K4B4G1646E-BCNB - 4Gb DDR3L SDRAM 256Mx16 1.35V | Samsung
MPN: K4B4G1646E-BCNB ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $14.93 | $14.93 |
| 10 | $13.8 | $138.00 |
| 100 | $12.6 | $1,260.00 |
| 500 | $11.4 | $5,700.00 |
| 1,000 | $10.5 | $10,500.00 |
Drop-in alternatives for K4B4G1646E-BCNB — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
K4B4G1646E-BYK0
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View Datasheet →K4B4G1646E-BYMA
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View Datasheet →K4B4G1646E-BMMA
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View Datasheet →K4B4G1646E-BMK0
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View Datasheet →K4B4G1646D-BCK0
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View Datasheet →W634GU6RB11I
✅ Drop-In✓ In Stock
$1.95 / Unit
View Datasheet →AS4C256M16D3C-93BCN
✅ Drop-In📋 Reference alternative (not in catalog)
IS43TR16256AL-125KBL
✅ Drop-In✓ In Stock
$5.6 / Unit
View Datasheet →K4B4G1646E-BCNB Maximum Ratings & Electrical Characteristics
| Memory Type | DDR3L SDRAM |
| Memory Capacity | 4 Gbit |
| Organization | 256M x 16 |
| Data Rate | 1866 Mbps |
| Supply Voltage | 1.35 V (1.283 V to 1.45 V DDR3L) |
| Interface | Parallel |
| Package | 96-ball FBGA |
| Mounting Type | Surface Mount |
| Operating Temperature | 0C to +95C |
| Auto Precharge | Yes |
| Asynchronous Reset | Yes |
| On-Chip Termination | Dynamic ODT |
| ZQ Calibration | Yes |
| Data Mask Function | Yes |
| Die Technology | Samsung E-die |
| RoHS Status | Compliant |
| Speed Grade Suffix | BCN (DDR3L-1866 bin, per Samsung ordering code) |
K4B4G1646E-BCNB 96-ball fbga Pin Configuration Guide
Complete pinout information for K4B4G1646E-BCNB (96-ball fbga package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for K4B4G1646E-BCNB.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
K4B4G1646E-BCNB is suitable for 6 applications: Single-Board Computers and ARM SoC Platforms, Industrial PLCs and Factory Automation, Networking and Communication Equipment, Medical Data-Logging Devices, Smart Home and IoT Hubs, Automotive Infotainment (Aftermarket).
Single-Board Computers and ARM SoC Platforms
The K4B4G1646E-BCNB is the main system memory for single-board computers and ARM SoC platforms such as Samsung Artik-based designs. Its 4Gb (512 MB) 256M x16 organization matches the 16-bit DDR3L memory controllers common on mid-range application processors, and the 1866 Mbps data rate provides roughly 3.7 GB/s of peak bandwidth on a single x16 channel - sufficient for Linux-class embedded computing. The 1.35V DDR3L operation cuts dynamic memory power roughly 15-20% versus 1.5V DDR3, which matters in passively cooled and battery-backed boards. Layout follows the standard fly-by command/address topology with ZQ calibration, and the 96-ball FBGA footprint keeps the BOM compact.
Recommended
Industrial PLCs and Factory Automation
Programmable logic controllers and factory-automation gateways use the K4B4G1646E-BCNB for program memory buffering, retentive data logging, and HMI frame buffers. Its 0C to +95C operating range covers typical control-cabinet environments, and features like asynchronous RESET# let the PLC watchdog reinitialize memory cleanly after a fault. The E-die's lower IDD current reduces heat inside sealed enclosures where airflow is limited. Because DDR3 is JEDEC-standardized, designers can dual-source with Alliance Memory or ISSI pin-compatible parts to guarantee a decade of supply continuity, and the same 96-ball FBGA footprint enables drop-in qualification across vendors.
Recommended
Networking and Communication Equipment
Switches, routers, and WAN access equipment deploy the K4B4G1646E-BCNB as packet-buffer and control-plane memory. The 1866 Mbps data rate sustains line-rate packet buffering for fast-Ethernet-class designs, while the data-mask (DM) function allows partial writes of packet headers without read-modify-write cycles. Dynamic ODT and ZQ calibration maintain signal integrity on the dense, fly-by-routed DDR3 topologies typical of networking boards with multiple load points. The 96-ball FBGA package suits the compact, high-density layout constraints of managed switch and CPE mainboards, and RoHS compliance aligns with telecom environmental requirements.
Recommended
Medical Data-Logging Devices
Patient monitors and portable diagnostic instruments use the K4B4G1646E-BCNB to buffer waveforms, images, and audit logs before upload. The device's deterministic DDR3 timing and asynchronous RESET# support the fail-safe data retention strategies required in medical data logging, and the low 1.35V supply reduces battery drain in portable equipment. Its 0C to +95C range covers typical clinical ambient conditions. Because E-die lowers standby current, battery-powered monitor designs benefit from longer sleep-mode endurance. Designers should qualify second sources such as ISSI or Winbond to secure long product lifecycles, as medical platforms often stay in production for 7-10 years.
