K4A8G165WB-BCTD - 8Gb DDR4 SDRAM x16 | Samsung
料号： K4A8G165WB-BCTD ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $48.62 | $48.62 |
| 10 | $45.12 | $451.20 |
| 100 | $42 | $4,200.00 |
| 500 | $39.5 | $19,750.00 |
| 1,000 | $37 | $37,000.00 |
K4A8G165WB-BCTD 概述
DDR4 SDRAM (Double Data Rate 4 Synchronous Dynamic Random-Access Memory) is the fourth generation of DDR memory, offering higher bandwidth and lower power consumption compared to DDR3. It achieves data rates up to 3200 Mbps/pin while operating at 1.2V, a 20% reduction from DDR3's 1.5V. DDR4 is the industry standard for main memory in servers, desktops, laptops, and increasingly in embedded applications such as networking and industrial computing.
Key features include a 512M x 16 organization, 2666 Mbps data rate, 1.2V power supply, and support for JEDEC-standard features like on-die termination (ODT), ZQ calibration, and auto-precharge. The device also includes a data mask function and supports a temperature range of 0°C to +95°C (TC), making it suitable for a wide range of commercial and industrial environments.
The K4A8G165WB-BCTD is built on Samsung's advanced B-die process technology, which is known for its high speed and low latency. The 96-ball FBGA package provides excellent signal integrity and thermal performance, while the 1.2V operation reduces power consumption by up to 25% compared to DDR3, making it ideal for power-sensitive applications.
Typical applications include high-performance computing, servers, networking equipment, and embedded systems that require high memory bandwidth and capacity. The device is also used in graphics cards, set-top boxes, and automotive infotainment systems.
When designing with this component, ensure proper decoupling with 0.1uF and 1uF capacitors near the power pins, and follow the layout guidelines in the datasheet to minimize signal integrity issues. The device requires a stable 1.2V supply and a reference voltage (VREF) of 0.6V.
直接替换替代料： K4A8G165WB-BCTD ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： K4A8G165WB-BCTD （相同外形与封装尺寸） ——差异在于 Data Rate, Package, Operating Temperature, Interface, Memory Size.
快速对比工具——选择替代料号进行并排对比：
K4A8G165WC-BCTD
✓ 有现货
$41.2 / 个
查看数据手册 →K4A8G165WB-BCRC
✓ 有现货
$12.57 / 个
查看数据手册 →MT41K256M16TW-107
✓ 有现货
$14.1 / 个
查看数据手册 →H5TC4G63CFR-PBA
✓ 有现货
$6.23 / 个
查看数据手册 →NT5CC256M16CP-DIB1
✓ 有现货
$6 / 个
查看数据手册 →K4A8G165WB-BCTD 最大额定值与电气特性
| 存储器类型 | DDR4 SDRAM |
| 存储组织 | 512M x 16 |
| Total Density | 8 Gb |
| 数据速率 | 2666 Mbps/pin (PC4-2666) |
| 电源电压 | 1.2 V |
| 封装 | 96-ball FBGA |
| 工作温度 | 0°C to +95°C (TC) |
| Refresh | Auto-refresh, self-refresh |
| On-Die Termination | Yes (ODT) |
| ZQ Calibration | Yes |
| Data Mask | Yes |
| RoHS | Compliant |
K4A8G165WB-BCTD 引脚配置
| 引脚 A1 | VDD — Power supply (1.2V) |
| 引脚 A2 | VSS — Ground |
| 引脚 B1 | DQ0 — Data input/output 0 |
| 引脚 B2 | DQ1 — Data input/output 1 |
| 引脚 C1 | DQS0 — Data strobe 0 |
| 引脚 C2 | DQS0_n — Data strobe 0 complement |
| 引脚 D1 | A0 — Address input 0 |
| 引脚 D2 | A1 — Address input 1 |
| 引脚 E1 | BA0 — Bank address 0 |
| 引脚 E2 | BA1 — Bank address 1 |
| 引脚 F1 | CS_n — Chip select (active low) |
| 引脚 F2 | RAS_n — Row address strobe (active low) |
典型应用
K4A8G165WB-BCTD 适用于 6 应用s: High-Performance Computing, Networking Equipment, Embedded Systems, Graphics and Gaming, Automotive Infotainment, Data Center Storage.
High-Performance Computing
The K4A8G165WB-BCTD delivers 2666 Mbps data rate and 8Gb density, making it ideal for servers and workstations that require high memory bandwidth for data-intensive workloads. Its 1.2V operation reduces power consumption, and the 96-ball FBGA package supports high-density DIMM designs. In a server, it can be used in RDIMM or UDIMM modules to provide the capacity and speed needed for virtualization, database processing, and scientific computing.
