K4B4G1646E-BMMA - 4Gb DDR3L SDRAM 256Mx16 | Samsung
Артикул: K4B4G1646E-BMMA ✓ Активен| Кол-во | Цена за ед. | Итого |
|---|---|---|
| 1 | $27.5625 | $27,56 |
| 10 | $19.9063 | $199,06 |
| 100 | $17.6094 | $1.760,94 |
| 500 | $16.8438 | $8.421,90 |
| 1.000 | $16.0781 | $16.078,10 |
K4B4G1646E-BMMA Обзор
DDR3L SDRAM (Double Data Rate 3 Low Voltage) is a type of synchronous dynamic random-access memory that operates at a lower voltage (1.35V) compared to standard DDR3 (1.5V), reducing power consumption by up to 20% while maintaining similar performance. It is part of the DDR3 memory family, which is widely used in computing, networking, and embedded systems. DDR3L is backward compatible with DDR3 slots, allowing flexible system design.
Key features of the K4B4G1646E-BMMA include a 16-bit I/O interface, 8 internal banks, and support for burst lengths of 8 and 4 (with burst chop). It offers programmable CAS latency (CL) and additive latency (AL), and includes on-die termination (ODT) for improved signal integrity. The device also supports self-refresh and partial array self-refresh (PASR) for power saving in standby modes.
Technically, the K4B4G1646E-BMMA uses Samsung's E-die process technology, which provides enhanced performance and lower power consumption compared to earlier die revisions. The 96-ball FBGA package measures 9mm x 13mm with a 0.8mm ball pitch, enabling high-density board layouts. The device is RoHS compliant and lead-free, meeting environmental standards.
Typical applications include high-performance computing, networking equipment (routers, switches), industrial automation, automotive infotainment and ADAS, and medical imaging systems. Its wide temperature range and low voltage make it ideal for harsh environments where reliability is critical.
When designing with this memory, ensure proper decoupling capacitors near the power pins and follow the layout guidelines in the datasheet to minimize signal integrity issues. The ZQ calibration pin requires a 240-ohm resistor to ground for correct impedance calibration.
Аналоги без доработки для K4B4G1646E-BMMA — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.
Варианты в этой серии
Модели той же серии, совместимые без доработки с K4B4G1646E-BMMA (тот же форм-фактор и посадочное место) — отличается по Package, Supply Voltage, Data Rate, Operating Temperature, Memory Type.
Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:
K4B4G1646E-BYMA
✓ В наличии
$14.3182 / шт.
Открыть даташит →K4B4G1646E-BYK0
✓ В наличии
$1.8 / шт.
Открыть даташит →K4B4G1646D-BMK0
✓ В наличии
$5.9 / шт.
Открыть даташит →MT41K256M16HA-125:E
✓ В наличии
$3.1 / шт.
Открыть даташит →H5TC4G63AFR-PBA
✓ В наличии
$3.9773 / шт.
Открыть даташит →IS43TR16256AL-125KBL
✓ В наличии
$5.6 / шт.
Открыть даташит →K4B4G1646E-BMMA Максимальные параметры и электрические характеристики
| Тип памяти | DDR3L SDRAM |
| Density | 4 Gb |
| Организация памяти | 256M x 16 |
| Скорость передачи данных | 1600 Mbps |
| Напряжение питания | 1.35 V |
| Рабочая температура | -40°C to +95°C |
| Корпус | 96-FBGA (9x13 mm) |
| Number of Banks | 8 |
| Интерфейс | Parallel |
| Clock Frequency | 800 MHz |
| Burst Length | 8, 4 (with burst chop) |
| On-Die Termination | Yes (Dynamic ODT) |
| ZQ Calibration | Yes |
| RoHS | Compliant |
| Lead-Free | Yes |
Конфигурация выводов K4B4G1646E-BMMA
| Контакт A1 | VDD — Power supply (1.35V) |
| Контакт A2 | DQ0 — Data input/output 0 |
| Контакт A3 | DQ1 — Data input/output 1 |
| Контакт A4 | VSS — Ground |
| Контакт A5 | DQ2 — Data input/output 2 |
| Контакт A6 | DQ3 — Data input/output 3 |
| Контакт A7 | VDD — Power supply (1.35V) |
| Контакт A8 | DQ4 — Data input/output 4 |
| Контакт A9 | DQ5 — Data input/output 5 |
| Контакт A10 | VSS — Ground |
| Контакт A11 | DQ6 — Data input/output 6 |
| Контакт A12 | DQ7 — Data input/output 7 |
| Контакт B1 | VSS — Ground |
| Контакт B2 | DQ8 — Data input/output 8 |
| Контакт B3 | DQ9 — Data input/output 9 |
| Контакт B4 | VDD — Power supply (1.35V) |
