PDRQLAKCDF12-00 - 16Gb DDR5-7200 SDRAM | Samsung Electronics
MPN: PDRQLAKCDF12-00 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $18.5 | $18.50 |
| 10 | $17.2 | $172.00 |
| 100 | $15.9 | $1,590.00 |
| 500 | $14.8 | $7,400.00 |
| 1,000 | $13.6 | $13,600.00 |
Drop-in alternatives for PDRQLAKCDF12-00 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
K4RAH165VB-BCWM
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$9.92 / Unit
View Datasheet →K4RAH165VP-BCWM
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$8.34 / Unit
View Datasheet →K4RAH165VB-BCQK
✅ Drop-In ⚠️ 参数待验证✓ In Stock
Contact for price
View Datasheet →K4RAH165VB-BIQK
✅ Drop-In ⚠️ 参数待验证✓ In Stock
Contact for price
View Datasheet →K4RAH086VE-BCWM
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$7.6 / Unit
View Datasheet →PDRQLAKCDF12-00 Maximum Ratings & Electrical Characteristics
| Memory Type | DDR5 SDRAM |
| Density | 16 Gbit |
| Organization | 1G x 16 |
| Data Rate | 7200 Mbps per pin |
| Speed Bin | DDR5-7200 |
| Operating Voltage | 1.1 V |
| Package | 102-ball FBGA |
| Mounting Type | Surface Mount |
| Generation | DDR5 (improved from 6400 Mbps generation) |
| Interface | JEDEC DDR5 |
PDRQLAKCDF12-00 [data_needed: package height] Pin Configuration Guide
Complete pinout information for PDRQLAKCDF12-00 ([data_needed: package height] package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
![[data_needed: package height] package pinout diagram for PDRQLAKCDF12-00](/assets/package-diagrams/default.svg?v=1788069619)
No detailed pinout data available for PDRQLAKCDF12-00.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
PDRQLAKCDF12-00 is suitable for 6 applications: PC and Workstation Memory Modules (UDIMM/SO-DIMM), Server RDIMM and Data Center Memory, Graphics and AI Accelerator Board Memory, Networking and Communication Equipment, Industrial Automation and Edge Computing, Embedded On-Board Memory in Consumer and IoT Hubs.
PC and Workstation Memory Modules (UDIMM/SO-DIMM)
The PDRQLAKCDF12-00 fits client PC UDIMM and SO-DIMM designs where its 7200 Mbps data rate and 1G x16 organization deliver high per-channel bandwidth at the JEDEC 1.1 V operating voltage. A typical DDR5 UDIMM places multiple x16 components per 64-bit channel, and the on-module PMIC converts 5 V to the 1.1 V DRAM rail. The DDR5-7200 bin requires memory-controller training support, but delivers roughly 12.5% more bandwidth than the 6400 Mbps generation, improving integrated-graphics and content-creation performance. designers should follow Samsung layout guidance for length matching and on-die termination settings.
Recommended
Server RDIMM and Data Center Memory
Data center server platforms use registered DIMMs built from DDR5 x16 components; the PDRQLAKCDF12-00's 16 Gbit density allows high-capacity RDIMMs when combined with register clock drivers and SPD hubs. Its 1.1 V operation reduces per-DIMM power, which directly cuts data center cooling budgets, while the 7200 Mbps speed bin supports next-generation Xeon/EPYC memory controllers. The x16 organization reduces component count per module, improving yield and cost. Server designs must validate RCD compatibility and on-die ECC reporting in the BMC memory-training flow before production.
Recommended
Graphics and AI Accelerator Board Memory
GPU add-in boards and AI accelerator cards often attach DDR5 components directly to the PCB around the host processor. The PDRQLAKCDF12-00's 7200 Mbps rate provides the bandwidth headroom these workloads demand, and its 102-ball FBGA footprint supports dense on-board arrays of x16 devices. At 1.1 V, a bank of components dissipates measurably less heat than an equivalent DDR4-3200 array, easing airflow design. Designers must implement fly-by command/address routing, reference-voltage planes, and per-byte DQS training consistent with JEDEC DDR5 board design guidelines for signal integrity at 7200 Mbps.
Recommended
Networking and Communication Equipment
Enterprise switches, routers, and 5G baseband cards use DDR5 as packet-buffer and control-plane memory. The PDRQLAKCDF12-00's combination of 16 Gbit density and 1G x16 organization suits wide, deep buffer pools, while 7200 Mbps operation sustains line-rate packet processing without memory bottlenecks. The 102-ball FBGA surface-mount package allows direct on-board attachment - no sockets, improving reliability in always-on networking hardware. Industrial-temperature screening options in the K4RAH family cover extended-ambient telecom racks; verify the required temperature grade and conformance testing for NEBS-type deployments.
