K4A4G165WF-BCWE - 4Gb DDR4 SDRAM 3200Mbps | Samsung
MPN: K4A4G165WF-BCWE ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $13.1 | $13.10 |
| 10 | $12.45 | $124.50 |
| 100 | $11.8 | $1,180.00 |
| 500 | $11.2 | $5,600.00 |
| 1,000 | $10.65 | $10,650.00 |
Drop-in alternatives for K4A4G165WF-BCWE — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
K4A4G165WE-BCWE
✅ Drop-In📋 Reference alternative (not in catalog)
K4A4G165WF-BCTD
✅ Drop-In✓ In Stock
$2.69 / Unit
View Datasheet →K4A4G165WE-BCTD
✅ Drop-In✓ In Stock
$11.38 / Unit
View Datasheet →K4A4G165WE-BIRC0CV
✅ Drop-In📋 Reference alternative (not in catalog)
K4A4G165WF-BCWE Maximum Ratings & Electrical Characteristics
| Memory Type | DDR4 SDRAM |
| Memory Density | 4 Gbit |
| Organization | 256M x 16 |
| Data Rate | 3200 Mbps |
| Clock Frequency | 1.6 GHz |
| Supply Voltage | 1.2 V (1.14 V to 1.26 V) |
| Access Time | 19 ns |
| Operating Temperature | 0C to +85C |
| Package | FBGA-96 (TFBGA) |
| Mounting Type | Surface Mount |
| Interface | Parallel |
| Die Generation | Samsung F-die |
| Data Mask | Supported (DM) |
| ZQ Calibration | Supported |
| On-Die Termination | Dynamic ODT supported |
| CRC | Supported |
| Auto Precharge | Supported |
| Asynchronous Reset | Supported |
| RoHS Status | Compliant (per JLCPCB listing) |
K4A4G165WF-BCWE fbga-96 (tfbga) Pin Configuration Guide
Complete pinout information for K4A4G165WF-BCWE (fbga-96 (tfbga) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for K4A4G165WF-BCWE.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
K4A4G165WF-BCWE is suitable for 6 applications: Industrial Embedded ARM Computing, Networking and Communications Equipment, Test and Measurement Instrumentation, Industrial HMI and Display Systems, Embedded x86 and Gateway Servers, Automotive-Adjacent and Robotics Controllers.
Industrial Embedded ARM Computing
The K4A4G165WF-BCWE fits industrial ARM-based edge computing and HMI controller boards that need 4GB-class DDR4 main memory. Its 256M x 16 organization provides a 16-bit data bus that halves component count versus x8 designs, and the DDR4-3200 speed grade supplies 2.5 GB/s peak per device, adequate for Linux-class SoCs running vision or protocol workloads. In use, the DRAM connects to the SoC memory controller in fly-by address/command topology with dynamic ODT handling termination on-die, simplifying routing. The 1.2V rail consumes roughly 25% less power than DDR3 per Samsung, reducing thermal load in fanless enclosures; verify the SoC QVL lists DDR4-3200 x16 components before release.
Recommended
Networking and Communications Equipment
In switch, router, and gateway line cards, the K4A4G165WF-BCWE serves as packet buffer and control-plane memory. The DDR4-3200 data rate (3200 Mbps per pin) and bank-group architecture sustain the random-access patterns of packet buffering, while CRC and data-mask functions improve data path reliability without external logic. The x16 interface with on-die termination (dynamic ODT) supports multi-rank fly-by routing on dense boards. The 0C to +85C commercial-industrial range covers indoor telecom closets and controlled data-center environments. Designers should budget the 1.2V VDD rail with low-ESR bulk and high-frequency decoupling close to the FBGA-96 power balls, and confirm the network processor supports DDR4 x16 device organization.
Recommended
Test and Measurement Instrumentation
Bench instruments such as oscilloscopes, logic analyzers, and signal generators use the K4A4G165WF-BCWE as deep waveform capture memory. Its 4Gbit density in a single FBGA-96 device allows large acquisition buffers with a compact footprint, and the 19 ns access time specification reflects fast random read behavior suited to segmentation replay. Because acquisition engines stream data continuously, the DDR4-3200 class bandwidth absorbs sustained write bursts from front-end ADCs. In the circuit, memory controllers perform ZQ calibration at power-up as supported by the device, and data-mask capability simplifies partial writes during waveform processing. The 0C to +85C rating suits laboratory environments rather than extended outdoor temperature ranges.
Recommended
Industrial HMI and Display Systems
Human-machine interface panels with large frame buffers benefit from the K4A4G165WF-BCWE's 4Gbit capacity and x16 organization, which deliver 512 MB of framebuffer and application memory per device. Display controllers moving 1080p or multi-layer graphics need sustained bandwidth; the DDR4-3200 rating supplies headroom over DDR3-class predecessors while the 1.2V operation cuts enclosure heat by roughly 25% versus DDR3 per Samsung's DDR4 family data. The auto precharge and asynchronous reset functions speed up display-list reconfiguration and simplify power-fail recovery in factory settings. Mount the FBGA-96 on a 4-layer or better PCB with length-matched DQ groups; the 0C to +85C range covers typical indoor factory floors.