| Контакт B5 | DQ10 — Data input/output 10 |
| Контакт B6 | DQ11 — Data input/output 11 |
| Контакт B7 | VSS — Ground |
| Контакт B8 | DQ12 — Data input/output 12 |
| Контакт B9 | DQ13 — Data input/output 13 |
| Контакт B10 | VDD — Power supply (1.35V) |
| Контакт B11 | DQ14 — Data input/output 14 |
| Контакт B12 | DQ15 — Data input/output 15 |
| Контакт C1 | VDD — Power supply (1.35V) |
| Контакт C2 | A0 — Address input 0 |
| Контакт C3 | A1 — Address input 1 |
| Контакт C4 | A2 — Address input 2 |
| Контакт C5 | A3 — Address input 3 |
| Контакт C6 | A4 — Address input 4 |
| Контакт C7 | A5 — Address input 5 |
| Контакт C8 | A6 — Address input 6 |
| Контакт C9 | A7 — Address input 7 |
| Контакт C10 | A8 — Address input 8 |
| Контакт C11 | A9 — Address input 9 |
| Контакт C12 | VSS — Ground |
| Контакт D1 | VSS — Ground |
| Контакт D2 | A10/AP — Address input 10 / Auto precharge |
| Контакт D3 | A11 — Address input 11 |
| Контакт D4 | A12/BC — Address input 12 / Burst chop |
| Контакт D5 | A13 — Address input 13 |
| Контакт D6 | A14 — Address input 14 |
| Контакт D7 | BA0 — Bank address 0 |
| Контакт D8 | BA1 — Bank address 1 |
| Контакт D9 | BA2 — Bank address 2 |
| Контакт D10 | RAS# — Row address strobe |
| Контакт D11 | CAS# — Column address strobe |
| Контакт D12 | WE# — Write enable |
| Контакт E1 | VDD — Power supply (1.35V) |
| Контакт E2 | CS# — Chip select |
| Контакт E3 | CKE — Clock enable |
| Контакт E4 | ODT — On-die termination |
| Контакт E5 | RESET# — Reset |
| Контакт E6 | ZQ — ZQ calibration |
| Контакт E7 | CK — Clock |
| Контакт E8 | CK# — Complementary clock |
| Контакт E9 | DM0 — Data mask 0 |
| Контакт E10 | DM1 — Data mask 1 |
| Контакт E11 | VSS — Ground |
| Контакт E12 | VDD — Power supply (1.35V) |
| Контакт F1 | VSS — Ground |
| Контакт F2 | VDD — Power supply (1.35V) |
| Контакт F3 | VSS — Ground |
| Контакт F4 | VDD — Power supply (1.35V) |
| Контакт F5 | VSS — Ground |
| Контакт F6 | VDD — Power supply (1.35V) |
| Контакт F7 | VSS — Ground |
| Контакт F8 | VDD — Power supply (1.35V) |
| Контакт F9 | VSS — Ground |
| Контакт F10 | VDD — Power supply (1.35V) |
| Контакт F11 | VSS — Ground |
| Контакт F12 | VDD — Power supply (1.35V) |
Типичное применение
K4B4G1646E-BMMA подходит для 6 применениеs: Industrial Automation, Networking Equipment, Automotive Infotainment, Medical Imaging, High-Performance Computing, Consumer Electronics.
Industrial Automation
The K4B4G1646E-BMMA's wide temperature range (-40°C to +95°C) and low voltage (1.35V) make it ideal for industrial controllers and PLCs that operate in harsh environments. Its 1600 Mbps data rate ensures fast data processing for real-time control loops. The 4Gb density provides ample memory for complex automation algorithms and data logging. With features like auto precharge and ZQ calibration, it maintains signal integrity in noisy industrial settings, reducing system errors and improving reliability.
Рекомендуется
Networking Equipment
In routers and switches, the K4B4G1646E-BMMA provides high-bandwidth memory for packet buffering and forwarding tables. Its 1600 Mbps data rate and 16-bit interface enable fast data throughput, while the 1.35V operation reduces power consumption in always-on network devices. The 96-FBGA package allows compact board designs, and features like dynamic ODT improve signal integrity at high speeds, ensuring reliable data transmission in demanding network environments.
Рекомендуется
Automotive Infotainment
The K4B4G1646E-BMMA is suitable for automotive infotainment systems that require high-speed memory for navigation, multimedia, and connectivity. Its -40°C to +95°C temperature range meets automotive requirements, and the 1.35V low voltage helps reduce power consumption in vehicles. The 4Gb density supports large maps and media files, while the 1600 Mbps data rate ensures smooth performance. Features like auto precharge and ZQ calibration enhance reliability in the automotive environment.
