K4B4G1646F-BYK0 - 4Gb DDR3L SDRAM 256Mx16 | Samsung
MPN: K4B4G1646F-BYK0 ✓ Hoạt độngK4B4G1646F-BYK0 Tóm tắt
DDR3L SDRAM is a type of double data rate synchronous dynamic random-access memory that operates at a lower voltage (1.35V) compared to standard DDR3 (1.5V), reducing power consumption by up to 20% while maintaining similar performance. It is part of the memory hierarchy in computing systems, serving as the main system memory for processors, and is widely used in laptops, servers, and embedded systems.
Key features include a 4Gb density, 16-bit I/O width, 96-ball FBGA package, and support for 1.35V and 1.5V operation. The device offers a burst length of 8 and 4, programmable CAS latency, and on-die termination. It also includes auto precharge, self-refresh, and power-down modes for energy efficiency.
The K4B4G1646F-BYK0 uses a high-performance CMOS process and features a pseudo-open-drain interface. It supports a wide operating temperature range of 0°C to 95°C (TC) and is RoHS compliant. The device is designed for reliable operation in demanding environments, with a typical refresh period of 7.8 us at 85°C.
Typical applications include DDR3L memory modules for laptops, all-in-one PCs, and embedded systems, as well as networking equipment, industrial computers, and automotive infotainment systems. Its low voltage and high density make it ideal for power-sensitive designs.
When designing with this device, ensure proper decoupling and signal integrity practices, including matched trace lengths and termination resistors, to achieve reliable high-speed operation.
Bộ thay thế dễ dàng lắp đặt cho K4B4G1646F-BYK0 — cùng gói, chân-to-chân tương thích. Các bộ phận yêu cầu hàn PCB bị loại trừ.
Các biến thể trong loạt này
Các mẫu cùng loạt có thể lắp đặt dễ dàng tương thích với K4B4G1646F-BYK0 (cùng hình factor và footprint) — khác nhau ở Data Rate, Operating Temperature, Package, Burst Length, Supply Voltage.
K4B4G1646E-BYK0
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →K4B4G1646D-BYK0
✅ Drop-In ⚠️ Thông số chưa được xác minhLiên hệ để biết giá
Xem tài liệu →K4B4G1646E-BCMA
✅ Drop-In✓ Còn hàng
$3.7734 / Đơn vị
Xem tài liệu →MT41K256M16HA-125:A1
✅ Drop-In ⚠️ Thông số chưa được xác minh📋 Tham chiếu thay thế (không có trong danh mục)
H5TC4G63AFR-PBA
✅ Drop-In ⚠️ Thông số chưa được xác minh✗ Hết hàng
$3.9773 / Đơn vị
Xem tài liệu →K4B4G1646F-BYK0 Tỷ lệ tối đa & tính chất điện
| Kiểu bộ nhớ | DDR3L SDRAM |
| Kích thước bộ nhớ | 4 Gb |
| Memory Organization | 256M x 16 |
| Điện áp cung cấp | 1.35V / 1.5V |
| Tốc độ dữ liệu | 1866 Mbps |
| Clock Frequency | 933 MHz |
| Hộp | 96-ball FBGA |
| Nhiệt độ hoạt động | 0°C to 95°C (TC) |
| Giao diện | Parallel |
| Burst Length | 8 and 4 |
| Latency CAS | Programmable |
| On-Die Termination | Yes |
| ZQ Calibration | Yes |
| Auto Precharge | Yes |
| Self-Refresh | Yes |
| RoHS | Compliant |
Cấu hình chân K4B4G1646F-BYK0
| Chân A1 | VDD — Power supply |
| Chân A2 | DQ0 — Data input/output 0 |
| Chân A3 | DQ1 — Data input/output 1 |
| Chân A4 | VSS — Ground |
| Chân A5 | DQ2 — Data input/output 2 |
| Chân A6 | DQ3 — Data input/output 3 |
| Chân A7 | VDD — Power supply |
| Chân A8 | DQ4 — Data input/output 4 |
| Chân A9 | DQ5 — Data input/output 5 |
| Chân A10 | VSS — Ground |
| Chân A11 | DQ6 — Data input/output 6 |
| Chân A12 | DQ7 — Data input/output 7 |
Ứng dụng tiêu biểu
K4B4G1646F-BYK0 phù hợp cho 6 Áp dụngs: Laptop Memory, Embedded Systems, Networking Equipment, Automotive Infotainment, Industrial PCs, Servers.
Laptop Memory
The K4B4G1646F-BYK0 is ideal for laptop memory modules (SO-DIMM) due to its low 1.35V operation, reducing power consumption and extending battery life. Its 4Gb density allows 8GB modules with 16 chips, and the 1866 Mbps data rate supports modern processors. The FBGA package enables compact module designs, and the wide temperature range ensures reliability in portable devices.
