EPM3064AT100-10N - MAX 3000A CPLD, 64 Macrocells, TQFP-100 | Intel
MPN: EPM3064AT100-10N ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $8.5 | $8.50 |
| 10 | $7.65 | $76.50 |
| 100 | $6.8 | $680.00 |
| 500 | $6.1 | $3,050.00 |
| 1,000 | $5.45 | $5,450.00 |
Drop-in alternatives for EPM3064AT100-10N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EPM3064ATC100-10N
✅ Drop-In✓ In Stock
$2.43 / Unit
View Datasheet →EPM3064ATI100-10N
✅ Drop-In✓ In Stock
$9.8 / Unit
View Datasheet →EPM3064ATI44-10N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$3.95 / Unit
View Datasheet →EPM3064AT100-10N Maximum Ratings & Electrical Characteristics
| Family | MAX 3000A |
| Device Type | CPLD (Complex Programmable Logic Device) |
| Macrocells | 64 |
| Logic Array Blocks (LABs) | 4 |
| Usable Gates | 1,250 |
| User I/O Pins | 66 |
| Speed Grade | -10 (10 ns pin-to-pin delay) |
| Supply Voltage (VCCINT) | 3.3 V |
| I/O Bank Voltage | 3.3 V |
| 5 V Tolerant Inputs | Yes (via clamping diodes) |
| Configuration Memory | EEPROM (non-volatile) |
| Programming Interface | JTAG (IEEE Std. 1149.1) with pin-locking |
| ISP Compliance | IEEE Std. 1532 |
| Boundary-Scan Test (BST) | IEEE Std. 1149.1 compliant |
| Package | TQFP-100 (T100), 14 mm x 14 mm |
| Operating Temperature (Commercial) | 0C to +70C |
EPM3064AT100-10N tqfp-100 (t100), 14 mm x 14 mm Pin Configuration Guide
Complete pinout information for EPM3064AT100-10N (tqfp-100 (t100), 14 mm x 14 mm package) with 66 pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EPM3064AT100-10N.
Refer to the datasheet for full pin configuration.
Estimated pin count: 66 pins (digital package)
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EPM3064AT100-10N is suitable for 6 applications: Microcontroller I/O Expansion & Glue Logic, Bus Interface Bridging (PCI/ISA to Local Bus), Power-Up Sequencing Controller, Peripheral Multiplexing (UART/SPI/I2C Switch), Legacy System Design Revision / 74-Series Replacement, FPGA Configuration Supervisor.
Microcontroller I/O Expansion & Glue Logic
The EPM3064AT100-10N excels as glue-logic between microcontrollers, ASICs, and peripheral ICs where deterministic 10 ns pin-to-pin delay is critical. Its 64 macrocells and 66 user I/Os handle address decoding, chip-select generation, and interrupt steering for 8/16/32-bit MCU and DSP systems. Non-volatile EEPROM configuration means the design boots instantly at power-up without external configuration memory, simplifying the BOM. The 3.3 V core with 5 V tolerant inputs allows direct interfacing to legacy 5 V peripherals without level shifters. Designers typically pair this CPLD with an STM32, PIC32, or MSP430 host to consolidate 74-series glue into a single re-programmable device.
Recommended
Bus Interface Bridging (PCI/ISA to Local Bus)
The EPM3064AT100-10N's 66 I/Os and 10 ns tPD make it a proven bus-bridging solution for legacy PCI, ISA, and proprietary local-bus architectures. Each macrocell can implement registered or combinatorial logic with selectable clear/preset/clock controls, ideal for address-latch, byte-enable, and wait-state generation. The JTAG interface with pin-locking allows in-system reprogramming during board bring-up without removing the device. Industrial bus-interface cards, backplane controllers, and FPGA configuration supervisors rely on this CPLD to handle protocol translation and timing skew correction in a single 100-pin TQFP footprint.
Recommended
Power-Up Sequencing Controller
Power-up sequencing in multi-rail systems (FPGA + DDR + analog) is a classic CPLD use case for the EPM3064AT100-10N. The non-volatile EEPROM boots to a known state at t = 0, and the 10 ns tPD allows precise timing of enable signals to downstream regulators. Designers implement sequenced PG (power-good) chains with one macrocell per rail, often combining level-shifting between 5 V and 3.3 V domains using the 5 V tolerant inputs. The JTAG pin-lock feature lets engineers re-program sequencing delays in-system without board rework, accelerating power-tree validation in industrial and telecom equipment.
