MPC870CZT66 vs MPC875ZT66 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci MPC870CZT66 disebabkan oleh NXP Semiconductors dan MPC875ZT66 disebabkan oleh NXP Semiconductors. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | MPC870CZT66 | MPC875ZT66 |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | NRND | Akhir Hidup |
| Core Architecture | Power Architecture (PowerQUICC MPC8xx) | — |
| Core Count | 1 | 1 core |
| Lebar Bus Data | 32-bit | — |
| Frekuensi Klock Maksimum | 66 MHz | 66 MHz |
| Tegangan Pemberi Arus | 3.3 V | 3.3 V |
| Suhu Operasi | -40C to +100C | — |
| Process Technology | 0.18 um CMOS | 0.18 µm |
| Kemasan | 256-PBGA (23x23 mm) | — |
| Jenis Pemasangan | Surface Mount | — |
| Gaya Pemasangan | Tray | — |
| Instruction Set | RISC | — |
| Integrated Peripherals | 10/100 Ethernet MAC, UART, I2C, SPI | — |
| External Memory Bus | Yes (SDRAM/Flash controller) | — |
| Status RoHS | Compliant | [DATA_NEEDED: RoHS status] |
| Aras MSL | 3 (168 hours) | — |
| Processor Type | — | MPC8xx communications processor |
| Architecture | — | Power Architecture |
| Data Width | — | 32-bit |
| Gambaran Suhu Operasi | — | 0 °C to 95 °C |
| Package Type | — | 256-pin PBGA (23 mm x 23 mm) |
| Package Code | — | HBGA |
| Terminal Count | — | 256 |
| Package Shape | — | Square |
| Peak Reflow Temperature | — | 245 °C |
| Application Category | — | Networking and communications applications |
| REACH Status | — | [DATA_NEEDED: REACH status] |
| AEC-Q100 Qualification | — | [DATA_NEEDED: AEC-Q100 qualification status] |
| Lead-Free Status | — | [DATA_NEEDED: lead-free status] |
| Halogen-Free Status | — | [DATA_NEEDED: halogen-free status] |
| Pinout | — | [DATA_NEEDED: complete numbered pinout] |