K4B4G1646D-BPH90 vs W634GU6RB-12 Comparison

Detailed side-by-side comparison of K4B4G1646D-BPH90 by Samsung Electronics and W634GU6RB-12 by Winbond. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Samsung Electronics
K4B4G1646D-BPH90 K4B4G1646D-BPH90 - 4Gb DDR3L SDRAM x16 96FBGA | Samsung

K4B4G1646D-BPH90 - 4Gb DDR3L SDRAM x16 96FBGA | Samsung

K4B4G1646D-BPH90 ✓ Active
Winbond
W634GU6RB-12 W634GU6RB-12 - 4Gb DDR3L SDRAM x16 933MHz | Winbond

W634GU6RB-12 - 4Gb DDR3L SDRAM x16 933MHz | Winbond

W634GU6RB-12 ✓ Active

Specification Comparison

Parameter K4B4G1646D-BPH90 W634GU6RB-12
Brand Samsung Electronics Winbond
Category Memory ICs Memory ICs
Lifecycle Status Active Active
Memory Type DDR3L SDRAM SDRAM - DDR3L
Density 4Gb —
Organization 32M x 16 256M x 16
Number of Banks 8 —
Data Rate 2133 Mb/s per pin 1600 MT/s
Supply Voltage 1.35V (DDR3L) 1.35V
Package 96FBGA 96-VFBGA (7.5x13)
Operating Temperature 0°C to +85°C -40°C to +95°C (12I), -40°C to +105°C (12J)
CAS Latency Programmable up to 14 —
Burst Length 8, 4 (with burst chop) —
On-Die Termination Yes —
ZQ Calibration Yes —
Auto Precharge Yes —
Asynchronous Reset Yes —
Data Mask Yes —
Lead-Free Yes —
Halogen Free Yes Yes
RoHS Compliant Yes —
Memory Size — 4Gbit
Interface — Parallel
Clock Frequency — 933 MHz
Access Time — 20 ns
Speed Grade — DDR3L-1600 (11-11-11)
RoHS — Compliant
Mounting Type — Surface Mount
Number of Pins — 96

Datasheets & Resources

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