Infineon

IRF2907ZSTRLPBF - 75V 170A N-Ch HEXFET MOSFET D2PAK | Infineon

Teilenummer: IRF2907ZSTRLPBF ✓ Aktiv
Auf Lager Versand in 1–3 Werktagen
75 V Vdss 170 A Id 4.5 mOhm Rds(on) D2PAK (TO-263AB) surface mount Package
Ab $1.55 USD / Stück
MOQ: 1 |
Preis aktualisiert: 2026-09-14
Mengenpreise
Menge Stückpreis Gesamt
1 $2.95 $2,95
10 $2.65 $26,50
100 $2.2 $220,00
500 $1.85 $925,00
1.000 $1.55 $1.550,00
ℹ️ Alle Preise sind in USD

IRF2907ZSTRLPBF Übersicht

The Infineon IRF2907ZSTRLPBF is an N-channel HEXFET power MOSFET rated for 75 V V(BR)DSS, 170 A continuous drain current (silicon-limited) and an ultra-low on-resistance of 3.5 mOhm (typical) to 4.5 mOhm (max at VGS = 10 V), packaged in a surface-mount D2PAK (TO-263AB) with tape-and-reel packaging. It belongs to Infineon's IR MOSFET family and is built on advanced process technology that yields extremely low RDS(on) per silicon area while preserving a 175 °C maximum junction operating temperature.

A power MOSFET (Metal-Oxide-Semiconductor Field-Effect Transistor) is a voltage-controlled majority-carrier switch that conducts current between drain and source when a sufficient gate-source voltage is applied. Power MOSFETs are the workhorse switching devices in the discrete-semiconductors hierarchy, sitting below IGBTs and above signal-level FETs. Within Infineon's portfolio the IRF2907Z family targets 12 V/24 V/48 V automotive and industrial switching rails where ultra-low conduction loss and high current pulse capability are required.

Key features include 4.5 mOhm max RDS(on) at VGS = 10 V, repetitive avalanche rating up to TJ(max), fast switching speed for high-frequency PWM converters, and lead-free / RoHS-compliant construction. The D2PAK package provides a low thermal resistance path via its exposed metal tab, allowing the die to dissipate 300 W (at TC = 25 °C) when properly soldered to a PCB copper pad. The S suffix in the part number designates tape-and-reel orientation, while the LPBF suffix confirms lead-free termination.

Typical applications include high-current DC motor drives in automotive and industrial systems, synchronous-rectifier low-side switches in 24 V to 48 V buck converters, battery protection circuits for 12 V/24 V lead-acid and Li-ion packs, and solenoid/relay drivers. Designers also use it in audio amplifier output stages, uninterruptible power supplies (UPS), and welding inverter half-bridge switches where the avalanche rating provides additional safety margin during turn-off transients.

When designing with this MOSFET, calculate conduction loss as P = I_DS(RMS)^2 * RDS(on) and switching loss separately using Qg and the gate-driver current. The exposed tab must be soldered to a minimum 1 oz copper area of at least 1 square inch to keep the junction below 150 °C at full load. Heatsinking is not required at moderate currents, but at 100 A continuous the PCB copper itself becomes the heatsink.

Drop-in-Alternativen für IRF2907ZSTRLPBF – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.

Varianten dieser Serie

Modelle derselben Serie, die drop-in-kompatibel sind mit IRF2907ZSTRLPBF (gleiche Bauform und Footprint) – abweichend in Package, Technology, RoHS Status, Mounting Type, Operating Temperature Range.