Recommended
Smart Home and IoT Hubs
IoT gateways, smart speakers, and home-automation hubs use the K4B4G1646E-BCNB as main memory for local processing, protocol stacks, and edge-AI inference buffers. The 4Gb capacity supports Linux-based hubs, and 16-bit organization keeps cost and PCB layers down versus x32 or dual-x8 configurations. DDR3L's 1.35V operation suits always-on devices where standby power is regulated, and E-die improves low-current retention. The 96-ball FBGA is reflow-compatible with standard SMT lines used in high-volume consumer manufacturing. Controllers in this segment (e.g., mid-range ARM SoCs) commonly support the DDR3L-1866 bin of this component.
Recommended
Automotive Infotainment (Aftermarket)
Aftermarket and tier-2 automotive infotainment head units and display modules use the K4B4G1646E-BCNB for graphics frame buffers and application memory. The 1866 Mbps rate supports smooth rendering on WVGA-class displays, and the 0C to +95C range fits in-cabin electronics with appropriate enclosure thermal design. DDR3L operation reduces the memory subsystem's share of total unit heat, easing fanless dashboard designs. Note that this commercial-grade BCNB SKU is not AEC-Q100 qualified; for a qualified automotive path, use an I-temperature Samsung variant or an automotive-grade DDR3/DDR4 part such as K4A8G085WB-BICR, keeping memory-controller configuration in mind.
Recommended
Recommended Products Summary
Engineering reference data for K4B4G1646E-BCNB — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | K4B4G1646E-BYK0 | K4B4G1646D-BCK0 | W634GU6RB11I | AS4C256M16D3C-93BCN |
|---|---|---|---|---|---|
| Package | 96-ball FBGA | 96-ball FBGA - same | 96-ball FBGA - same | 96-ball FBGA - same | 96-ball FBGA - same |
| Brand | Samsung Electronics | Samsung Electronics | Samsung Electronics | Winbond | Alliance Memory |
| Capacity | 4 Gbit | 4 Gbit | 4 Gbit | 4 Gbit | 4 Gbit |
| Organization | 256M x 16 | 256M x 16 | 256M x 16 | 256M x 16 | 256M x 16 |
| Data Rate | 1866 Mbps | [DATA_NEEDED] | 1600 Mbps bin (D-die BCK) | 1866 Mbps (933 MHz) | 1866 Mbps (93 suffix) |
| Supply Voltage | 1.35 V (DDR3L) | 1.35 V (DDR3L) | 1.35 V (DDR3L) | 1.35 V (DDR3L) | 1.5 V (DDR3) |
| Operating Temperature | 0C to +95C | [DATA_NEEDED] | 0C to +95C | -40C to +95C (industrial) | 0C to +95C |
| Die / Technology | Samsung E-die | Samsung E-die | Samsung D-die | Winbond DDR3L process | Alliance (Nanya-fab) DDR3 |
| Lifecycle Priority | Active (Samsung DDR3 mature phase) | Active | Mature/D-die phase-out risk | Long-lifecycle industrial | Long-lifecycle second source |
Key Differentiators
- Lower power with E-die process (vs K4B4G1646D-BCK0)
- Industrial temperature option in same footprint (vs W634GU6RB11I)
- DDR3L 1.35V native operation (vs AS4C256M16D3C-93BCN)
- 1866 Mbps speed bin headroom (vs IS43TR16256AL-125KBL)
Design Notes
DDR3 x16 at 1866 Mbps requires fly-by command/address routing with per-DQS write leveling. Keep command/address length skew within 100 mils across loads and route DQ/DQS as tightly coupled 40-50 ohm pairs with matched intra-pair lengths. Enable dynamic ODT on writes and ZQ calibration at initialization; place the ZQ ball's 240-ohm 1% resistor on a quiet ground island per the Samsung datasheet layout guide. Avoid routing DDR3 traces over board plane splits, which cause impedance discontinuities and eye collapse.
Estimated: with VDD=1.35V and a typical 1866 Mbps read/write mix, per-die current for a 4Gb E-die part is on the order of a few hundred milliamps (consult the datasheet IDD tables for exact ICC values per condition). Budget VDD and VDDQ rails separately, decouple each FBGA ball pair with at least one 0.1 uF ceramic plus bulk 22-47 uF per device. DDR3L is backward-compatible with 1.5V DDR3 controllers, but only within the 1.283-1.45 V DDR3L window - never run it above 1.45V.
A frequent sourcing error is confusing 4 Gb with 4 GB - this part stores 512 MB. Also verify the controller supports the BCN (DDR3L-1866) speed bin; if it tops out at DDR3L-1600, the part runs fine at a relaxed CL but the timing register set must match. Finally, when second-sourcing with Alliance AS4C256M16D3C-93BCN, note that part is 1.5V DDR3, not DDR3L - confirm your regulator and controller before dropping it in, or select the Alliance DDR3L 'D3L' variants instead.
Compliance Information
RoHS compliant per Samsung/LCSC listing. Not an automotive AEC-Q100 qualified grade; select an I-temperature variant for automotive paths. REACH/halogen-free status not stated in provided data.
