EPM5130WM883B-1 - 128-Macrocell UV PLD, 5V, CQFP-100 | Altera MAX 5000
MPN: EPM5130WM883B-1 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $185 | $185.00 |
| 10 | $168 | $1,680.00 |
| 100 | $148 | $14,800.00 |
| 250 | $138 | $34,500.00 |
| 500 | $128 | $64,000.00 |
Drop-in alternatives for EPM5130WM883B-1 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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EPM5130GM883B
✅ Drop-In✓ In Stock
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View Datasheet →EPM5130GM/883B
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EPM5130WC-1
✅ Drop-In ⚠️ 参数待验证✓ In Stock
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View Datasheet →EPM5128GM883B
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$159.25 / Unit
View Datasheet →EPM5064GM883B
✅ Drop-In ⚠️ 参数待验证📋 Reference alternative (not in catalog)
EPM5130WM883B-1 Maximum Ratings & Electrical Characteristics
| Device Family | MAX 5000 (Classic EPLD) |
| Manufacturer | Altera (now Intel PSG) |
| Logic Type | UV-Erasable Programmable Logic Device (EPLD) |
| Technology | CMOS, EPROM cell |
| Macrocells | 128 |
| Logic Array Blocks (LABs) | 8 |
| Dedicated Inputs | 19 |
| I/O Pins | 48 (bi-directional) |
| Propagation Delay (tPD) | 55 ns |
| Maximum Clock Frequency (fMAX) | 33.3 MHz |
| Supply Voltage (VCC) | 4.5 V to 5.5 V (nominal 5 V) |
| External Clock Inputs | 1 global + shared inputs |
| Interconnect | Programmable Interconnect Array (PIA) |
| Package Type | CQFP-100, ceramic windowed (WM) |
| Military Screening | MIL-STD-883 Class B (883B suffix) |
| Programming Method | UV erase + EPROM programming |
| Mounting Type | Surface Mount (CQFP with J-leads) |
EPM5130WM883B-1 cqfp-100, ceramic windowed (wm) Pin Configuration Guide
Complete pinout information for EPM5130WM883B-1 (cqfp-100, ceramic windowed (wm) package) with 48 (bi-directional) pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EPM5130WM883B-1.
Refer to the datasheet for full pin configuration.
Estimated pin count: 48 (bi-directional) pins (digital package)
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EPM5130WM883B-1 is suitable for 6 applications: Military Avionics Glue Logic, Ruggedised Industrial Controllers, Telecom Line-Card Interface Logic, Instrumentation Front-End State Machines, Legacy System Redesign, Aerospace Test & Diagnostic Equipment.
Military Avionics Glue Logic
The EPM5130WM883B-1's MIL-STD-883 Class B screening, 128 macrocells and 55 ns propagation delay make it well matched to military-avionics glue logic that previously used bipolar PALs or discrete 74LS glue. Its 48 I/O pins comfortably absorb the address-decoder and chip-select logic of a VME/PCI-style backplane interface, while the 19 dedicated inputs simplify bank-to-bank state-machine design. Non-volatile UV-EPROM cells eliminate the configuration-ROM of an SRAM-based CPLD, a critical benefit for cold-start deterministic behaviour in DO-254 platforms. Trade-off: the 55 ns delay limits this device to sub-33 MHz logic, so high-speed serializer blocks need separate fast TTL/CMOS parts.
Recommended
Ruggedised Industrial Controllers
In ruggedised industrial PLCs and process-control line-replacement cards, the EPM5130WM883B-1 functions as a deterministic decoder/state-machine that must survive extended temperature, vibration and supply-noise stress. The CQFP-100 ceramic body delivers the hermeticity and thermal mass needed for MIL-style environmental qualification, and the 4.5-5.5V supply range tolerates the industrial 5V rail after protection filtering. The 128 macrocells comfortably accommodate watchdog timers, encoder-decoder blocks and ladder-logic pre-processors. Trade-off: the 55 ns delay is adequate for PLC scan loops (~10 kHz) but unsuitable for high-speed motion-control feedback loops, where a faster MAX 7000 or MAX II CPLD should be paired alongside.
Recommended
Telecom Line-Card Interface Logic
The EPM5130WM883B-1's 48 bi-directional I/O pins, 19 dedicated inputs and one global clock map cleanly onto legacy telecom line-card glue, where it arbitrates between T1/E1 framers, HDLC controllers and time-slot crossbars. Its deterministic tPD 55 ns path simplifies worst-case timing analysis for sub-33 MHz backplane logic, and the non-volatile UV-EPROM cell removes the boot-loader risk of SRAM CPLDs. Combined with MIL-STD-883B screening, the part is widely used in central-office hardware that must operate continuously for 20+ years. Trade-off: the ceramic CQFP-100 footprint is large; modern designs often port the same logic to a MAX II CPLD in a smaller TQFP package.
Recommended
Instrumentation Front-End State Machines
The EPM5130WM883B-1 provides 128 macrocells of programmable sum-of-products logic that is well matched to instrumentation front-end sequencing - gain ranging, autoranging, multiplexer addressing, and IEEE-488 / RS-232 handshake state machines. With 33.3 MHz fMAX and 55 ns tPD it comfortably services the control plane of an oscilloscope or spectrum analyser while a fast ADC handles the data path. The MIL-STD-883B grade is desirable for test equipment destined for naval or airborne use. Trade-off: the part's 5V supply contrasts with modern 3.3V ADC rails, so level-shifters are typically needed on the digital interfaces.
