MPC870CZT66 vs MPC875ZT66 Perbandingan
Perbandingan bersamaan detil MPC870CZT66 dari NXP Semiconductors dan MPC875ZT66 dari NXP Semiconductors. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | MPC870CZT66 | MPC875ZT66 |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | NRND | Akhir Hidup |
| Core Architecture | Power Architecture (PowerQUICC MPC8xx) | — |
| Core Count | 1 | 1 core |
| Lebar Bus Data | 32-bit | — |
| Frekuensi Bawah Maximum | 66 MHz | 66 MHz |
| Tegangan Pemuat | 3.3 V | 3.3 V |
| Suhu Kerja | -40C to +100C | — |
| Process Technology | 0.18 um CMOS | 0.18 µm |
| Paket | 256-PBGA (23x23 mm) | — |
| Tipe Mounting | Surface Mount | — |
| Gaya Mounting | Tray | — |
| Instruction Set | RISC | — |
| Integrated Peripherals | 10/100 Ethernet MAC, UART, I2C, SPI | — |
| External Memory Bus | Yes (SDRAM/Flash controller) | — |
| Status RoHS | Compliant | [DATA_NEEDED: RoHS status] |
| Level MSL | 3 (168 hours) | — |
| Processor Type | — | MPC8xx communications processor |
| Architecture | — | Power Architecture |
| Data Width | — | 32-bit |
| Rentang Suhu Kerja | — | 0 °C to 95 °C |
| Package Type | — | 256-pin PBGA (23 mm x 23 mm) |
| Package Code | — | HBGA |
| Terminal Count | — | 256 |
| Package Shape | — | Square |
| Peak Reflow Temperature | — | 245 °C |
| Application Category | — | Networking and communications applications |
| REACH Status | — | [DATA_NEEDED: REACH status] |
| AEC-Q100 Qualification | — | [DATA_NEEDED: AEC-Q100 qualification status] |
| Lead-Free Status | — | [DATA_NEEDED: lead-free status] |
| Halogen-Free Status | — | [DATA_NEEDED: halogen-free status] |
| Pinout | — | [DATA_NEEDED: complete numbered pinout] |