K3KL8L80QM-MUCT - 32Gb LPDDR5X DRAM | Samsung
MPN: K3KL8L80QM-MUCT ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $18.5 | $18.50 |
| 10 | $17.2 | $172.00 |
| 100 | $15.8 | $1,580.00 |
| 500 | $14.6 | $7,300.00 |
| 1,000 | $13.4 | $13,400.00 |
Drop-in alternatives for K3KL8L80QM-MUCT — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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View Datasheet →K3KL8L80QM-MUCT Maximum Ratings & Electrical Characteristics
| Memory Type | LPDDR5X SDRAM |
| Density | 32 Gb (4 GB) |
| Speed Grade | QM (per Samsung part numbering) |
| Package | FBGA (original package, 315-ball class) |
| Mounting Type | Surface Mount |
| Interface | LPDDR5X channel interface |
| Series | LPDDR5X |
| Brand | Samsung Semiconductor |
| Packaging Suffix | MUCT |
| Application Segment | Mobile / AI edge computing |
K3KL8L80QM-MUCT fbga (original package, 315-ball class) Pin Configuration Guide
Complete pinout information for K3KL8L80QM-MUCT (fbga (original package, 315-ball class) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for K3KL8L80QM-MUCT.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
K3KL8L80QM-MUCT is suitable for 6 applications: Flagship Smartphone Main Memory, AI Edge Computing Modules, Automotive Infotainment Systems, 5G Modems and Connected Devices, Tablets and Portable Computing, Test and Measurement Instruments.
Flagship Smartphone Main Memory
The K3KL8L80QM-MUCT serves as the main system DRAM in flagship smartphones, where its 32 Gb (4 GB) capacity and LPDDR5X interface provide the bandwidth needed by flagship SoCs such as Snapdragon and Exynos application processors. Multi-gigabit-per-second per-pin data rates support high-refresh displays, computational photography, and on-device AI inference. The part is PoP- or package-mounted adjacent to the AP with length-matched channel routing; its LPDDR5X low-voltage operation reduces memory subsystem power, which is typically a top-3 battery consumer. Speed-bin qualification against the SoC memory compatibility list is the key integration step.
Recommended
AI Edge Computing Modules
Edge AI accelerators and smart camera modules use the K3KL8L80QM-MUCT as activation/frame-buffer DRAM, because LPDDR5X delivers higher bandwidth per watt than LPDDR5 at lower operating voltage. The 32 Gb (4 GB) density fits typical CNN feature-map working sets for real-time object detection at multi-frame-per-second rates. The device mounts on a dense FBGA land pattern; memory-controller training handles timing closure at LPDDR5X data rates. Designers should budget bandwidth headroom, since AI inference and streaming share the same channel and overflow forces costly external DRAM upgrades or model quantization.
Recommended
Automotive Infotainment Systems
Automotive cockpit SoCs increasingly qualify LPDDR5X for infotainment domains, and the K3KL8L80QM-MUCT provides 32 Gb (4 GB) of channel memory for navigation rendering, multi-display output, and voice-assistant processing. LPDDR5X bandwidth sustains 3D HMI rendering while low-voltage operation reduces thermal load in enclosed head units. Integration requires confirming the temperature class and the OEM SoC approved-memory list, since commercial mobile bins are generally used for infotainment rather than safety domains. Drop-in second-sourcing within the Samsung LPDDR5X family simplifies supply continuity across vehicle program lifecycles.
Recommended
5G Modems and Connected Devices
5G modems, CPE gateways, and connected tablets use the K3KL8L80QM-MUCT as protocol and packet-buffer memory. LPDDR5X multi-gigabit data rates keep pace with multi-gigabit 5G throughput while the 32 Gb density supports deep buffering for millimeter-wave peak bursts. The FBGA surface-mount package suits dense modem boards; low-voltage LPDDR5X operation trims standby draw important for battery-powered CPE. Design attention should go to power-integrity on VDDQ rails, since LPDDR5X termination currents are dynamic and peak during simultaneous read/write bursts across bank groups.
