MPC860DEZQ50D4 vs MPC860SRVR50D4R2 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng MPC860DEZQ50D4 sa pamamagitan ng NXP Semiconductors at MPC860SRVR50D4R2 sa pamamagitan ng NXP Semiconductors. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
NXP Semiconductors
MPC860SRVR50D4R2 - PowerQUICC MPC8xx 50MHz MPU, 357-BGA | NXP
MPC860SRVR50D4R2 ⚠ Huling PagbiliPagsanggunian na paghahambing
| Parametro | MPC860DEZQ50D4 | MPC860SRVR50D4R2 |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Kategorya | Microcontrollers | Microcontrollers |
| Katayuan ng Lifecycle | NRND | Huling Pagbili |
| Processor Type | MPC8xx PowerQUICC, 32-bit | MPC8xx PowerQUICC, 32-Bit Power Architecture |
| Core Architecture | Power Architecture (embedded) | — |
| Core Frequency | 50 MHz | — |
| Communications Processor Module | CPM with HDLC, Ethernet, PCMCIA, SCC | Yes (RISC CPM with HDLC, Ethernet, UART) |
| Ethernet MAC | 10/100 Mbps integrated | — |
| HDLC/SDLC Channels | Yes (multi-channel) | — |
| PCMCIA Interface | Yes | — |
| Supply Voltage (I/O) | 3.3 V | — |
| Packhaging | 357-Ball PBGA (25x25 mm) | 357-BGA (25 x 25 mm) |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount |
| Temperature na Operasyon | 0 C to +95 C | — |
| Tindminan RoHS | Contains Lead (legacy BGA) | Compliant |
| Lead-Free Status | Contains Lead | — |
| Packaging | Tray | Tape & Reel (TR) |
| Sub-Brand Heritage | Freescale / NXP PowerQUICC | — |
| Core Count | — | 1 |
| Maksimum na Taktiko ng Oras | — | 50 MHz |
| Operating Voltage | — | 3.3 V |
| Hanay ng Temperature na Operasyon | — | 0 C to +95 C |
| Lead Free Status | — | Lead Free |
| Process Technology | — | 0.32 um CMOS |
| Ethernet Interfaces | — | 10/100 Mbps Fast Ethernet (FCC) |
| DMA Channels | — | 4 |
| Series | — | MPC860 |