Được đề xuất
Embedded Systems
In embedded systems, the K4B4G1646F-BYK0 provides high-density memory for applications like industrial controllers and networking equipment. Its 1.35V operation reduces heat generation, and the 96-ball FBGA package is suitable for space-constrained PCBs. The device supports standard DDR3L features like ZQ calibration and on-die termination, simplifying design. Its 0-95°C range covers most industrial environments.
Được đề xuất
Networking Equipment
The K4B4G1646F-BYK0 is used in routers, switches, and firewalls for packet buffering and routing tables. Its high bandwidth (1866 Mbps) and low latency support high-throughput data processing. The 1.35V supply reduces power in always-on equipment, and the FBGA package offers good thermal performance. The device's reliability and long lifecycle make it suitable for infrastructure deployments.
Được đề xuất
Automotive Infotainment
In automotive infotainment systems, the K4B4G1646F-BYK0 provides memory for navigation, media playback, and connectivity. Its 1.35V operation reduces power draw from the vehicle's electrical system, and the 0-95°C range covers cabin temperature extremes. The FBGA package withstands vibration, and the high data rate supports smooth graphics. Samsung's automotive-grade variants are available for stricter requirements.
Được đề xuất
Industrial PCs
The K4B4G1646F-BYK0 is used in industrial PCs for factory automation and process control. Its 4Gb density allows large memory footprints for data logging and HMI applications. The 1.35V supply reduces heat in sealed enclosures, and the wide temperature range ensures operation in harsh environments. The device's long availability supports extended product lifecycles common in industrial equipment.
Được đề xuất
Servers
In entry-level servers, the K4B4G1646F-BYK0 is used in UDIMM modules for cost-effective memory expansion. Its 1866 Mbps data rate supports dual-channel configurations, and the 1.35V operation reduces data center power consumption. The FBGA package allows high-density modules, and the device's reliability is critical for 24/7 operation. ECC variants are available for error correction.
Được đề xuất
Tóm tắt các sản phẩm được đề xuất
Dữ liệu tham khảo kỹ thuật cho K4B4G1646F-BYK0 — so sánh, hướng dẫn thiết kế và thông tin tuân thủ.
Hướng dẫn chọn lựa
So sánh với các sản phẩm thay thế
| Tham số | Sản phẩm này | K4B4G1646E-BYK0 | K4B4G1646D-BYK0 | MT41K256M16HA-125:A1 | H5TC4G63AFR-PBA |
|---|---|---|---|---|---|
| Package | 96-ball FBGA | 96-ball FBGA | 96-ball FBGA | 96-ball FBGA | 96-ball FBGA |
| Brand | Samsung Electronics | Samsung Electronics | Samsung Electronics | Micron Technology | SK Hynix |
| Memory Size | 4 Gb | 4 Gb | 4 Gb | 4 Gb | 4 Gb |
| Organization | 256M x 16 | 256M x 16 | 256M x 16 | 256M x 16 | 256M x 16 |
| Supply Voltage | 1.35V / 1.5V | 1.35V / 1.5V | 1.35V / 1.5V | 1.35V / 1.5V | 1.35V / 1.5V |
| Data Rate | 1866 Mbps | 1866 Mbps | 1866 Mbps | 1866 Mbps | 1866 Mbps |
| Operating Temperature | 0°C to 95°C | 0°C to 95°C | 0°C to 95°C | 0°C to 95°C | 0°C to 95°C |
| RoHS | Compliant | Compliant | Compliant | Compliant | Compliant |
Bảo phân biệt quan trọng
- Low voltage operation (1.35V) (vsStandard DDR3 parts at 1.5V)
- High density 4Gb in 16-bit organization (vs2Gb parts like K4B2G1646F-BYK0)
- Samsung F-die revision (vsE-die (K4B4G1646E-BYK0))
Ghi chú thiết kế
For high-speed DDR3L routing, maintain 50-ohm single-ended impedance and 100-ohm differential impedance for DQS signals. Keep trace lengths matched within 50 mils for address/command and 25 mils for data groups. Use ground planes beneath the FBGA to minimize noise.
Decouple VDD and VDDQ with 0.1uF and 1uF capacitors placed close to the balls. Use a dedicated power plane for VDDQ to reduce noise. The 1.35V supply should be stable within +/-5% to ensure reliable operation.
The FBGA package dissipates heat through the solder balls and PCB. Ensure adequate thermal vias under the package to conduct heat to inner layers. For high ambient temperatures, consider airflow or heatsinks to keep TC below 95°C.
Thông tin tuân thủ
RoHS compliance confirmed from datasheet. Other compliance data not available.
