | Commercial | Commercial | Commercial |
| Configuration Technology | CMOS SRAM (volatile) | CMOS SRAM (volatile) | CMOS SRAM (volatile) | CMOS SRAM (volatile) | CMOS SRAM (volatile) |
Key Differentiators
- MultiVolt I/O in a single 5V core device (vs Older 5V-only FPGAs (pre-MultiVolt))
- FLEX 8000 FastTrack interconnect provides predictable timing (vs CPLD-style segmented interconnect)
- 152 user I/Os in a single 208-RQFP package (vs Lower-density 144-pin FLEX 8000 variants)
- Pin-compatible speed-grade family for second sourcing (vs EPF8820ARC208-3 (alternative in the same family))
Design Notes
The EPF8820ARC208-C requires two supplies: VCCINT at 4.75V to 5.25V for the core logic, and VCCIO at 3.3V or 5.0V for the I/O banks (MultiVolt). Decouple each VCC pin with a 0.1uF ceramic capacitor placed as close to the package as possible, and add a single 10uF to 47uF bulk tantalum or ceramic capacitor near the device. Estimated: at 50 MHz toggling across 50% of I/Os, ICCINT draws approximately 50 to 150 mA; place a bulk capacitor rated for at least 250 mA ripple to avoid supply droop during simultaneous-switching events. Power sequencing requires VCCINT to come up before or simultaneously with VCCIO; otherwise the I/O pins can drive into the unpowered core and cause latch-up.
FLEX 8000 devices are SRAM-based and lose their configuration when power is removed. Every EPF8820ARC208-C board MUST include a configuration PROM (EPC1, EPC1064, EPC1213, or EPC1441) or a system controller that loads the bit-stream at every power-up. Forgetting the configuration device is the most common reason a 'dead' FLEX 8000 board never wakes up. Also, an external pull-up resistor on nCONFIG (typically 10 kohm to VCCIO) is required to enable user-controlled reconfiguration; without it the device cannot be reconfigured in-circuit via the JTAG port.
The 208-RQFP package has an exposed thermal pad on the underside that must be soldered to a PCB copper pour for reliable thermal performance. Estimated: at typical 5V operation with moderate toggle rates, the EPF8820ARC208-C dissipates 0.5 W to 1.5 W; the exposed pad reduces junction-to-ambient thermal resistance (theta_JA) by roughly 30% compared with a non-pad QFP. For continuous high-toggle applications such as PCI bus bridges, design the PCB copper pour to cover at least 1 square inch connected to the exposed pad through at least 9 thermal vias (0.3 mm drill) to the inner ground plane.
Route the JTAG chain (TCK, TMS, TDI, TDO) as a daisy-chain with no stubs, keeping each device-to-device segment under 50 mm to preserve signal integrity at the TCK frequency. Place a 10 kohm pull-up on TMS and TDI to keep the JTAG TAP controller in a known state during power-up. For high-speed MultiVolt I/O at 5.0V, route 8 to 16 signals per layer with a continuous ground reference plane underneath; for 3.3V operation the same layout works but with relaxed spacing. The configuration clock (DCLK) trace must be kept short and shielded by ground to avoid bit-stream corruption during power-up.
Compliance Information
Compliance status for the EPF8820ARC208-C is not stated in the verified web data; the FLEX 8000 family predates widespread RoHS documentation. The lead-free 'N' suffix variants (e.g. EPF8820ARC208-2N, EPF8820ARC208-3N) are the recommended choice for RoHS-compliant assemblies; verify the specific date code with the distributor.