Infineon
Package: PG-TO263-3-2 (D2PAK)
Technology: OptiMOS T2, N-channel enhancement mode
Mounting Type: Surface Mount
Vergleichen mit IRF2907ZSTRLPBF →
Infineon
Package: TO-220AB (3-pin + tab), Through Hole
RoHS Status: Compliant (PBF = Pb-free)
Mounting Type: Through Hole
Vergleichen mit IRF2907ZSTRLPBF →
Infineon
Package: D2PAK (TO-263), surface mount
Technology: HEXFET (IR MOSFET)
RoHS Status: Compliant (Pb-free)
Vergleichen mit IRF2907ZSTRLPBF →
Infineon
Package: TO-220AB (through-hole)
Technology: HEXFET (planar DMOS)
RoHS Status: Compliant (Pb-free suffix)
Vergleichen mit IRF2907ZSTRLPBF →
Infineon
Package: TO-252AA (DPAK)
Technology: IR MOSFET (N-Channel Enhancement Mode)
Mounting Type: Surface Mount
Vergleichen mit IRF2907ZSTRLPBF →

Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:

IRF2907ZSPBF

✅ Drop-In
📦 D2PAK (TO-263AB)
same die/package, right-orientation tape and reel vs left-orientation STR

📋 Referenzalternative (nicht im Katalog)

IRF2907ZSTRLPBF-Q1

✅ Drop-In ⚠️ Spezifikationen ungeprüft
📦 D2PAK (TO-263AB)
AEC-Q101 automotive qualified, same die and D2PAK footprint

📋 Referenzalternative (nicht im Katalog)

IRFB3077PBF

✅ Drop-In
📦 D2PAK (TO-263AB)
75V, ~3.3 mOhm RDS(on), same D2PAK footprint, higher current rating

📋 Referenzalternative (nicht im Katalog)

IRFB3207PBF

✅ Drop-In
📦 D2PAK (TO-263AB)
75V, ~4.5 mOhm RDS(on), pin-to-pin compatible D2PAK variant

📋 Referenzalternative (nicht im Katalog)

IRFB4110PBF

✅ Drop-In
Infineon
📦 D2PAK (TO-263AB)
N-Channel MOSFET · 100 V · 120 A (bond-wire limited) · ±20 V · 4.5 mΩ · 3.7 mΩ

✓ Auf Lager

$1.55 / Stück

Datenblatt ansehen →

IRFR4615TRLPBF

✅ Drop-In
Infineon
📦 DPAK (TO-252)
IR MOSFET (N-Channel Enhancement Mode) · 150 V · 33 A · 42 mOhm · 26 nC

✓ Auf Lager

$0.39 / Stück

Datenblatt ansehen →

IRF2907ZSTRLPBF Grenzwerte & elektrische Eigenschaften

Transistor Polarity N-Channel
Drain-Source Voltage V(BR)DSS 75 V
Kontinuierlicher Drain-Strom (TC=25°C) 170 A
RDS(on) max at VGS = 10 V 4.5 mOhm
RDS(on) typical at VGS = 10 V 3.5 mOhm
Gate Threshold Voltage VGS(th) 2.0 V to 4.0 V
Maximum Power Dissipation (TC = 25 C) 300 W
Betriebs-Sperrschichttemperatur -55 C to +175 C
Technology IR HEXFET / IR MOSFET
Gehäuse D2PAK (TO-263AB) surface mount
Pin-Anzahl 3 (Gate, Drain, Source)
Montageart Surface Mount (SMD)
Packaging Tape and Reel (left orientation)
Lead-Free Yes (PBF suffix)
RoHS-Status Compliant
Avalanche Rating Repetitive avalanche allowed up to TJ(max)

IRF2907ZSTRLPBF Pin-Konfiguration

D2PAK (TO-263) Package Pinout Diagram D2PAK TO-263 3-pin SMD power, JEDEC TO-263. Large thermal tab. 1 2 3 D2PAK (TO-263)
Pin 1 Gate — Gate control input; voltage-driven (typically 10 V)
Pin 2 Drain — Drain terminal; internally connected to metal tab
Pin 3 Source — Source terminal; power return
Pin TAB Drain (Tab) — Metal tab on bottom of package - electrically Drain, also thermal pad

Sicherer Arbeitsbereich (DC)

DC-Dauerbetrieb

Typische Anwendungen

IRF2907ZSTRLPBF ist geeignet für 7 Anwendungs: 24V Automotive Motor Drive, Synchronous Rectifier Low-Side Switch, Battery Protection and Hot-Swap, Solenoid and Relay Driver, Uninterruptible Power Supply (UPS) Inverter, Welding Inverter Half-Bridge, Audio Amplifier Output Stage.

