EPM570M100C5N - 440 Macrocell MAX II CPLD, 100-MBGA | Intel
料号： EPM570M100C5N ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $18.4 | $18.40 |
| 10 | $16.55 | $165.50 |
| 100 | $13.92 | $1,392.00 |
| 250 | $12.6 | $3,150.00 |
| 500 | $11.85 | $5,925.00 |
EPM570M100C5N 概述
A CPLD (Complex Programmable Logic Device) is a non-volatile programmable logic device that combines the instant-on behavior of a PAL/GAL with the density and routability of a small FPGA. Within the broader hierarchy of programmable logic, CPLD sits between discrete 74-series glue logic and high-density FPGAs, providing deterministic timing, low standby power, and a single-chip solution for bus decoding, I/O expansion, and power-up control. The MAX II family specifically targets glue-logic replacement with MultiVolt I/O support, on-chip User Flash Memory (UFM), and JTAG-based in-system programmability.
Key features of the EPM570M100C5N include 8 Kbits of UFM for non-volatile user data, MultiVolt I/O supporting 1.5V/1.8V/2.5V/3.3V interfaces, a 2.5V/3.3V core, JTAG (IEEE 1149.1) and ISP support, plus a commercial operating temperature grade (0C to +85C). The device is built on a 0.18 um, 6-layer-metal flash process and consumes standby current in the microamp range, suiting it to power-sensitive designs.
Architecturally, MAX II uses a logic-element array with a continuous, non-segmented interconnect that delivers predictable, deterministic timing - critical for control applications such as address decoding, bus bridging, and reset distribution. The on-chip flash stores the configuration, so the device starts in a known state within microseconds of power-up, removing the external configuration memory required by SRAM-based FPGAs.
Typical applications include bus interface bridging, I/O expansion for microcontrollers and ASSPs, address/command decoding in DDR memory subsystems, power-sequencer and reset-controller logic, peripheral glue-logic replacement, and protocol bridging (UART, SPI, I2C, parallel). The wide MultiVolt I/O makes it especially useful when bridging a 1.8V processor to 3.3V peripherals.
When designing with the EPM570M100C5N, note that the 100-MBGA package requires a 4-layer PCB with microvia technology or a 6-layer stack-up for fan-out routing, plus proper thermal relief on the ball pads. All unused I/O pins should be configured as outputs driving a defined logic level to minimize quiescent current.
This page synthesizes distributor pricing, drop-in alternatives within the EPM570 pin-compatible family, and practical PCB/glue-logic design notes that complement (rather than duplicate) the manufacturer datasheet.
直接替换替代料： EPM570M100C5N ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： EPM570M100C5N （相同外形与封装尺寸） ——差异在于 Operating Temperature, Package, Process Technology, Programming Interface, Configuration Memory.
快速对比工具——选择替代料号进行并排对比：
EPM570M100C4N
✅ 直接替换✓ 有现货
$14.95 / 个
查看数据手册 →EPM570GM100C5N
✅ 直接替换✓ 有现货
$10.4 / 个
查看数据手册 →EPM570GM100I5N
✅ 直接替换✓ 有现货
$8.55 / 个
查看数据手册 →EPM570GF100C5N
✅ 直接替换✓ 有现货
$11.65 / 个
查看数据手册 →EPM570F100C5N
✅ 直接替换✓ 有现货
$5.2 / 个
查看数据手册 →EPM570F100I5N
✅ 直接替换✓ 有现货
$13.4 / 个
查看数据手册 →EPM570M100C5N 最大额定值与电气特性
| Family | MAX II |
| Series | EPM570 |
| Device Type | CPLD (Complex Programmable Logic Device) |
| Macrocell Count | 440 |
| Logic Elements | 570 |
| User I/Os | 76 |
| 引脚数 | 100 |
| 封装 | 100-MBGA (FineLine BGA, 6 x 6 mm, 0.5 mm pitch) |
| Maximum Frequency (fMAX) | 201.1 MHz |
| Pin-to-Pin Propagation Delay | 5.4 ns |
| Operating Supply Voltage (Core) | 2.5 V / 3.3 V |
| I/O Voltage Support | 1.5 V / 1.8 V / 2.5 V / 3.3 V (MultiVolt) |
| On-Chip User Flash Memory (UFM) | 8 Kbits |
| Process Technology | 0.18 um, 6-layer-metal flash |
| Programming Interface | JTAG (IEEE 1149.1) and ISP |
| 工作温度范围 | 0 C to +85 C (Commercial) |
| 安装类型 | Surface Mount (BGA) |
| RoHS 状态 | Lead-Free / Compliant |
EPM570M100C5N 100-mbga (fineline bga, 6 x 6 mm, 0.5 mm pitch) 引脚配置指南
EPM570M100C5N（100-mbga (fineline bga, 6 x 6 mm, 0.5 mm pitch) 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： EPM570M100C5N.
