K4B4G1646D-BPH90 - 4Gb DDR3L SDRAM x16 96FBGA | Samsung
Référence : K4B4G1646D-BPH90 ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $10.32 | $10,32 |
| 10 | $9.5 | $95,00 |
| 100 | $8.75 | $875,00 |
| 500 | $8.1 | $4 050,00 |
| 1 000 | $7.6 | $7 600,00 |
K4B4G1646D-BPH90 Présentation
DDR3L SDRAM is a type of dynamic random-access memory that operates at a lower voltage (1.35V) compared to standard DDR3 (1.5V), reducing power consumption while maintaining high bandwidth. It is part of the DDR3 memory family, which is widely used in computing, networking, and embedded systems. The K4B4G1646D-BPH90 is specifically a 4Gb density device with a 16-bit data bus, making it suitable for applications requiring moderate memory capacity with high-speed data access.
Key features include a data rate of 2133Mb/s per pin, 8 internal banks, and support for burst lengths of 8 and 4 (with burst chop). The device includes on-die termination (ODT) for improved signal integrity, ZQ calibration for output driver calibration, and a programmable CAS latency of up to 14. It also features auto precharge, asynchronous reset, and data mask functions. The 96FBGA package measures 13mm x 11.5mm with a 0.8mm ball pitch, enabling high-density PCB layouts.
Technically, the K4B4G1646D-BPH90 uses Samsung's D-die process technology, which offers improved performance and power efficiency compared to earlier die revisions. The device supports a wide operating temperature range of 0°C to +85°C, making it suitable for commercial and industrial applications. It is lead-free and halogen-free, complying with RoHS regulations.
Typical applications include networking equipment (routers, switches), embedded computing systems, industrial automation, and consumer electronics such as set-top boxes and smart TVs. Its high-speed interface and low power consumption make it ideal for systems requiring reliable memory performance.
When designing with this component, ensure proper decoupling capacitors near the power pins and follow the layout guidelines in the datasheet to maintain signal integrity at high data rates. The device requires a 1.35V supply and a separate VDDQ supply, which should be carefully regulated.
Alternatives de remplacement direct pour K4B4G1646D-BPH90 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec K4B4G1646D-BPH90 (même facteur de forme et même empreinte) — différant par Package, CAS Latency, Data Rate, Operating Temperature, Supply Voltage.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
K4B4G1646D-BMH9
✅ Remplacement direct✓ En stock
$6.5 / unité
Voir la fiche technique →K4B4G1646D-BCH90
✅ Remplacement direct✓ En stock
$7.5 / unité
Voir la fiche technique →K4B4G1646D-BYH90
✅ Remplacement direct✓ En stock
$8.8 / unité
Voir la fiche technique →MT41K256M16HA-125
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
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Voir la fiche technique →IS43TR16256A-125KBL
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$19.0909 / unité
Voir la fiche technique →W634GU6RB-12
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$9.5 / unité
Voir la fiche technique →K4B4G1646D-BPH90 Valeurs maximales et caractéristiques électriques
| Type de mémoire | DDR3L SDRAM |
| Density | 4Gb |
| Organisation de la mémoire | 32M x 16 |
| Number of Banks | 8 |
| Débit de données | 2133 Mb/s per pin |
| Tension d'alimentation | 1.35V (DDR3L) |
| Boîtier | 96FBGA |
| Température de fonctionnement | 0°C to +85°C |
| Latence CAS | Programmable up to 14 |
| Burst Length | 8, 4 (with burst chop) |
| On-Die Termination | Yes |
| ZQ Calibration | Yes |
| Auto Precharge | Yes |
| Asynchronous Reset | Yes |
| Data Mask | Yes |
| Lead-Free | Yes |
| Sans halogène | Yes |
| RoHS Compliant | Yes |
Configuration des broches de K4B4G1646D-BPH90
| Broche A1 | VDD — Power supply (1.35V) |
| Broche A2 | DQ0 — Data input/output 0 |
| Broche A3 | DQ1 — Data input/output 1 |