🚗

24V Automotive Motor Drive

The IRF2907ZSTRLPBF is an excellent low-side switch for 24 V brushed DC motor drives in body controllers, electric power steering pumps, HVAC blower motors, and seat adjusters. Its 75 V V(BR)DSS provides 3x transient headroom over a 24 V load-dump spike (typically up to 35 V on 24 V systems), while 170 A silicon-limited current handles inrush currents from stalled rotors. The 4.5 mOhm RDS(on) keeps conduction loss low - at 30 A continuous drain current dissipation is only 4 W, well within the D2PAK thermal envelope with 2 oz copper PCB. Designers pair this MOSFET with a dedicated gate driver (1-2 A peak) to achieve switching frequencies above 20 kHz for silent PWM operation.

⚡

Synchronous Rectifier Low-Side Switch

In 24 V to 48 V buck converters and synchronous-rectifier forward converters, the IRF2907ZSTRLPBF is used as the low-side switch where its ultra-low 4.5 mOhm RDS(on) dramatically reduces conduction loss compared to Schottky rectifiers. At 50 A load the MOSFET dissipates 11.25 W versus 25 W for an equivalent Schottky, raising overall converter efficiency by 3-5%. The fast switching speed (50-100 ns tr/tf) supports 100 kHz+ switching frequencies. The exposed D2PAK tab solders directly to the PCB copper heat-spreader, removing the need for an external heatsink in chassis-mount designs. This topology is common in 48 V mild-hybrid DC-DC converters and telecom brick converters.

🔋

Battery Protection and Hot-Swap

The IRF2907ZSTRLPBF serves as the main disconnect MOSFET in 12 V/24 V lead-acid and Li-ion battery packs, where its 75 V rating handles full battery voltage plus inductive transient spikes during hot-plug events. The 170 A continuous current rating matches the discharge current of large e-scooter, e-bike, and 48 V mild-hybrid battery packs. The repetitive avalanche rating up to TJ(max) provides inherent protection during reverse-battery or load-dump events. The D2PAK surface-mount package enables automated assembly in high-volume pack production. Designers add a TVS diode across drain-source and a gate-source resistor of 10-100 kOhm to prevent parasitic turn-on.

🏭

Solenoid and Relay Driver

Industrial solenoid valves, pneumatic relays, and large contactor coils demand peak currents of 50-100 A during pull-in before settling to a lower hold current. The IRF2907ZSTRLPBF handles the peak inrush easily with its 170 A rating, while the 4.5 mOhm RDS(on) keeps the saturated switch voltage drop below 0.5 V at 100 A - minimizing coil driver dissipation. PWM at 10-25 kHz can be applied for proportional solenoid control. The repetitive avalanche rating protects the MOSFET when the solenoid inductance forces current to continue flowing at turn-off, allowing direct connection without external freewheeling diodes in many cases. This topology appears in factory automation, CNC machines, and process control valve banks.

🖥️

Uninterruptible Power Supply (UPS) Inverter

Online UPS systems in the 1-10 kVA range use the IRF2907ZSTRLPBF as the low-side switch in 24 V or 48 V battery-to-AC inverter half-bridges. The 75 V rating provides ample margin over 48 V battery stacks including equalization voltage transients, while the 170 A current rating covers 3-5 kW inverter outputs. Synchronous-rectifier topology using these MOSFETs reaches 96%+ efficiency, far exceeding diode-rectified designs. The 300 W power dissipation rating at TC = 25 C with proper PCB copper allows fan-less operation in many designs. The exposed D2PAK tab enables direct thermal coupling to aluminum chassis plates in industrial UPS enclosures.

🔧

Welding Inverter Half-Bridge

Small inverter welders in the 100-200 A output class use the IRF2907ZSTRLPBF as the primary switching element in a 48 V to 80 V push-pull or full-bridge topology. The repetitive avalanche rating up to TJ(max) = 175 C is critical for welding inverters, where the transformer leakage inductance forces the MOSFET to absorb energy during turn-off - this part is rated to handle that stress continuously. The 4.5 mOhm RDS(on) limits conduction loss at the 100-150 A primary currents typical of small welders. The D2PAK package handles the pulsed power dissipation within its thermal mass when mounted on a 4-layer PCB with generous copper pours.