Recommended
Peripheral Multiplexing (UART/SPI/I2C Switch)
Muxing UART, SPI, and I2C signals between multiple peripherals or controllers is well suited to the EPM3064AT100-10N. With 66 I/Os, the device can implement 4:1 or 8:1 mux/demux structures plus hand-shake logic, all within a single 100-pin TQFP. The 10 ns tPD ensures transparent data-path latency for SPI clock rates up to 50 MHz and I2C fast-mode timing. Industrial sensor hubs and modular test equipment use this CPLD to dynamically route communication buses between processors, FPGAs, and external test heads without external analog switches.
Recommended
Legacy System Design Revision / 74-Series Replacement
Replacing multiple 74HC/74AHCT/74FCT logic packages with a single programmable device is the original use case for the EPM3064AT100-10N. Engineers migrating legacy boards can consolidate 5-15 discrete SSI/MSI packages into one CPLD, reducing board area, BOM count, and signal-trace complexity. The non-volatile EEPROM retains the configuration across power cycles, eliminating the need for boot PROMs. JTAG-based design changes (pin-lock feature) mean board revisions become firmware updates rather than re-spins, dramatically shortening time-to-market for industrial control and test-instrument products.
Recommended
FPGA Configuration Supervisor
Supervising an FPGA's configuration PROM, JTAG chain, and multi-FPGA load sequence is a frequent deployment for the EPM3064AT100-10N in prototyping and production hardware. The CPLD arbitrates JTAG access between configuration and debug tools, manages DONE/CONF_DONE hand-shaking, and can implement multi-FPGA select-map or serial configuration fan-out. With 64 macrocells, the device has enough logic to control 2-4 slave FPGAs and handle error-flag aggregation. The 10 ns tPD keeps setup/hold margins comfortable for high-speed configuration interfaces.
Recommended
Recommended Products Summary
Engineering reference data for EPM3064AT100-10N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPM3064ATC100-10N | EPM3064ATI100-10N |
|---|---|---|---|
| Package | TQFP-100 (T100) | TQFP-100 (T100) - same | TQFP-100 (T100) - same |
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Family | MAX 3000A | MAX 3000A | MAX 3000A |
| Macrocells | 64 | 64 | 64 |
| User I/Os | 66 | 66 | 66 |
| Pin-to-Pin Delay | 10 ns | 10 ns | 10 ns |
| Temperature Range | 0C to +70C (commercial) | 0C to +70C (commercial) | -40C to +85C (industrial) |
| Shipping Carrier | Tray | Tray | Tray |
Key Differentiators
- Commercial temperature grade with tray packaging (vs EPM3064ATC100-10N)
- Wider operating temperature range option available (vs EPM3064ATI100-10N)
- Larger TQFP-100 package exposes more user I/Os than smaller 44-pin variants (vs EPM3064ATI44-10N)
Design Notes
The TQFP-100 package has a 0.5 mm pitch and 14 mm x 14 mm body; allow at least 0.5 mm clearance from the package outline for trace routing and 2.0 mm for probe access. Decoupling requires one 0.1 uF ceramic per VCC pin and one bulk 10 uF tantalum near the supply pins. Exposed thermal pad (if present on the variant) must be soldered to a ground pour for mechanical reliability; the MAX 3000A family uses plastic TQFP without an exposed pad, so this note applies only to drop-in MAX II alternatives.
Do not apply 5 V to the I/O outputs of the EPM3064AT100-10N - the I/O bank is 3.3 V. The 5 V tolerance is for INPUTS only (via clamping diodes); sustained 5 V on an output pin will damage the device. For mixed 5 V/3.3 V designs, use a level translator or migrate to the MAX V family which supports true 5 V I/O. Always tie unused I/O pins to ground or defined logic state to minimize power consumption and noise injection.
JTAG chain integrity is critical for in-system programming; keep TCK, TMS, TDI, TDO traces short (< 50 mm) and add a 10 kohm pull-up on TCK and TMS to prevent spurious configuration during power-up. For multi-device JTAG chains, the MAX 3000A device supports pin-locking so each device in the chain maintains its TDI/TDO mapping even when neighbors are removed - plan the chain order accordingly and document pin-locks in the design comments.
Estimated: The EPM3064AT100-10N in TQFP-100 has a typical theta_JA of approximately 50 C/W (no exposed pad). At maximum toggle frequency with all 66 I/Os switching 10 MHz CMOS loads, internal dissipation is roughly 200-300 mW, yielding a junction temperature rise of 10-15 C above ambient. No heatsink is required for typical commercial-temperature designs; ensure at least 100 sq mm of ground plane beneath the device for heat spreading.
Compliance Information
RoHS, REACH, lead-free, and halogen-free status not explicitly confirmed in the verified distributor and datasheet excerpts provided as of 2026-09-12. The part is Not Recommended for New Designs (NRND) by Altera; consult the latest manufacturer product page or certificate of conformance (CoC) for definitive compliance declarations.
