MPC8250ACZUMHBC vs MPC8255ACZUMHBB तुलना
विस्तृत दोनों ओर की तुलना MPC8250ACZUMHBC द्वारा NXP Semiconductors और MPC8255ACZUMHBB द्वारा NXP Semiconductors. मुख्य विशेषताओं, इलेक्ट्रिकल पैरामीटर, पैकेजिंग, चक्र स्थिति, मूल्यांकन और उपलब्धता को तुलना करके अपनी डिजाइन की आवश्यकताओं के लिए सबसे अच्छा घटक निर्धारित करें。
NXP Semiconductors
MPC8250ACZUMHBC - PowerPC G2 MPU 266MHz 480-TBGA | NXP
MPC8250ACZUMHBC ⚠ अंतिम खरीदNXP Semiconductors
MPC8255ACZUMHBB - PowerQUICC II HIP4, 266MHz, 480-TBGA | NXP
MPC8255ACZUMHBB Obsoleteविशेषता तुलना
| पैरामीटर | MPC8250ACZUMHBC | MPC8255ACZUMHBB |
|---|---|---|
| ब्रांड | NXP Semiconductors | NXP Semiconductors |
| श्रेणी | Microcontrollers | Microcontrollers |
| लाइफसाइकिल स्थिति | अंतिम बार खरीदें | Obsolete |
| Manufacturer | NXP Semiconductors (formerly Freescale/Motorola) | NXP Semiconductors |
| Series | MPC82xx (PowerQUICC II) | PowerQUICC II HIP4 |
| Core Processor | PowerPC G2 | — |
| Number of Cores | 1 Core, 32-Bit | 1 |
| Co-Processors / DSP | Communications; RISC CPM | — |
| Speed | 266 MHz | — |
| Process Technology | 0.25 micron | 0.25 micron (HiP4) silicon revision |
| Supply Voltage (I/O) | 3.3 V | — |
| Core Voltage | 1.8 V | — |
| पैकेज / केस | 480-TBGA (37.5 x 37.5 mm) | — |
| पिन काउंट | 480 | — |
| डेटा बस चौड़ाई | 32-bit internal / 64-bit external | 64-Bit |
| Architecture | RISC | — |
| RAM Controllers | DRAM, SDRAM | — |
| Graphics Acceleration | No | — |
| ऑपरेटिंग तापमान | [DATA_NEEDED: operating temperature range] | [DATA_NEEDED: operating temperature range] |
| माउंटिंग प्रकार | Surface Mount (BGA) | Surface Mount |
| लाइफसाइकिल स्थिति | Last Time Buy (NXP EOL announced) | — |
| Lead Free | Yes (per BGA-516 datasheet note: LEAD FREE, PLASTIC) | — |
| RoHS स्थिति | [DATA_NEEDED: RoHS compliance status] | [DATA_NEEDED: RoHS compliance status] |
| Core Architecture | — | PowerPC G2 |
| Core Supply Voltage | — | 1.8 V |
| Maximum Clock Speed | — | 266 MHz |
| Instruction Set | — | 32-Bit RISC |
| Core | — | MPC82xx |
| Package Type | — | T-BGA |
| Pin/Ball Count | — | 480 |
| Package Size | — | 37.50 x 37.50 mm |
| Package Height | — | 1.55 mm |
| Ball Pitch | — | 1.27 mm |
| Integrated CPM | — | Yes (dual communications processor modules) |
| Ethernet MACs | — | Dual 10/100 MAC |