MPC870CZT66 vs MPC875ZT66 Vergleich
Detaillierter Direktvergleich von MPC870CZT66 von NXP Semiconductors und MPC875ZT66 von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | MPC870CZT66 | MPC875ZT66 |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | NRND | Ende des Lebenszyklus |
| Core Architecture | Power Architecture (PowerQUICC MPC8xx) | — |
| Core Count | 1 | 1 core |
| Datenbusbreite | 32-bit | — |
| Maximale Taktfrequenz | 66 MHz | 66 MHz |
| Versorgungsspannung | 3.3 V | 3.3 V |
| Betriebstemperatur | -40C to +100C | — |
| Process Technology | 0.18 um CMOS | 0.18 µm |
| Gehäuse | 256-PBGA (23x23 mm) | — |
| Montageart | Surface Mount | — |
| Montagestil | Tray | — |
| Instruction Set | RISC | — |
| Integrated Peripherals | 10/100 Ethernet MAC, UART, I2C, SPI | — |
| External Memory Bus | Yes (SDRAM/Flash controller) | — |
| RoHS-Status | Compliant | [DATA_NEEDED: RoHS status] |
| MSL-Level | 3 (168 hours) | — |
| Processor Type | — | MPC8xx communications processor |
| Architecture | — | Power Architecture |
| Data Width | — | 32-bit |
| Betriebstemperaturbereich | — | 0 °C to 95 °C |
| Package Type | — | 256-pin PBGA (23 mm x 23 mm) |
| Package Code | — | HBGA |
| Terminal Count | — | 256 |
| Package Shape | — | Square |
| Peak Reflow Temperature | — | 245 °C |
| Application Category | — | Networking and communications applications |
| REACH Status | — | [DATA_NEEDED: REACH status] |
| AEC-Q100 Qualification | — | [DATA_NEEDED: AEC-Q100 qualification status] |
| Lead-Free Status | — | [DATA_NEEDED: lead-free status] |
| Halogen-Free Status | — | [DATA_NEEDED: halogen-free status] |
| Pinout | — | [DATA_NEEDED: complete numbered pinout] |