Recommended
Industrial Automation and Edge Computing
Industrial PCs, machine-vision controllers, and edge AI gateways increasingly adopt DDR5 for larger working sets in vision inference and protocol processing. The PDRQLAKCDF12-00's 1.1 V operation lowers rail power in passively cooled enclosures, and its 7200 Mbps bandwidth accelerates frame-buffer handling in multi-camera vision systems. On-board soldered DDR5 also resists vibration better than socketed modules. For these deployments, pair the DRAM with wide-input power modules and verify memory-controller training margins over the full -40C to +85C ambient range if industrial-screening variants are selected.
Recommended
Embedded On-Board Memory in Consumer and IoT Hubs
Smart-home hubs, premium set-top boxes, and in-vehicle infotainment head units use soldered-down DDR5 to save space and improve mechanical robustness. The PDRQLAKCDF12-00's 102-ball FBGA supports compact multi-layer layouts, and 16 Gbit capacity covers modern media pipelines with headroom. Its DDR5-7200 bin enables responsive 4K/8K media playback and edge AI workloads at 1.1 V, reducing thermal design constraints in sealed enclosures. Consumer platforms should confirm SoC memory-controller support for the speed bin and implement JEDEC DDR5 power-ramp sequencing for reliable boot.
Recommended
Recommended Products Summary
Engineering reference data for PDRQLAKCDF12-00 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | K4RAH165VB-BCWM | K4RAH165VP-BCWM | K4RAH165VB-BCQK | K4RAH086VE-BCWM |
|---|---|---|---|---|---|
| Package | 102-ball FBGA | 102-ball FBGA - same | 102-ball FBGA - same | 102-ball FBGA - same | 102-ball FBGA - same |
| Brand | Samsung Electronics | Samsung Electronics | Samsung Electronics | Samsung Electronics | Samsung Electronics |
| Density | 16 Gbit | 16 Gbit | 16 Gbit | 16 Gbit | 16 Gbit (2G x8) |
| Organization | 1G x16 | 1G x16 | 1G x16 | 1G x16 | 2G x8 |
| Memory Type | DDR5 SDRAM | DDR5 SDRAM | DDR5 SDRAM | DDR5 SDRAM | DDR5 SDRAM |
| Speed Bin | DDR5-7200 | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
| Operating Voltage | 1.1 V | 1.1 V | 1.1 V | 1.1 V | 1.1 V |
| Temperature Screening | [DATA_NEEDED: operating temperature range] | Standard (WM suffix) | Standard (WM suffix) | [DATA_NEEDED] | Standard (WM suffix) |
Key Differentiators
- Native 7200 Mbps speed bin (vs K4RAH165VB-BCWM)
- x16 organization reduces component count (vs K4RAH086VE-BCWM)
- 102-ball FBGA footprint flexibility (vs PDRQL8KCBF12-00)
Design Notes
DDR5 moves voltage regulation onto the module: a dedicated PMIC generates the 1.1 V DRAM core rail from a 5 V or 12 V input with I2C/I3C programmability. Size the PMIC for peak current of all mounted components - estimate roughly 16 Gbit x16 parts drawing several hundred mA each during 7200 Mbps bursts (exact current per Samsung datasheet IDD tables). Verify power-ramp sequencing between VDD, VDDQ, and VPP per the JEDEC DDR5 specification to avoid latch-up during hot-plug or brownout events.
At 7200 Mbps, DDR5 signal integrity demands careful stackup and routing: use fly-by CA routing, length-match DQ/DQS byte groups within tight intra-byte skew budgets, and reference DQ nets to solid VSS/VDDQ planes with adequate decoupling. The 102-ball FBGA footprint allows via-in-pad or dog-bone escape; for arrays, prefer via-in-pad with filled vias to shorten the electrical path. Follow the Samsung DDR5 component layout guide and your memory-controller (CPU/SoC) design guideline, which take precedence over generic DRAM rules at this speed bin.
Do not assume the 7200 Mbps speed bin works on every DDR5 memory controller - many 2024-2025 chipsets train only to 5600/6400 Mbps. Confirm BIOS/firmware training tables support DDR5-7200 before committing BOM. Second, Samsung suffix codes encode speed, package, and screening; substituting between CDF/CBF and K4RAH suffix variants without checking the ordering-information table can silently change the speed bin or temperature grade. Always request the official Samsung DDR5 datasheet and match the full ordering code, not just the prefix.
Compliance Information
Compliance data was not present in the retrieved web data. Samsung DDR5 components are generally RoHS-compliant, but confirm with the official Samsung product page and certificate of conformance before release.
