NT5CC256M16DP-FLNA - 4Gb DDR3L SDRAM | Nanya Technology
Référence : NT5CC256M16DP-FLNA ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $29.81 | $29,81 |
| 10 | $27.5 | $275,00 |
| 100 | $25 | $2 500,00 |
| 500 | $22 | $11 000,00 |
| 1 000 | $20 | $20 000,00 |
NT5CC256M16DP-FLNA Présentation
DDR3L SDRAM is a type of dynamic random-access memory that operates at a lower voltage (1.35V) compared to standard DDR3 (1.5V), reducing power consumption by up to 20% while maintaining similar performance. It is part of the DDR3 memory family, which uses double data rate architecture to transfer data on both edges of the clock signal, achieving high data rates. DDR3L is commonly used in mobile devices, embedded systems, and industrial applications where power efficiency is critical.
Key features include a 16-bit data bus, 8 internal banks, programmable CAS latency (CL 11, 12, 13), burst lengths of 8 and 4 (with burst chop), on-die termination (ODT) for signal integrity, and ZQ calibration for improved timing. The device supports auto self-refresh, auto precharge, and write leveling, ensuring robust operation in various system conditions. It also includes a data mask function and asynchronous reset for enhanced control.
The NT5CC256M16DP-FLNA utilizes advanced CMOS technology, achieving low power consumption and high reliability. The 96-ball BGA package provides excellent thermal and electrical performance, with a thermal resistance of and operating temperature range of -40°C to +95°C (industrial) and -40°C to +105°C (automotive). The device is RoHS compliant and lead-free.
Typical applications include networking equipment (routers, switches), industrial automation, automotive infotainment and ADAS, and embedded computing systems. Its low voltage and high density make it ideal for memory-intensive tasks in space-constrained designs.
When designing with this device, ensure proper decoupling capacitors near the power pins and follow the layout guidelines in the datasheet to minimize signal integrity issues. The ZQ pin requires a 240-ohm resistor to ground for calibration.
Alternatives de remplacement direct pour NT5CC256M16DP-FLNA — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec NT5CC256M16DP-FLNA (même facteur de forme et même empreinte) — différant par Package, Data Rate, Supply Voltage, CAS Latency, Interface.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
NT5CC256M16DP-DI
✅ Remplacement direct✓ En stock
$6.5 / unité
Voir la fiche technique →NT5CC256M16DP-DII
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MT41K256M16HA-125
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$6.3636 / unité
Voir la fiche technique →IS43TR16512B-125K
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
K4B4G1646E-BYMA
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$14.3182 / unité
Voir la fiche technique →NT5CC256M16DP-FLNA Valeurs maximales et caractéristiques électriques
| Type de mémoire | DDR3L SDRAM |
| Organisation de la mémoire | 256M x 16 |
| Total Density | 4 Gb |
| Tension d'alimentation | 1.35 V (1.283 V to 1.45 V) |
| Débit de données | 1600 Mbps (PC3L-12800) |
| Latence CAS | 11, 12, 13 |
| Burst Length | 8, 4 (with burst chop) |
| Number of Banks | 8 |
| Interface | SSTL-15 |
| Boîtier | BGA-96 (13x9 mm) |
| Température de fonctionnement | -40°C to +95°C (industrial), -40°C to +105°C (automotive) |
| RoHS | Compliant |
| Lead-Free | Yes |
| Refresh | Auto self-refresh, auto precharge |
| Caractéristiques | Write leveling, dynamic ODT, ZQ calibration, data mask, asynchronous reset |
Configuration des broches de NT5CC256M16DP-FLNA
| Broche A1 | VDD — Power supply (1.35V) |
| Broche A2 | DQ0 — Data input/output 0 |
| Broche A3 | DQ1 — Data input/output 1 |
| Broche B1 | VSS — Ground |
| Broche B2 | DQ2 — Data input/output 2 |
| Broche B3 | DQ3 — Data input/output 3 |
| Broche C1 | VDDQ — I/O power supply |
| Broche C2 | DQ4 — Data input/output 4 |
| Broche C3 | DQ5 — Data input/output 5 |
| Broche D1 | VSSQ — I/O ground |
| Broche D2 | DQ6 — Data input/output 6 |
| Broche D3 | DQ7 — Data input/output 7 |
| Broche E1 | DQS0 — Data strobe 0 |
| Broche E2 | DQS0# — Data strobe 0 complement |
| Broche E3 | VSS — Ground |
| Broche F1 | A0 — Address input 0 |
| Broche F2 | A1 — Address input 1 |
| Broche F3 | A2 — Address input 2 |
| Broche G1 | A3 — Address input 3 |
| Broche G2 | A4 — Address input 4 |
| Broche G3 | A5 — Address input 5 |
| Broche H1 | A6 — Address input 6 |
| Broche H2 | A7 — Address input 7 |
| Broche H3 | A8 — Address input 8 |
| Broche J1 | A9 — Address input 9 |
| Broche J2 | A10/AP — Address input 10 / auto precharge |
| Broche J3 | A11 — Address input 11 |
| Broche K1 | A12 — Address input 12 |
| Broche K2 | A13 — Address input 13 |
| Broche K3 | A14 — Address input 14 |
| Broche L1 | BA0 — Bank address 0 |
| Broche L2 | BA1 — Bank address 1 |
| Broche L3 | BA2 — Bank address 2 |
| Broche M1 | CK — Clock input |
| Broche M2 | CK# — Clock input complement |
| Broche M3 | CKE — Clock enable |
| Broche N1 | CS# — Chip select |
| Broche N2 | RAS# — Row address strobe |
| Broche N3 | CAS# — Column address strobe |
| Broche P1 | WE# — Write enable |
| Broche P2 | ODT — On-die termination |
| Broche P3 | RESET# — Asynchronous reset |
| Broche R1 | ZQ — Calibration reference (240 ohm to ground) |
| Broche R2 | VDD — Power supply |
| Broche R3 | VSS — Ground |
Applications typiques
NT5CC256M16DP-FLNA convient pour 6 applications: Networking Equipment, Industrial Automation, Automotive Infotainment, Embedded Computing, Data Acquisition Systems, Medical Devices.
