H5AN4G6NBJR-UHC vs MT40A256M16GE-083E 比較

詳細並排比較 H5AN4G6NBJR-UHC 由 SK hynix 與 MT40A256M16GE-083E 由 Micron Technology. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

SK hynix
H5AN4G6NBJR-UHC H5AN4G6NBJR-UHC - 4Gb DDR4 SDRAM 256Mx16 FBGA-96 | SK Hynix

H5AN4G6NBJR-UHC - 4Gb DDR4 SDRAM 256Mx16 FBGA-96 | SK Hynix

H5AN4G6NBJR-UHC ✓ 啟用中
Micron Technology
MT40A256M16GE-083E MT40A256M16GE-083E - DDR4 4Gb 256Mx16 2400MHz DRAM | Micron

MT40A256M16GE-083E - DDR4 4Gb 256Mx16 2400MHz DRAM | Micron

MT40A256M16GE-083E ✗ 停產

規格比較

參數 H5AN4G6NBJR-UHC MT40A256M16GE-083E
品牌 SK hynix Micron Technology
類別 Memory ICs Memory ICs
生命週期狀態 啟用中 停產終止
記憶體類型 DDR4 SDRAM DDR4 SDRAM
記憶體容量 4 Gbit —
組織 256M x 16 256M x 16
Clock Frequency 1.6 GHz 1200 MHz (DDR4-2400)
Supply Voltage (VDD) 1.14 V to 1.26 V —
Technology CMOS CMOS DRAM
工作溫度 -40C to +95C [DATA_NEEDED: operating temperature range]
封裝 FBGA-96 (PBGA-96) 96-ball FBGA, 9 x 14 mm
安裝類型 Surface Mount Surface Mount
Self Refresh Auto self-refresh —
Data Mask Function Yes (DM) —
Asynchronous Reset Yes (RESET_n) —
On-Die Termination Dynamic ODT —
ZQ Calibration Yes —
Write Leveling Yes —
CRC Function Yes (command/address CRC) —
RoHS 狀態 Compliant —
Density — 4 Gbit
供應電壓 — 1.2 V
介面 — Parallel
ECCN — EAR99
Country of Origin — China
無鹵素 — Compliant
Lead Free — Yes
Introduction Date — August 2017
Lifecycle — Obsolete / End of Life (per distributor cross-reference data)
CAS 延遲 — [DATA_NEEDED: CAS latency at DDR4-2400]
Refresh — [DATA_NEEDED: refresh rate]

資料表與資源

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