Recommended
Legacy System Redesign
The EPM5130WM883B-1 is a drop-in for end-of-life bipolar PALs and 20-pin GALs on legacy boards where a 128-macrocell CMOS EPLD is required to retain the original fuse-map functionality. The UV-erase window lets engineering teams recover, re-verify and re-program devices recovered from field returns, accelerating the qualification of re-spared boards. The 883B suffix preserves the original reliability baseline, which is critical for legacy military spares-pool programs. Trade-off: a modern MAX II CPLD requires a re-synthesis of the original MAX+PLUS II .fit files and a PCB redesign for the new package, so the 883B Altera part remains the lowest-risk path for sustainment programs.
Recommended
Aerospace Test & Diagnostic Equipment
Aerospace test and BIT (built-in test) hardware relies on the EPM5130WM883B-1 to consolidate the address decoding, periodic-stimulus sequencing, and fault-isolation logic of multi-channel test rigs. Its 128 macrocells support four independent sequencers per device, while the ceramic CQFP-100 package withstands the thermal-cycling and vibration profiles of airborne test racks. The MIL-STD-883 Class B screening plus 5V tolerance make it a safe replacement for original bipolar PLDs that have become unreliable. Trade-off: lead-time and price for 883B-screened parts are significantly higher than commercial grades, so production runs should be planned with 8-12 week buffer.
Recommended
Recommended Products Summary
Engineering reference data for EPM5130WM883B-1 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPM5130GM883B | EPM5130GM/883B | EPM5130WC-1 | EPM5128GM883B | EPM5064GM883B |
|---|---|---|---|---|---|---|
| Package | CQFP-100 (ceramic windowed) | Ceramic PGA (per datasheet) | Ceramic PGA (per datasheet) | Ceramic windowed CQFP/PGA variant | Ceramic PGA (per datasheet) | Ceramic PGA (per datasheet) |
| Brand | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) |
| Macrocells | 128 | 128 | 128 | 128 | 128 | 64 |
| Propagation Delay (tPD) | 55 ns | 55 ns | 55 ns | 55 ns | 55 ns | 55 ns |
| Maximum Clock Frequency | 33.3 MHz | 33.3 MHz | 33.3 MHz | 33.3 MHz | 33.3 MHz | 33.3 MHz |
| MIL-STD-883B Screening | Yes | Yes | Yes | No (commercial windowed) | Yes | Yes |
| Supply Voltage | 4.5 V to 5.5 V | 4.5 V to 5.5 V | 4.5 V to 5.5 V | 4.5 V to 5.5 V | 4.5 V to 5.5 V | 4.5 V to 5.5 V |
| Programming Method | UV-EPROM | UV-EPROM | UV-EPROM | UV-EPROM | UV-EPROM | UV-EPROM |
Key Differentiators
- MIL-STD-883B screening in a windowed ceramic CQFP-100 (vs EPM5130WC-1)
- 128 macrocells vs 64 macrocells (vs EPM5064GM883B)
- Non-volatile UV-EPROM configuration (vs MAX II CPLD family)
- Same die across WM/GM/WC variants (vs EPM5130GM883B)
Design Notes
Estimated: at VCC = 5.0 V and typical CMOS switching activity on 48 I/O lines at 33 MHz, the EPM5130WM883B-1 draws approximately 150-250 mA dynamic, plus 25-50 mA quiescent. Decouple each VCC pin with a 0.1 µF X7R ceramic placed within 3 mm of the pin, and add a 10 µF tantalum bulk capacitor at the board entry. The 883B screening guarantees operation across the full 4.5-5.5 V range, but brown-out below 4.5 V may corrupt the EPROM state-machine if VCC falls faster than 50 µs; design the supervisory circuit to hold the device in reset until VCC ≥ 4.6 V.
The CQFP-100 ceramic body has a coefficient-of-thermal-expansion mismatch with FR-4, so place the part on a uniform copper-pour and avoid placing large heat sinks over the ceramic window. Use a J-lead foot print with a 0.65 mm pitch and generous pad-to-pad solder mask relief to reduce tombstoning. Route all 1 global clock and 19 dedicated inputs on the inner layers with 50 Ω controlled impedance, and keep PIA-driven signals short to minimise reflection on the 33 MHz edges.
Do not confuse the EPM5130WM883B-1 (windowed CQFP-100) with the plastic-windowed EPM5130WC-1 or the surface-mount CQFP variants - they are not electrically or pin compatible. Cover the UV-transparent window with an opaque label after programming; ambient fluorescent light can erase cells over months. Always verify the programming algorithm against the MAX 5000 datasheet (52-page version on Alldatasheet) before qualifying a third-party programmer, as the VPP pulse profile differs from generic EPROM devices.
Estimated: with θJA ≈ 35 °C/W on a ceramic CQFP-100 in still air, the part can dissipate up to 2.5 W before the junction reaches the MIL-883B screening limit. In practice CMOS EPLD switching losses keep dissipation well below 1 W, but designers should avoid placing the part adjacent to high-power dissipators such as DC-DC converters. For naval or aerospace profiles (-55 °C to +125 °C), the thermal margin narrows; in such cases the EPM5130GM883B ceramic PGA variant offers a slightly better thermal path to a metal-core board.
Compliance Information
MIL-STD-883 Class B screened per 883B suffix. RoHS / REACH status not officially documented because the part predates these directives; lead-bearing ceramic package typically qualifies for the high-reliability military exemption under Directive 2002/95/EC Annex. AEC-Q100 not applicable - this is a logic device, not an automotive analog/mixed-signal IC.