推荐
Networking Equipment
In routers, switches, and network appliances, the K4A8G165WB-BCTD provides the high-speed memory required for packet buffering and routing tables. Its 2666 Mbps data rate ensures low latency, while the 1.2V supply helps meet strict power budgets. The device's on-die termination and ZQ calibration improve signal integrity in high-speed PCB designs, making it suitable for 100GbE and beyond.
推荐
Embedded Systems
For embedded applications like industrial PCs, medical devices, and test equipment, the K4A8G165WB-BCTD offers a balance of performance and power efficiency. Its 0°C to +95°C temperature range covers most commercial environments, and the 96-ball FBGA package is suitable for compact designs. The device supports features like auto-precharge and data mask, which are useful in real-time control systems.
推荐
Graphics and Gaming
The K4A8G165WB-BCTD is used in graphics cards and gaming consoles to provide high-bandwidth memory for rendering and texture storage. Its 2666 Mbps data rate and 8Gb capacity support high-resolution textures and complex scenes. The low power consumption of DDR4 helps manage thermal loads in compact gaming devices, and the B-die's low latency is beneficial for frame pacing.
推荐
Automotive Infotainment
In automotive infotainment systems, the K4A8G165WB-BCTD provides the memory needed for navigation, multimedia, and connectivity features. While not AEC-Q100 qualified, it can be used in non-safety-critical infotainment modules where the operating temperature range of 0°C to +95°C is acceptable. Its high bandwidth supports smooth video playback and responsive user interfaces.
推荐
Data Center Storage
In data center storage systems, the K4A8G165WB-BCTD is used in cache memory for SSDs and storage controllers. Its high data rate and low latency improve I/O performance, while the 1.2V supply reduces power consumption in large-scale deployments. The device's reliability features, such as on-die termination, ensure stable operation in high-speed interfaces.
推荐
推荐产品汇总
工程参考数据： K4A8G165WB-BCTD ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | K4A8G165WC-BCTD | K4A8G165WB-BCRC | MT41K256M16TW-107 | H5TC4G63CFR-PBA | NT5CC256M16CP-DIB1 |
|---|---|---|---|---|---|---|
| Package | 96-ball FBGA | 96-ball FBGA | 96-ball FBGA | 96-ball FBGA | 96-ball FBGA | 96-ball FBGA |
| Brand | Samsung Electronics | Samsung Electronics | Samsung Electronics | Micron Technology | SK Hynix | Nanya Technology |
| Density | 8 Gb | 8 Gb | 8 Gb | 8 Gb | 8 Gb | 8 Gb |
| Organization | 512M x 16 | 512M x 16 | 512M x 16 | 512M x 16 | 512M x 16 | 512M x 16 |
| Supply Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| Operating Temperature | 0°C to +95°C | 0°C to +95°C | 0°C to +95°C | 0°C to +95°C | 0°C to +95°C | 0°C to +95°C |
| RoHS | Compliant | Compliant | Compliant | Compliant | Compliant | Compliant |
关键差异点
- Samsung B-die process （对比 K4A8G165WC-BCTD)
- Wide availability and ecosystem support （对比 MT41K256M16TW-107)
- Proven reliability in high-speed designs （对比 H5TC4G63CFR-PBA)
设计说明
For high-speed DDR4 routing, maintain controlled impedance of 40-50 ohms for DQ/DQS signals and 50-60 ohms for address/control signals. Keep trace lengths matched within +/- 10 mils for each byte lane. Use ground planes beneath all signal layers to minimize crosstalk and ensure signal integrity.
Decouple the VDD pins with 0.1uF and 1uF ceramic capacitors placed as close as possible to the package. Use a 10uF bulk capacitor on the VDD rail. The VREF voltage should be bypassed with a 0.1uF capacitor to ground. Ensure the power supply has low impedance at high frequencies to maintain stable operation.
The K4A8G165WB-BCTD operates up to +95°C TC. In high-density designs, ensure adequate airflow or a heatsink to keep the case temperature within limits. The 96-ball FBGA package has a thermal resistance of approximately 20°C/W (theta_JA), so calculate power dissipation based on your data rate and activity factor.
合规信息
RoHS compliance is assumed based on Samsung's general compliance, but not explicitly stated in the provided data. AEC-Q100 not applicable as this is not an automotive-grade part.