Рекомендуется
Medical Imaging
In medical imaging devices such as ultrasound and MRI systems, the K4B4G1646E-BMMA provides high-speed memory for image processing and storage. Its 1600 Mbps data rate enables fast data transfer, while the 4Gb density can hold large image frames. The wide temperature range ensures reliable operation in clinical environments. The low voltage operation reduces heat generation, which is critical in sensitive medical equipment. Features like dynamic ODT help maintain signal integrity in high-speed imaging data paths.
Рекомендуется
High-Performance Computing
The K4B4G1646E-BMMA is used in servers and workstations for high-speed data processing. Its 1600 Mbps data rate and 16-bit interface provide high bandwidth for compute-intensive tasks. The 1.35V operation reduces power consumption in data centers, contributing to energy efficiency. The 96-FBGA package allows high-density memory modules, and features like auto precharge and ZQ calibration ensure reliable operation at high speeds. This memory is ideal for applications requiring large memory capacity and fast access times.
Рекомендуется
Consumer Electronics
In consumer devices like smart TVs and set-top boxes, the K4B4G1646E-BMMA provides high-speed memory for multimedia processing and app execution. Its 1600 Mbps data rate ensures smooth video playback and responsive user interfaces. The 1.35V low voltage helps extend battery life in portable devices. The 4Gb density supports multiple applications and media content. Features like dynamic ODT improve signal integrity in compact designs, making it suitable for space-constrained consumer electronics.
Рекомендуется
Сводка рекомендуемых товаров
Справочные инженерные данные для K4B4G1646E-BMMA — сравнение, рекомендации по проектированию и информация о соответствии.
Руководство по выбору
Сравнение с аналогами
| Параметр | Этот товар | K4B4G1646E-BYMA | K4B4G1646E-BYK0 | K4B4G1646D-BMK0 | MT41K256M16HA-125 | H5TC4G63AFR-PBA | IS43TR16256AL-125KBL |
|---|---|---|---|---|---|---|---|
| Package | 96-FBGA | 96-FBGA | 96-FBGA | 96-FBGA | E: 96-FBGA | 96-FBGA | 96-FBGA |
| Brand | Samsung | Samsung | Samsung | Samsung | E: Micron | SK Hynix | ISSI |
| Density | 4 Gb | 4 Gb | 4 Gb | 4 Gb | E: 4 Gb | 4 Gb | 4 Gb |
| Organization | 256M x 16 | 256M x 16 | 256M x 16 | 256M x 16 | E: 256M x 16 | 256M x 16 | 256M x 16 |
| Data Rate | 1600 Mbps | 1600 Mbps | 1866 Mbps | 1600 Mbps | E: 1600 Mbps | 1600 Mbps | 1600 Mbps |
| Supply Voltage | 1.35 V | 1.35 V | 1.35 V | 1.35 V | E: 1.35 V | 1.35 V | 1.35 V |
| Operating Temperature | -40°C to +95°C | -40°C to +95°C | -40°C to +95°C | -40°C to +95°C | E: 0°C to +95°C | -40°C to +95°C | -40°C to +95°C |
Ключевые отличия
- Wide temperature range (-40°C to +95°C) (против MT41K256M16HA-125:E)
- E-die process technology (против K4B4G1646D-BMK0)
- High-speed 1600 Mbps operation (против IS43TR16256AL-125KBL)
Заметки по проектированию
For high-speed DDR3L designs, maintain controlled impedance of 40-60 ohms for data and address lines. Use a 4-layer or more PCB with solid ground plane. Place decoupling capacitors (0.1uF and 1uF) close to each VDD and VDDQ pin. Follow the layout guidelines in the Samsung datasheet to minimize signal integrity issues.
The K4B4G1646E-BMMA operates up to +95°C, but ensure adequate airflow or heatsinking in high-temperature environments. The 96-FBGA package has a thermal resistance of approximately [DATA_NEEDED: theta_JA] °C/W. Calculate junction temperature to ensure it stays within the maximum rating. For industrial applications, consider derating if ambient temperature exceeds 85°C.
Ensure the ZQ pin is connected to a 240-ohm resistor to ground for correct impedance calibration. Do not leave the RESET# pin floating; tie it high for normal operation. Verify that the CKE pin is properly controlled during power-up and power-down sequences to avoid data corruption. Also, ensure the supply voltage is within 1.283V to 1.45V as per DDR3L specifications.
Информация о соответствии
RoHS compliant per LCSC listing. Lead-free per Samsung datasheet. AEC-Q100 not applicable for memory components.