Networking Equipment
The NT5CC256M16DP-FLNA provides high-density, low-power memory for routers and switches. Its 4Gb capacity and 1600 Mbps data rate support high-throughput packet processing. The 1.35V operation reduces power consumption in always-on network devices, while the industrial temperature range ensures reliability in uncontrolled environments. Placed on the memory bus with proper termination, it handles burst traffic efficiently, improving overall system performance.
Recommandé
Industrial Automation
In industrial automation, the NT5CC256M16DP-FLNA offers reliable memory for PLCs and robotics controllers. Its wide temperature range (-40°C to +95°C) and low voltage (1.35V) make it suitable for harsh factory floors. The auto self-refresh and write leveling features ensure data integrity during power fluctuations. It interfaces with industrial microcontrollers via a standard DDR3L bus, providing fast access for real-time control algorithms.
Recommandé
Automotive Infotainment
The NT5CC256M16DP-FLNA supports automotive infotainment systems with its automotive temperature grade (-40°C to +105°C) and high bandwidth. It enables smooth multimedia playback and navigation. The 1.35V operation reduces heat generation in the cabin, and the BGA package withstands vibration. It connects to automotive SoCs via a DDR3L interface, providing fast data access for graphics and audio processing.
Recommandé
Embedded Computing
For embedded computing, the NT5CC256M16DP-FLNA offers a balance of density and power efficiency. Its 4Gb capacity is ideal for Linux-based systems and edge computing. The low voltage (1.35V) extends battery life in portable devices. The device supports burst lengths of 8 and 4, optimizing memory throughput. It is compatible with a wide range of application processors, making it a versatile choice for custom embedded designs.
Recommandé
Data Acquisition Systems
The NT5CC256M16DP-FLNA is used in data acquisition systems to buffer large amounts of sensor data. Its high data rate (1600 Mbps) allows rapid sampling and storage. The industrial temperature range ensures operation in remote monitoring stations. The auto precharge and data mask features simplify control logic. It interfaces with ADCs and DSPs via a DDR3L bus, enabling high-speed data logging.
Recommandé
Medical Devices
In medical devices, the NT5CC256M16DP-FLNA provides reliable memory for imaging and monitoring equipment. Its low power consumption is critical for battery-operated devices. The industrial temperature range ensures stable operation in clinical environments. The device's error-free performance and long lifecycle make it suitable for medical applications. It connects to medical-grade processors, supporting real-time data processing.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour NT5CC256M16DP-FLNA — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | NT5CC256M16DP-DI | NT5CC256M16DP-DII | MT41K256M16HA-125 | IS43TR16512B-125K | K4B4G1646E-BYMA |
|---|---|---|---|---|---|---|
| Package | BGA-96 (13x9 mm) | BGA-96 (13x9 mm) | BGA-96 (13x9 mm) | BGA-96 (13x9 mm) | BGA-96 (13x9 mm) | BGA-96 (13x9 mm) |
| Brand | Nanya Technology | Nanya Technology | Nanya Technology | Micron Technology | ISSI | Samsung Electronics |
| Density | 4 Gb | 4 Gb | 4 Gb | 4 Gb | 8 Gb | 4 Gb |
| Organization | 256M x 16 | 256M x 16 | 256M x 16 | 256M x 16 | 512M x 16 | 256M x 16 |
| Supply Voltage | 1.35V | 1.35V | 1.35V | 1.35V | 1.35V | 1.35V |
| Data Rate | 1600 Mbps | 1600 Mbps | 1866 Mbps | 1600 Mbps | 1600 Mbps | 1866 Mbps |
| Temperature Range | -40°C to +95°C (industrial) | -40°C to +95°C | -40°C to +95°C | 0°C to +95°C | -40°C to +95°C | 0°C to +95°C |
| CAS Latency | 11, 12, 13 | 11, 12, 13 | 12, 13, 14 | 11, 12, 13 | 11, 12, 13 | 12, 13, 14 |
Principaux différenciateurs
- Industrial and automotive temperature grades (vs MT41K256M16HA-125)
- Lower power consumption at 1.35V (vs K4B4G1646E-BYMA)
- Pin-compatible with multiple Nanya variants (vs IS43TR16512B-125K)
Notes de conception
Place decoupling capacitors (0.1uF and 1uF) close to each VDD and VDDQ pin. Use a solid ground plane and minimize trace lengths for DQ and DQS signals. Follow the layout guidelines in the Nanya datasheet to ensure signal integrity at 1600 Mbps.
The BGA-96 package has a thermal resistance of [DATA_NEEDED: theta_JA]. Ensure adequate airflow or a thermal pad for high-temperature operation. In automotive applications, consider the -40°C to +105°C range and design for heat dissipation.
Connect a 240-ohm resistor from the ZQ pin to ground for calibration. Do not leave the RESET# pin floating; tie it high for normal operation. Ensure the supply voltage is within 1.283V to 1.45V to avoid data corruption.
Informations de conformité
RoHS compliant per Nanya datasheet. AEC-Q100 not specified; automotive grade may require additional qualification.