Recommended
Tablets and Portable Computing
Premium tablets and foldable devices adopt the K3KL8L80QM-MUCT for combined OS, app, and graphics memory. The 4 GB monolithic density allows multi-die stacking to reach 8-16 GB system memory within thin form factors, while LPDDR5X bandwidth supports high-resolution displays and desktop-class browser workloads. Thermal constraints in fanless enclosures favor the LPDDR5X low-voltage interface, which cuts memory-subsystem heat compared with LPDDR5 at equivalent bandwidth. PCB designers must maintain strict package-to-AP length matching in the thin stackup typical of tablet boards to preserve eye margin at maximum data rate.
Recommended
Test and Measurement Instruments
Portable oscilloscopes, logic analyzers, and protocol testers embed the K3KL8L80QM-MUCT as high-speed capture buffer memory, since LPDDR5X sustained bandwidth supports continuous streaming acquisition at hundreds of megasamples per second into a 4 GB per-die buffer. The FBGA package mounts on high-layer-count instrument boards with dedicated power planes; the memory controller runs calibration training at power-up to close timing at full data rate. Procurement teams value the drop-in Samsung LPDDR5X family alternatives for long instrument service lifetimes, since speed-bin substitution keeps the footprint and firmware structure unchanged.
Recommended
Recommended Products Summary
Engineering reference data for K3KL8L80QM-MUCT — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | K3KL8L80CM-MGCT | K3LK8L80CM-MGCT | K3LKCKC0BM-MGCP | K3LKBKB0BM-MGCP | K3KL7L70EM-MGCU |
|---|---|---|---|---|---|---|
| Package | FBGA (315-ball class, original package) | FBGA (315-ball class) - same | FBGA (315-ball class) - same | FBGA (LPDDR5X family) - same family | FBGA (LPDDR5X family) - same family | FBGA (LPDDR5X family) - same family |
| Brand | Samsung Electronics | Samsung Electronics | Samsung Electronics | Samsung Electronics | Samsung Electronics | Samsung Electronics |
| Memory Type | LPDDR5X | LPDDR5X | LPDDR5X | LPDDR5X | LPDDR5X | LPDDR5X |
| Density | 32 Gb (4 GB) | 32 Gb (4 GB) | 32 Gb (4 GB) | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
| Speed Grade Code | QM | CM | CM | B | B | E |
| Data Rate per Pin | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
| Lifecycle Status | Active | Active | Active | Active | Active | Active |
| Typical Use | Flagship smartphone / AI edge memory | Smartphone / tablet memory (lower bin) | Smartphone / tablet memory (lower bin) | Mobile / AI companion memory | High-density mobile memory | Mid-tier mobile memory |
Key Differentiators
- Top speed bin in the 32 Gb LPDDR5X family (vs K3KL8L80CM-MGCT)
- 32 Gb monolithic density reduces die count (vs K3KL7L70EM-MGCU)
- LPDDR5X interface with lower operating voltage (vs LPDDR5 predecessors in the Samsung lineup)
Design Notes
LPDDR5X channel routing to the K3KL8L80QM-MUCT must maintain length matching within the tolerance specified by the SoC memory design guide (typically a few mils within a byte lane). Use a stackup with unbroken reference planes under all address/command and data groups. At multi-Gbps data rates, via stubs and plane splits dominate eye closure - keep escape routing short and reference the same ground plane end-to-end. Rely on on-die termination and read/write training for final margin, but do not substitute layout care for training range.
LPDDR5X devices draw dynamic termination current on VDDQ that peaks during simultaneous read/write bursts. Estimated: budget VDDQ decoupling with a mix of bulk (10-22 uF) plus high-frequency (0.1 uF) ceramics placed within 2-3 mm of the ball farm, and verify rail droop against the controller's worst-case simultaneous burst pattern in SI simulation. Confirm exact VDD/VDDQ values from the Samsung datasheet for the QM speed bin before finalizing the power tree, as LPDDR5X voltage levels are bin-dependent.
Verify the exact MPN ordering: the correct part is K3KL8L80QM-MUCT; transposed strings such as K3LK8L80QM-MUCT circulate in search queries and can return a different speed bin or family. When substituting the CM speed grade (K3KL8L80CM-MGCT), re-run memory training and confirm the platform approved-memory list - firmware boot parameters and training result tables differ between bins. LPDDR5X FBGA parts are moisture-sensitive: observe MSL floor life and bake per the Samsung packing datasheet before reflow.
Compliance Information
Compliance status not stated in retrieved distributor data; obtain Samsung RoHS/REACH certificates for the exact orderable code before production. Not an automotive-qualified orderable code.