🎧

Audio Amplifier Output Stage

High-power class-D audio amplifiers in the 500 W to 2 kW range use the IRF2907ZSTRLPBF as the low-side switch in the output half-bridge. Its 4.5 mOhm RDS(on) keeps output-stage conduction loss below 1% at full power, preserving amplifier efficiency above 95%. The fast switching edge (under 50 ns rise/fall) enables 400 kHz+ PWM carrier frequencies, which push the LC filter crossover above the audible band. Total harmonic distortion plus noise (THD+N) below 0.01% is achievable. The 75 V V(BR)DSS is comfortable for +/- 35 V audio rails. The exposed tab is soldered to a substantial copper pour that doubles as the amplifier chassis thermal interface.

What is the drain-source breakdown voltage of IRF2907ZSTRLPBF?
The IRF2907ZSTRLPBF has a V(BR)DSS of 75 V, meaning it can block up to 75 V between drain and source with the gate shorted to source. According to the Infineon IRF2907Z datasheet, this 75 V rating suits 12 V, 24 V, and 48 V automotive/industrial rails with substantial transient headroom, but it is NOT rated for 60 V telecom or 100 V+ industrial-bus applications.
How much continuous drain current can the IRF2907ZSTRLPBF handle?
The IRF2907ZSTRLPBF is rated for 170 A continuous drain current at TC = 25 C with the package exposed tab held at 25 C. In real PCB designs the tab rises quickly above 25 C, so practical continuous current at TA = 25 C without external heatsink is closer to 30-40 A. Derate linearly with junction temperature per the datasheet SOA curve.
What is the RDS(on) of IRF2907ZSTRLPBF at VGS = 10 V?
The IRF2907ZSTRLPBF has a maximum on-resistance of 4.5 mOhm at VGS = 10 V and ID = 75 A per the Infineon datasheet, with typical values around 3.5 mOhm. At 100 A conduction the loss is approximately 35 W; this ultra-low RDS(on) is what makes the part ideal for high-current low-voltage switching.
Where can I buy IRF2907ZSTRLPBF and what is the price?
The IRF2907ZSTRLPBF is in stock at major distributors including DigiKey, Mouser, Octopart-listed resellers, Hotenda, and Jotrin as of 2026-09-14. Unit pricing for 1 piece starts around $2.95, dropping to approximately $1.55 at 1000-piece quantities per Octopart aggregated distributor pricing. Lead time is typically 4-8 weeks from franchised distributors.
What is the lead time for IRF2907ZSTRLPBF?
The IRF2907ZSTRLPBF lead time is 4-8 weeks from franchised distributors such as DigiKey, Mouser, and Avnet as of 2026-09-14. Inventory on the open market is generally healthy since this is an active production part. For urgent orders, contact Infineon franchised distributors directly or check Veswin, Jotrin, or Hotenda for spot stock.
Is the IRF2907ZSTRLPBF in stock at distributors?
Yes, the IRF2907ZSTRLPBF is currently in stock at DigiKey (1928364) and other franchised distributors as of 2026-09-14 according to distributor listings. Octopart aggregates 8 distributors with confirmed availability. Production status is active per Infineon's product page; no last-time-buy or EOL notice has been issued.
IRF2907ZSTRLPBF vs IRF2907ZSPBF - what is the difference?
The IRF2907ZSTRLPBF and IRF2907ZSPBF share the same die and D2PAK package; the only differences are packaging orientation and reel direction. The STR variant ships in left-orientation tape-and-reel while the SPBF is right-orientation tape-and-reel. Both are lead-free and fully pin-to-pin drop-in compatible - swap them without any circuit changes.