请参阅 数据手册 以查看完整引脚配置。
典型应用
EPM570M100C5N 适用于 6 应用s: Bus Interface Bridging and I/O Expansion, Power Sequencing and Reset Distribution, DDR Memory Address/Command Decoding, Industrial Control and Factory Automation, Communication Protocol Bridging (UART/SPI/I2C to Parallel), Display and LED Matrix Driving.
Bus Interface Bridging and I/O Expansion
The EPM570M100C5N is well-suited as a glue-logic bridge between processors and peripherals because it offers 76 MultiVolt I/Os that natively support 1.5V/1.8V/2.5V/3.3V interfaces without external level shifters. Its 440 macrocells easily absorb address decoders, chip-select generators, and interrupt controllers for legacy 8/16-bit bus attachment to modern SoCs, while the 5.4 ns pin-to-pin delay keeps bus-cycle latency low. Place the CPLD between the processor and multiple peripherals to consolidate 74-series glue logic into a single re-programmable device, simplifying board layout and BOM. The on-chip UFM (8 Kbits) can hold boot options or board revision metadata for traceability.
推荐
Power Sequencing and Reset Distribution
The EPM570M100C5N's instant-on, non-volatile flash-based configuration makes it ideal for power-rail sequencing in multi-supply systems. On power-up, the device enters a known state within microseconds - no external boot PROM or configuration flash is required - so it can immediately assert reset signals, enable DC-DC converters, and gate MOSFETs in the correct order. With 76 user I/Os and 440 macrocells, the same CPLD can sequence 6-8 independent rails, monitor power-good flags, and latch fault conditions. The deterministic 5.4 ns pin-to-pin delay gives predictable timing margins for sequencing windows, which is critical for processors requiring strict supply ramp order.
推荐
DDR Memory Address/Command Decoding
For DDR2/DDR3 memory subsystems, the EPM570M100C5N can host the address and command decoding logic that sits between the memory controller and the DRAM, including chip-select generation, bank-address steering, and clock-enable control. The 201.1 MHz fMAX and 5.4 ns propagation delay comfortably meet DDR command timing budgets at 200-266 MHz clock rates. The MultiVolt I/O (1.5V/1.8V/2.5V/3.3V) allows direct interfacing with DDR2 SSTL-18 and DDR3 drivers. Because the configuration is non-volatile, the decoder state is deterministic at power-up, avoiding the unpredictable boot-time behavior seen with SRAM-based FPGAs.
推荐
Industrial Control and Factory Automation
In factory-automation controllers, the EPM570M100C5N serves as a deterministic logic concentrator that consolidates discrete I/O handling, encoder counters, and protocol translation (e.g., SPI to parallel). The 76 user I/Os interface with 24V-to-3.3V opto-isolated inputs on the field side while driving logic-level outputs back to the controller. Industrial designs benefit from the deterministic timing of CPLDs (no jitter from SRAM configuration), enabling reliable PWM generation, quadrature decoding, and interrupt edge detection. The 0C to +85C commercial temperature range covers most cabinet-mounted equipment; for outdoor or motor-control enclosures, the EPM570GM100I5N industrial variant extends to -40C to +100C.
推荐
Communication Protocol Bridging (UART/SPI/I2C to Parallel)
The EPM570M100C5N's 440 macrocells and 76 I/Os make it a good fit for protocol-bridging tasks such as converting multiple UART streams into a single parallel bus, expanding SPI slave selects, or implementing custom I2C-to-parallel adapters for legacy peripherals. The on-chip UFM (8 Kbits) can store device descriptors or address tables for the bridge. At 201.1 MHz internal fMAX, the device supports UART baud rates up to 10 Mbps and SPI clocks above 50 MHz with proper constraint settings, leaving headroom for status/state-machine logic alongside the protocol converters.
