MT40A256M16GE-083E vs H5AN4G6NBJR-UHC 比較

詳細並排比較 MT40A256M16GE-083E 由 Micron Technology 與 H5AN4G6NBJR-UHC 由 SK hynix. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

Micron Technology
MT40A256M16GE-083E MT40A256M16GE-083E - DDR4 4Gb 256Mx16 2400MHz DRAM | Micron

MT40A256M16GE-083E - DDR4 4Gb 256Mx16 2400MHz DRAM | Micron

MT40A256M16GE-083E ✗ 停產
SK hynix
H5AN4G6NBJR-UHC H5AN4G6NBJR-UHC - 4Gb DDR4 SDRAM 256Mx16 FBGA-96 | SK Hynix

H5AN4G6NBJR-UHC - 4Gb DDR4 SDRAM 256Mx16 FBGA-96 | SK Hynix

H5AN4G6NBJR-UHC ✓ 啟用中

規格比較

參數 MT40A256M16GE-083E H5AN4G6NBJR-UHC
品牌 Micron Technology SK hynix
類別 Memory ICs Memory ICs
生命週期狀態 停產終止 啟用中
記憶體類型 DDR4 SDRAM DDR4 SDRAM
Density 4 Gbit —
組織 256M x 16 256M x 16
Clock Frequency 1200 MHz (DDR4-2400) 1.6 GHz
供應電壓 1.2 V —
封裝 96-ball FBGA, 9 x 14 mm FBGA-96 (PBGA-96)
安裝類型 Surface Mount Surface Mount
介面 Parallel —
Technology CMOS DRAM CMOS
ECCN EAR99 —
Country of Origin China —
無鹵素 Compliant —
Lead Free Yes —
Introduction Date August 2017 —
Lifecycle Obsolete / End of Life (per distributor cross-reference data) —
工作溫度 [DATA_NEEDED: operating temperature range] -40C to +95C
CAS 延遲 [DATA_NEEDED: CAS latency at DDR4-2400] —
Refresh [DATA_NEEDED: refresh rate] —
記憶體容量 — 4 Gbit
Supply Voltage (VDD) — 1.14 V to 1.26 V
Self Refresh — Auto self-refresh
Data Mask Function — Yes (DM)
Asynchronous Reset — Yes (RESET_n)
On-Die Termination — Dynamic ODT
ZQ Calibration — Yes
Write Leveling — Yes
CRC Function — Yes (command/address CRC)
RoHS 狀態 — Compliant

資料表與資源

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