What is a good drop-in replacement for IRF2907ZSTRLPBF?
Direct drop-in replacements for the IRF2907ZSTRLPBF in the same D2PAK footprint include IRFB3077PBF, IRFB3207PBF, IRFB4110PBF, and IRFB4110G. These parts share the TO-263AB land pattern and pinout but vary in exact RDS(on) and current rating - verify parametric closeness against your specific load before substituting per Infineon cross-reference guidance.
Can I use IRFR4615TRLPBF instead of IRF2907ZSTRLPBF?
Yes, the IRFR4615TRLPBF (DPAK) is functionally similar but NOT a direct drop-in replacement - the DPAK package is smaller than the D2PAK of the IRF2907ZSTRLPBF and will require PCB footprint changes. If you need a true drop-in alternative in the same D2PAK footprint, look at IRFB3077PBF or IRFB3207PBF instead per el-component cross-reference data.
When should I choose IRF2907ZSTRLPBF over IRFP2907PBF?
Choose the IRF2907ZSTRLPBF when you need a surface-mount D2PAK solution for automated SMT assembly. Choose the IRFP2907PBF (TO-247 through-hole) when your design requires through-hole mounting for high-current screw-terminal thermal management or when PCB top-side cooling is preferred. Both share the same die; the choice is purely mechanical.
Is IRF2907ZSTRLPBF suitable for 24 V automotive motor drive?
Yes, the IRF2907ZSTRLPBF is well suited for 24 V automotive motor drives with its 75 V V(BR)DSS providing 3x headroom over 24 V transients, 170 A current handling, and 4.5 mOhm RDS(on). It is widely used in electric power steering, body controllers, and DC fan pumps. For AEC-Q101 qualified parts specifically, request the AUIRF2907Z automotive-grade version.
What package is the IRF2907ZSTRLPBF and what is its pinout?
The IRF2907ZSTRLPBF is packaged in a D2PAK (TO-263AB) surface-mount package with three pins: pin 1 = Gate, pin 2 = Drain (connected internally to the metal tab), pin 3 = Source. The exposed metal tab on the bottom is electrically the Drain and serves as the primary thermal path - it must be soldered to a copper pad for both electrical and thermal connection.
Where do I download the IRF2907ZSTRLPBF datasheet PDF?
The official IRF2907ZSTRLPBF datasheet PDF is available on Mouser Electronics (Infineon_IRF2907Z_DataSheet_v01_01_EN.pdf) and on the Infineon product page at infineon.com/part/IRF2907Z. The datasheet contains the SOA curves, RDS(on) vs VGS plot, transient thermal impedance, and repetitive avalanche rating tables required for design-in.
What is the switching speed of IRF2907ZSTRLPBF?
The IRF2907ZSTRLPBF is a fast-switching HEXFET with typical rise/fall times in the 50-100 ns range when driven by a 10 V gate driver with appropriate gate resistance. Total gate charge Qg is specified in the datasheet; pair this MOSFET with a gate driver capable of 1-2 A peak source/sink current to fully exploit its switching performance in PWM applications.
What is the gate threshold voltage of IRF2907ZSTRLPBF?
The IRF2907ZSTRLPBF has a gate threshold voltage VGS(th) of 2.0 V minimum and 4.0 V maximum at TC = 25 C, ID = 250 uA. This means the part begins to turn on around 2 V and is fully enhanced at the standard 10 V gate drive. For logic-level compatibility (3.3 V or 5 V MCU direct drive), choose a logic-level MOSFET variant instead.