推荐
Display and LED Matrix Driving
For LED-matrix signage, character-LCD multiplexers, and small TFT display controllers, the EPM570M100C5N provides the deterministic timing needed to refresh rows or columns at uniform brightness without the visual artifacts that microsecond-level jitter can introduce. Its 76 user I/Os are enough to drive 8-12 multiplexed common-anode LED rows plus 8 column-driver enable lines. The 5.4 ns propagation delay permits refresh rates above 1 kHz for typical matrices, eliminating visible flicker. The MultiVolt I/O simplifies direct connection to both 3.3V driver ICs and 5V legacy LCD modules in mixed-supply designs.
推荐
推荐产品汇总
工程参考数据： EPM570M100C5N ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | EPM570M100C4N | EPM570GM100C5N | EPM570GM100I5N | EPM570GF100C5N |
|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 100-MBGA (6x6 mm) | 100-MBGA - same | 100-MBGA - same | 100-MBGA - same | 100-MBGA - same |
| Macrocell Count | 440 | 440 | 440 | 440 | 440 |
| User I/Os | 76 | 76 | 76 | 76 | 76 |
| Speed Grade | C5 (5.4 ns tPD) | C4 (faster) | C5 | I5 (industrial) | C5 |
| Operating Temperature | 0 C to +85 C (Commercial) | 0 C to +85 C (Commercial) | 0 C to +85 C (Commercial) | -40 C to +100 C (Industrial) | 0 C to +85 C (Commercial) |
| Core Voltage | 2.5 V / 3.3 V | 2.5 V / 3.3 V | 2.5 V / 3.3 V | 2.5 V / 3.3 V | 2.5 V / 3.3 V |
| User Flash Memory | 8 Kbits | 8 Kbits | 8 Kbits | 8 Kbits | 8 Kbits |
| RoHS / Lead-Free | Yes (Pb-free) | Yes (Pb-free) | Yes (Pb-free) | Yes (Pb-free) | Yes (Pb-free) |
关键差异点
- Same-package industrial-grade drop-in option （对比 EPM570GM100I5N)
- Same-package faster speed-grade upgrade （对比 EPM570M100C4N)
- Functionally equivalent variant with identical density （对比 EPM570GM100C5N)
设计说明
The 100-MBGA package (6 x 6 mm, 0.5 mm pitch) requires PCB microvia technology for fan-out routing. Use a 4-layer stack-up with HDI (laser-drilled) microvias from the BGA pads to inner signal layers, OR a 6-layer stack-up with conventional through-vias and dog-bone fan-out. Each BGA ball needs a non-solder-mask-defined (NSMD) land pad of approximately 0.30 mm diameter with a 0.50 mm pitch via. Maintain a clear keep-out of at least 0.4 mm from the package edge to the first routing track. X-ray inspection after reflow is recommended to verify joint integrity because the BGA balls are hidden under the package.
All unused I/O pins on the MAX II CPLD must be configured as outputs driving a defined logic level (high or low) rather than left as inputs. Unconfigured inputs float, causing shoot-through current in the I/O cell and increasing quiescent current draw by hundreds of microamperes per pin. In Quartus II, enable the 'Reserve all unused pins' setting under Device Options -> Unused Pins, and choose 'As output driving ground' or 'As output driving an unspecified signal' as the default state. Also, configure JTAG pins (TCK/TMS/TDO/TDI) appropriately if JTAG is not used: TMS and TDI require internal pull-ups that Quartus enables automatically when JTAG is disabled in the pin assignments.
The MAX II CPLD requires both a core supply (VCCINT, 3.3V or 2.5V) and one or more I/O supplies (VCCIO, supporting 1.5V/1.8V/2.5V/3.3V). Decoupling should follow the Altera reference: place one 0.1 uF X7R ceramic capacitor per VCCINT pin and one 0.1 uF per VCCIO bank, all within 3 mm of the respective BGA ball. Add a bulk 10 uF tantalum or ceramic capacitor near each supply pin. When the I/O bank is configured for 1.5V SSTL signaling, the reference voltage (VREF) requires its own decoupling of 0.1 uF + 10 uF at the bank supply pins. Power-rail sequencing (VCCINT before VCCIO, or vice versa) is not strictly required for MAX II, but matching the application datasheet recommendation of VCCINT at least 1.0V before VCCIO avoids I/O-cell latch-up risk on hot-plug events.
合规信息
RoHS compliant per manufacturer declaration. Not AEC-Q100 qualified; the MAX II family is not targeted at automotive safety-critical applications. For automotive, evaluate MAX 10 or Cyclone IV/E families. Halogen-free status not explicitly stated in the verified web data; set to 'unknown' rather than guessing.