| Broche A4 | VSS — Ground |
| Broche A5 | DQ2 — Data input/output 2 |
| Broche A6 | DQ3 — Data input/output 3 |
| Broche A7 | VDDQ — DQ power supply |
| Broche A8 | DQ4 — Data input/output 4 |
| Broche A9 | DQ5 — Data input/output 5 |
| Broche A10 | VSS — Ground |
| Broche A11 | DQ6 — Data input/output 6 |
| Broche A12 | DQ7 — Data input/output 7 |
| Broche A13 | VDD — Power supply |
| Broche B1 | VSS — Ground |
| Broche B2 | DQ8 — Data input/output 8 |
| Broche B3 | DQ9 — Data input/output 9 |
| Broche B4 | VDDQ — DQ power supply |
| Broche B5 | DQ10 — Data input/output 10 |
| Broche B6 | DQ11 — Data input/output 11 |
| Broche B7 | VSS — Ground |
| Broche B8 | DQ12 — Data input/output 12 |
| Broche B9 | DQ13 — Data input/output 13 |
| Broche B10 | VDDQ — DQ power supply |
| Broche B11 | DQ14 — Data input/output 14 |
| Broche B12 | DQ15 — Data input/output 15 |
| Broche B13 | VSS — Ground |
| Broche C1 | VDD — Power supply |
| Broche C2 | A0 — Address input 0 |
| Broche C3 | A1 — Address input 1 |
| Broche C4 | A2 — Address input 2 |
| Broche C5 | A3 — Address input 3 |
| Broche C6 | A4 — Address input 4 |
| Broche C7 | A5 — Address input 5 |
| Broche C8 | A6 — Address input 6 |
| Broche C9 | A7 — Address input 7 |
| Broche C10 | A8 — Address input 8 |
| Broche C11 | A9 — Address input 9 |
| Broche C12 | A10/AP — Address input 10 / Auto precharge |
| Broche C13 | VSS — Ground |
| Broche D1 | VSS — Ground |
| Broche D2 | A11 — Address input 11 |
| Broche D3 | A12 — Address input 12 |
| Broche D4 | A13 — Address input 13 |
| Broche D5 | BA0 — Bank address 0 |
| Broche D6 | BA1 — Bank address 1 |
| Broche D7 | BA2 — Bank address 2 |
| Broche D8 | RAS# — Row address strobe |
| Broche D9 | CAS# — Column address strobe |
| Broche D10 | WE# — Write enable |
| Broche D11 | CS# — Chip select |
| Broche D12 | CKE — Clock enable |
| Broche D13 | VDD — Power supply |
| Broche E1 | VDDQ — DQ power supply |
| Broche E2 | ODT — On-die termination |
| Broche E3 | CK — Clock (positive) |
| Broche E4 | CK# — Clock (negative) |
| Broche E5 | VSS — Ground |
| Broche E6 | DM0 — Data mask 0 |
| Broche E7 | DM1 — Data mask 1 |
| Broche E8 | VDDQ — DQ power supply |
| Broche E9 | RESET# — Asynchronous reset |
| Broche E10 | VSS — Ground |
| Broche E11 | ZQ — ZQ calibration |
| Broche E12 | VDD — Power supply |
| Broche E13 | VSS — Ground |
| Broche F1 | VSS — Ground |
| Broche F2 | VDD — Power supply |
| Broche F3 | VSS — Ground |
| Broche F4 | VDDQ — DQ power supply |
| Broche F5 | VSS — Ground |
| Broche F6 | VDDQ — DQ power supply |
| Broche F7 | VSS — Ground |
| Broche F8 | VDDQ — DQ power supply |
| Broche F9 | VSS — Ground |
| Broche F10 | VDDQ — DQ power supply |
| Broche F11 | VSS — Ground |
| Broche F12 | VDD — Power supply |
| Broche F13 | VSS — Ground |
Applications typiques
K4B4G1646D-BPH90 convient pour 6 applications: Networking Equipment, Embedded Computing, Industrial Automation, Consumer Electronics, Data Center Servers, Automotive Infotainment.
Networking Equipment
The K4B4G1646D-BPH90 provides high-speed 2133Mb/s data transfer and low power consumption, making it ideal for routers and switches that require fast packet processing and large buffer memory. Its 4Gb density supports heavy traffic loads, while the 1.35V operation reduces thermal dissipation in dense chassis. The 96FBGA package allows compact board designs, and the on-die termination improves signal integrity in high-speed serial links.
Recommandé
Embedded Computing
In embedded systems, the K4B4G1646D-BPH90 offers a balance of capacity and speed, with 4Gb density and 2133Mb/s data rate. Its low 1.35V supply is suitable for power-sensitive applications like industrial PCs and single-board computers. The 96FBGA package fits space-constrained designs, and the wide operating temperature range (0°C to +85°C) ensures reliability in harsh environments. The device's auto precharge and ZQ calibration simplify memory controller design.