Recommended
Embedded x86 and Gateway Servers
Compact embedded x86 gateways and micro-servers use the K4A4G165WF-BCWE as main system memory in single-device or multi-rank configurations. Its DDR4-3200 throughput supports virtualized workloads, and the CRC feature adds a link-integrity layer valued in always-on server-class designs. The 96-ball FBGA footprint permits placing DRAM directly on the carrier board or on soldered-down memory modules where SODIMM sockets are impractical. During integration, enable dynamic ODT and ZQ calibration as the device supports, and follow fly-by routing for address/command across multiple devices. The commercial 0C to +85C range targets climate-controlled server rooms; extended-temperature deployments should consider industrial DRAM grades instead.
Recommended
Automotive-Adjacent and Robotics Controllers
Non-safety robotics controllers and factory automation computers adopt the K4A4G165WF-BCWE for vision processing and motion-planning workloads. The 4Gbit F-die device provides the memory capacity needed by camera pipelines and path planners, while 2.5 GB/s peak bandwidth per x16 device keeps frame buffers and control loops responsive. In the memory subsystem, the controller applies ZQ calibration after reset as the device supports, and the CRC/data-mask functions protect and streamline data writes. Controllers should verify operation within 0C to +85C; harsher automotive-bay environments require the qualified industrial/automotive variants such as the K4A4G165WE-BIRC0CV family. Decouple the 1.2V rail with bulk capacitance near the FBGA-96 power balls for burst tolerance.
Recommended
Recommended Products Summary
Engineering reference data for K4A4G165WF-BCWE — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | K4A4G165WE-BCWE | K4A4G165WF-BCTD | K4A4G165WE-BCTD | K4A4G165WE-BIRC0CV |
|---|---|---|---|---|---|
| Package | FBGA-96 (TFBGA) | FBGA-96 - same | FBGA-96 - same | FBGA-96 - same | FBGA-96 - same |
| Brand | Samsung Electronics | Samsung Electronics | Samsung Electronics | Samsung Electronics | Samsung Electronics |
| Density / Organization | 4 Gbit / 256M x 16 | 4 Gbit / 256M x 16 | 4 Gbit / 256M x 16 | 4 Gbit / 256M x 16 | 4 Gbit / 256M x 16 |
| Speed Grade | DDR4-3200 (BCWE) | DDR4-3200 class (BCWE) | DDR4-2666 class (TD) | DDR4-2666 class (TD) | [DATA_NEEDED] |
| Supply Voltage | 1.2 V (1.14 V to 1.26 V) | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| Operating Temperature | 0C to +85C | 0C to +85C | 0C to +95C (per LCSC) | [DATA_NEEDED] | [DATA_NEEDED] |
| Die Generation | F-die | E-die | F-die | E-die | E-die |
| Grade | Standard commercial/industrial | Standard | Standard | Standard | Industrial/automotive grade (IR suffix) |
| Unit Price (qty 1, as of 2026-09-04) | $13.10 | [DATA_NEEDED] | $20.75 (LCSC) | [DATA_NEEDED] | [DATA_NEEDED] |
Key Differentiators
- Highest speed grade in the Samsung 4Gb x16 DDR4 line (vs K4A4G165WF-BCTD)
- Newer F-die silicon generation (vs K4A4G165WE-BCWE)
- Lower unit price than older F-die speed variant (vs K4A4G165WF-BCTD)
Design Notes
Route DDR4-3200 signal groups per Samsung's DDR4 design guide: fly-by topology for address/command with per-device series termination, and per-byte-group length matching for DQ/DQS within the controller skew budget (typically tens of mils at this data rate - use your controller's specification). Place the 240-ohm ZQ calibration resistor with a short, clean ground return. The FBGA-96 balls allow via-in-pad escape on 4-layer boards; on 2-layer hobby layouts DDR4-3200 timing will likely fail, so plan at least 4 layers with solid reference planes.
The device operates from a nominal 1.2V rail (1.14V to 1.26V). Use a dedicated point-of-load buck regulator (for example TI TPS54218 family) with fast transient response, plus 100 nF ceramic decoupling per power ball region and 22 uF to 47 uF bulk near the device. Follow the datasheet power-rail sequencing table (VDD before or with reference rails as specified) to avoid latch-up during startup. Estimated: at full DDR4-3200 activity, budget several hundred mA per device; confirm idle/active currents from the datasheet IDD tables for your power tree.
Confirm the memory controller qualified (QVL) lists DDR4-3200 x16 F-die components - many industrial SoCs cap at DDR4-2666, in which case the K4A4G165WF-BCTD or K4A4G165WE-BCTD is the correct choice. Also note the BCWE grade is rated 0C to +85C: the BCTD variant extends to +95C if your enclosure runs hot. Finally, DDR4 uses bank groups - blindly reusing DDR3 controller timing will cause initialization failures; run the controller's training and ZQ calibration routines at every boot.
Compliance Information
RoHS compliance stated on JLCPCB listing for C5827965. REACH, halogen-free, and conflict-minerals declarations not found in provided data - request from Samsung via distributor.
