XC3S1600EFG400 - Spartan-3E FPGA 1.6M Gates | AMD/Xilinx
MPN: XC3S1600EFG400 β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $45 | $45.00 |
| 10 | $40.5 | $405.00 |
| 100 | $36 | $3,600.00 |
| 500 | $32.4 | $16,200.00 |
| 1,000 | $29 | $29,000.00 |
Drop-in alternatives for XC3S1600EFG400 β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
XC3S1600E-4FGG400C
β Drop-Inπ Reference alternative (not in catalog)
XC3S1600E-4FG400C
β Drop-Inπ Reference alternative (not in catalog)
XC3S1200E-4FG400C
β Drop-Inπ Reference alternative (not in catalog)
XC3S2000E-4FG400C
β Drop-Inπ Reference alternative (not in catalog)
XC3S1600EFG400 Maximum Ratings & Electrical Characteristics
| Family | Spartan-3E |
| Logic Cells | 33192 |
| Equivalent Gate Count | 1600000 |
| CLBs | 3688 |
| Block RAM | 663552 bits |
| Maximum Clock Frequency | 572 MHz |
| Number of I/O | 304 |
| Core Supply Voltage | 1.2 V |
| Package | 400-ball FBGA (FG400) |
| Terminal Pitch | 1.00 mm |
| Technology | CMOS |
| Operating Temperature | [DATA_NEEDED: operating temperature range] |
| Mounting Type | Surface Mount |
| RoHS Status | [DATA_NEEDED: RoHS status] |
| Configuration Interfaces | JTAG, SPI, SelectMAP |
XC3S1600EFG400 Pin Configuration
| Pin A1 | IO_L01N_0 β User I/O differential negative, bank 0 |
| Pin A2 | IO_L01P_0 β User I/O differential positive, bank 0 |
| Pin B1 | IO_L02N_0 β User I/O differential negative, bank 0 |
| Pin B2 | IO_L02P_0 β User I/O differential positive, bank 0 |
| Pin C1 | VCCAUX β Auxiliary supply voltage (2.5V) |
| Pin C2 | GND β Ground |
| Pin D1 | IO_L03N_0 β User I/O differential negative, bank 0 |
| Pin D2 | IO_L03P_0 β User I/O differential positive, bank 0 |
| Pin E1 | VCCINT β Core supply voltage (1.2V) |
| Pin E2 | GND β Ground |
| Pin F1 | IO_L04N_0 β User I/O differential negative, bank 0 |
| Pin F2 | IO_L04P_0 β User I/O differential positive, bank 0 |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
XC3S1600EFG400 is suitable for 6 applications: Industrial Control, Automotive Infotainment, Communication Systems, Consumer Electronics, Medical Imaging, Aerospace and Defense.
Industrial Control
The XC3S1600EFG400 is ideal for industrial control systems requiring high logic density and flexible I/O. With 33,192 logic cells and 304 I/O pins, it can implement complex motor control algorithms, PLC interfaces, and real-time processing. The 1.2V core and 572 MHz clock support high-speed data acquisition and control loops. Its 663,552 bits of block RAM enable on-chip buffering for sensor data. The FPGA's reconfigurability allows firmware updates in the field, reducing downtime. Compared to microcontrollers, it offers parallel processing and deterministic timing, essential for safety-critical industrial applications.
Recommended
Automotive Infotainment
In automotive infotainment, the XC3S1600EFG400 provides the logic capacity for video processing, audio DSP, and interface bridging. Its 304 I/O pins support multiple display interfaces, camera inputs, and CAN/LIN controllers. The 572 MHz clock enables real-time video scaling and overlay. The FPGA's low power 1.2V core is suitable for automotive environments, though temperature grade must be verified. Block RAM can store line buffers for video processing. The device's reconfigurability allows over-the-air updates for new features. Compared to ASICs, it offers flexibility and faster time-to-market for evolving infotainment standards.
Recommended
Communication Systems
The XC3S1600EFG400 is well-suited for communication systems such as base stations, routers, and software-defined radio. Its high logic density and 572 MHz clock enable implementation of digital up/down converters, FFT engines, and protocol processing. The 304 I/O pins support high-speed serial interfaces like LVDS and SERDES. Block RAM provides buffering for packet processing. The FPGA's parallel architecture handles multiple channels simultaneously, improving throughput. Its reconfigurability allows adaptation to evolving standards like 5G. Compared to DSPs, it offers higher parallelism and lower latency for real-time signal processing.