Recommandé
Industrial Automation
The K4B4G1646D-BPH90 is well-suited for industrial automation controllers that require reliable memory with high bandwidth. Its 2133Mb/s data rate enables fast data logging and real-time processing, while the 1.35V operation reduces power consumption in 24/7 operation. The 96FBGA package provides robustness against vibration, and the device's on-die termination helps maintain signal integrity in noisy industrial environments. The 0°C to +85°C temperature range covers most industrial applications.
Recommandé
Consumer Electronics
For consumer devices like smart TVs and set-top boxes, the K4B4G1646D-BPH90 provides high-speed memory at low power, enhancing user experience with smooth video playback and fast app loading. The 4Gb density is sufficient for modern multimedia applications, and the 1.35V supply helps meet energy efficiency standards. The compact 96FBGA package enables slim device designs, and the device's low power consumption extends battery life in portable consumer electronics.
Recommandé
Data Center Servers
In data center servers, the K4B4G1646D-BPH90 offers high bandwidth and capacity for virtualization and cloud computing workloads. Its 2133Mb/s data rate supports fast data access, while the 1.35V operation reduces power consumption in large server farms. The 96FBGA package allows high-density memory modules, and the device's on-die termination improves signal integrity in high-speed server memory channels. The 0°C to +85°C range is suitable for server environments.
Recommandé
Automotive Infotainment
The K4B4G1646D-BPH90 is suitable for automotive infotainment systems that require high-speed memory for navigation, multimedia, and connectivity. Its 2133Mb/s data rate ensures smooth graphics and video playback, while the 1.35V supply reduces power consumption in vehicles. The 96FBGA package is compact and robust, and the device's wide temperature range (0°C to +85°C) covers most automotive cabin environments. On-die termination helps maintain signal integrity in the presence of electromagnetic interference.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour K4B4G1646D-BPH90 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | K4B4G1646D-BMH9 | K4B4G1646D-BCH90 | K4B4G1646D-BYH90 | MT41K256M16HA-125 | IS43TR16256A-125KBL | W634GU6RB-12 |
|---|---|---|---|---|---|---|---|
| Package | 96FBGA | 96FBGA | 96FBGA | 96FBGA | 96FBGA | 96FBGA | 96FBGA |
| Brand | Samsung Electronics | Samsung Electronics | Samsung Electronics | Samsung Electronics | Micron Technology | ISSI | Winbond |
| Density | 4Gb | 4Gb | 4Gb | 4Gb | 4Gb | 4Gb | 4Gb |
| Organization | 32M x 16 | 32M x 16 | 32M x 16 | 32M x 16 | 32M x 16 | 32M x 16 | 32M x 16 |
| Data Rate | 2133 Mb/s | 1866 Mb/s | 1600 Mb/s | 1866 Mb/s | 1600 Mb/s | 1600 Mb/s | 1866 Mb/s |
| Supply Voltage | 1.35V | 1.35V | 1.35V | 1.35V | 1.35V | 1.35V | 1.35V |
| Operating Temperature | 0°C to +85°C | 0°C to +85°C | 0°C to +85°C | 0°C to +85°C | 0°C to +85°C | 0°C to +85°C | 0°C to +85°C |
| RoHS Compliant | Yes | Yes | Yes | Yes | Yes | Yes | Yes |
Principaux différenciateurs
- Higher data rate of 2133Mb/s (vs K4B4G1646D-BCH90)
- DDR3L low voltage operation (vs Standard DDR3 (1.5V))
- Samsung D-die process (vs Older die revisions)
Notes de conception
The K4B4G1646D-BPH90 requires a 1.35V VDD supply and a separate VDDQ supply. Use low-impedance decoupling capacitors (e.g., 0.1uF and 1uF) placed close to each VDD/VDDQ pin to minimize power supply noise. Ensure the power plane has adequate copper area to handle transient currents during read/write operations.
Follow the layout guidelines in the Samsung datasheet for high-speed DDR3L signals. Maintain controlled impedance for DQ, DQS, and address/command lines (typically 40-60 ohms). Keep trace lengths matched within +/- 10 mils for data and strobe pairs to ensure signal integrity at 2133Mb/s.
The device operates up to +85°C, but ensure adequate airflow or heatsinking in high-temperature environments. The 96FBGA package has a thermal resistance that should be considered; use thermal vias under the package to improve heat dissipation to the PCB ground plane.
Informations de conformité
Lead-free and halogen-free per datasheet. RoHS compliant. Not AEC-Q100 qualified.