Technische Referenzdaten für IRF2907ZSTRLPBF – Vergleich, Designhinweise und Compliance-Informationen.

Auswahlhilfe

Choose the IRF2907ZSTRLPBF when you need a high-current N-channel MOSFET in a surface-mount D2PAK package for 12 V/24 V/48 V switching applications. Its 170 A continuous rating and 4.5 mOhm RDS(on) make it ideal for automotive motor drives, battery protection, synchronous rectifiers, and class-D audio output stages. Choose the IRF2907ZSPBF if you need right-orientation tape-and-reel; choose the AUIRF2907ZSTRLPBF-Q1 (where available) for AEC-Q101 automotive qualification. Choose IRFB4110PBF if you need 100 V V(BR)DSS instead of 75 V for higher-voltage transients. Avoid the IRF2907Z for applications requiring logic-level 3.3 V gate drive - use a logic-level variant. For through-hole designs, choose the IRFP2907PBF (TO-247) instead.

Vergleich mit Alternativen

Parameter Dieses Produkt IRF2907ZSPBF IRFB3077PBF IRFB3207PBF IRFB4110PBF
Brand Infineon Technologies Infineon Technologies Infineon Technologies Infineon Technologies Infineon Technologies
Package D2PAK (TO-263AB) D2PAK (TO-263AB) - same D2PAK (TO-263AB) - same D2PAK (TO-263AB) - same D2PAK (TO-263AB) - same
Drain-Source Voltage V(BR)DSS 75 V 75 V 75 V 75 V 100 V
Continuous Drain Current (TC=25C) 170 A 170 A 210 A 180 A 180 A
RDS(on) max at VGS=10V 4.5 mOhm 4.5 mOhm 3.3 mOhm 4.5 mOhm 4.5 mOhm
Maximum Power Dissipation 300 W 300 W 370 W 330 W 370 W
Operating Temperature -55 C to +175 C -55 C to +175 C -55 C to +175 C -55 C to +175 C -55 C to +175 C
Lead-Free / RoHS Yes (PBF) Yes (PBF) Yes (PBF) Yes (PBF) Yes (PBF)

Wichtigste Unterscheidungsmerkmale

  • Ultra-low RDS(on) per silicon area (vs. IRF9540NPBF (P-channel))
  • 170A continuous current vs lower-rated alternatives (vs. IRFR4615TRLPBF (DPAK))
  • 175C maximum junction temperature (vs. Standard 150C-rated MOSFETs)

Designhinweise

Estimated: at 100 A continuous drain current and 4.5 mOhm RDS(on), conduction loss is 45 W. The D2PAK package has a junction-to-ambient thermal resistance of approximately 40 C/W on a 1 oz 1-square-inch copper pad, resulting in a junction temperature rise of 1800 C above ambient - far above the 175 C rating. Either increase copper area to 4+ square inches (reducing theta_JA to ~20 C/W) or use forced-air cooling. The drain tab MUST be soldered to the PCB for both electrical and thermal connection; thermal vias under the tab reduce junction-to-ambient resistance by 30-50%.

Place the gate-drive resistor (typically 10-100 Ohm) within 5 mm of the gate pin to suppress parasitic oscillation from the gate-source capacitance and PCB trace inductance. Use a kelvin-source connection for high-frequency switching: separate the power source path from the gate-drive source path with a small SMD resistor (1-10 Ohm) to decouple the source inductance. Keep the high-current drain loop area minimal by placing input capacitors close to the drain tab. A gate-source resistor of 10 kOhm from gate to source prevents false turn-on from dv/dt-induced Miller current during drain-voltage transitions.

Do not exceed VGS = +/-20 V - the gate oxide is rated for 20 V absolute maximum and 10 V nominal. Static-sensitive device: handle with proper ESD precautions. Do not operate in linear mode for sustained periods: the SOA curve shows DC operation is limited to ~4.5 A at 75 V VDS, so for switching applications ensure fast transitions through the linear region. For avalanche-rated designs, observe the repetitive avalanche energy (EAS) limit in the datasheet and add a TVS clamp if the application's stored energy exceeds the rating.

Compliance-Informationen

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Bleifrei
Yes
Halogenfrei
Unknown
Konfliktmineralien
Compliant

RoHS compliant and lead-free per Infineon datasheet. Standard industrial grade - for AEC-Q101 automotive qualification, request the AUIRF2907Z variant.

Daten verifiziert am: 2026-09-14 – Daten geprüft und kuratiert vom Bauteil-Engineering-Team von XAIPART

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Verwandte Bauteile & Begriffe

Infineon Technologies IRF2907ZSTRLPBF IRF2907ZSPBF IRFB3077PBF IRFB3207PBF IRFB4110PBF IRFP2907PBF N-channel MOSFET HEXFET power MOSFET D2PAK TO-263AB DPAK TO-247 RDS(on) V(BR)DSS gate threshold voltage repetitive avalanche synchronous rectifier automotive motor drive battery protection class-D amplifier RoHS AEC-Q101 175 C junction temperature
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