Recommended
Consumer Electronics
In consumer electronics, the XC3S1600EFG400 enables cost-effective implementation of video processing, gaming, and smart home devices. Its 33,192 logic cells can handle image scaling, color space conversion, and user interface rendering. The 304 I/O pins connect to HDMI, USB, and sensor interfaces. The 1.2V core minimizes power consumption for battery-powered devices. Block RAM supports frame buffering and audio FIFOs. The FPGA's reconfigurability allows feature updates post-launch. Compared to ASSPs, it offers customization and differentiation. Its 400-ball FBGA package is compact for consumer form factors.
Recommended
Medical Imaging
The XC3S1600EFG400 is used in medical imaging devices like ultrasound and endoscopy systems. Its high logic density supports real-time image processing, filtering, and enhancement. The 572 MHz clock enables high-frame-rate video pipelines. The 304 I/O pins interface with image sensors and display panels. Block RAM stores line buffers and coefficients. The FPGA's deterministic timing is critical for synchronized acquisition. Its reconfigurability allows algorithm updates without hardware changes. Compared to GPUs, it offers lower power and predictable latency. The 1.2V core reduces heat in compact medical devices.
Recommended
Aerospace and Defense
In aerospace and defense, the XC3S1600EFG400 provides reliable programmable logic for radar, communication, and navigation systems. Its 33,192 logic cells implement complex signal processing and encryption algorithms. The 572 MHz clock supports high-speed data acquisition. The 304 I/O pins interface with sensors and actuators. Block RAM enables secure key storage. The FPGA's radiation tolerance must be verified for space applications. Its reconfigurability allows mission-specific updates. Compared to ASICs, it offers flexibility and lower NRE costs. The 1.2V core reduces power in power-constrained platforms.
Recommended
Recommended Products Summary
Engineering reference data for XC3S1600EFG400 β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | XC3S1600E-4FGG400C | XC3S1600E-4FG400C | XC3S1600E-4FGG320I | XC3S1200E-4FG400C | XC3S2000E-4FG400C |
|---|---|---|---|---|---|---|
| Package | 400-ball FBGA (FG400) | 400-ball FBGA (FG400) | 400-ball FBGA (FG400) | 320-ball FBGA (FG320) | 400-ball FBGA (FG400) | 400-ball FBGA (FG400) |
| Brand | AMD | AMD | AMD | AMD | AMD | AMD |
| Logic Cells | 33192 | 33192 | 33192 | 33192 | 17280 | 46080 |
| Block RAM (bits) | 663552 | 663552 | 663552 | 663552 | 516096 | 663552 |
| Number of I/O | 304 | 304 | 304 | 250 | 304 | 304 |
| Max Clock Frequency | 572 MHz | 572 MHz | 572 MHz | 572 MHz | 572 MHz | 572 MHz |
| Core Supply Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| Temperature Grade | [DATA_NEEDED] | Commercial | Commercial | Industrial | Commercial | Commercial |
Key Differentiators
- Higher logic density than XC3S1200E (vs XC3S1200E-4FG400C)
- Lower logic density than XC3S2000E (vs XC3S2000E-4FG400C)
- Lead-free option available (vs XC3S1600E-4FG400C)
Design Notes
The XC3S1600EFG400 requires a stable 1.2V core supply (VCCINT) and 2.5V auxiliary supply (VCCAUX). Use low-ESR ceramic capacitors (e.g., 100nF and 10uF) placed close to each power pin to decouple high-frequency noise. According to Xilinx UG332, proper decoupling is critical for reliable operation. Also, ensure the I/O banks are powered with the appropriate VCCO voltage for the selected I/O standard.
For the 400-ball FBGA package, use a 4-layer or more PCB with dedicated power and ground planes. Route high-speed signals with controlled impedance (e.g., 50 ohm single-ended) and minimize trace lengths. Follow Xilinx PCB design guidelines in UG393 for BGA escape routing and via placement. Ensure adequate thermal vias under the package for heat dissipation.
A common pitfall is incorrect configuration of the FPGA. The XC3S1600EFG400 supports JTAG, SPI, and SelectMAP configuration. Ensure the mode pins are set correctly and the configuration bitstream is compatible with the device. Also, verify that the VCCAUX supply is within the specified range (2.5V) to avoid configuration failures. Refer to Xilinx UG380 for configuration details.
Compliance Information
Compliance information not explicitly provided in the verified data. The 'G' in FGG400 may indicate lead-free, but this is not confirmed.
