K4A4G165WF-BCWE vs K4A4G165WD-BCPB 比較
詳細並排比較 K4A4G165WF-BCWE 由 Samsung Electronics 與 K4A4G165WD-BCPB 由 Samsung Electronics. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | K4A4G165WF-BCWE | K4A4G165WD-BCPB |
|---|---|---|
| 品牌 | Samsung Electronics | Samsung Electronics |
| 類別 | Memory ICs | Memory ICs |
| 生命週期狀態 | 啟用中 | 啟用中 |
| 庫存狀態 | In Stock | — |
| 單價 (USD) | $10.65 | — |
| 記憶體類型 | DDR4 SDRAM | DDR4 SDRAM |
| Memory Density | 4 Gbit | — |
| 組織 | 256M x 16 | 256M x 16 |
| 資料速率 | 3200 Mbps | 2133 MT/s |
| Clock Frequency | 1.6 GHz | — |
| 供應電壓 | 1.2 V (1.14 V to 1.26 V) | — |
| Access Time | 19 ns | — |
| 工作溫度 | 0C to +85C | [DATA_NEEDED: operating temperature range] |
| 封裝 | FBGA-96 (TFBGA) | FBGA-96 |
| 安裝類型 | Surface Mount | Surface Mount |
| 介面 | Parallel | DDR4 (synchronous, source-synchronous strobe) |
| Die Generation | Samsung F-die | D-die |
| Data Mask | Supported (DM) | — |
| ZQ Calibration | Supported | — |
| On-Die Termination | Dynamic ODT supported | — |
| CRC | Supported | — |
| Auto Precharge | Supported | — |
| Asynchronous Reset | Supported | — |
| RoHS 狀態 | Compliant (per JLCPCB listing) | Compliant (lead-free suffix) |
| Density | — | 4 Gbit |
| Core Voltage | — | 1.2 V |
| Bank Architecture | — | 4 bank groups x 4 banks |
| CAS 延遲 | — | [DATA_NEEDED: CAS Latency at 2133 speed bin] |
| Burst Length | — | 8 (BL8, fixed/chop) |
| Pb-Free | — | Yes (per Samsung part-numbering suffix) |
| Refresh | — | Self-refresh supported (TCSR per DDR4 standard features) |