MPC8250ACZUMHBC vs MPC8255ACZUMHBB Perbandingan
Perbandingan bersamaan detil MPC8250ACZUMHBC dari NXP Semiconductors dan MPC8255ACZUMHBB dari NXP Semiconductors. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
NXP Semiconductors
MPC8250ACZUMHBC - PowerPC G2 MPU 266MHz 480-TBGA | NXP
MPC8250ACZUMHBC ⚠ Waktu Beli TerakhirNXP Semiconductors
MPC8255ACZUMHBB - PowerQUICC II HIP4, 266MHz, 480-TBGA | NXP
MPC8255ACZUMHBB ObsoletePerbandingan Spesifikasi
| Parameter Umum | MPC8250ACZUMHBC | MPC8255ACZUMHBB |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | Waktu Pembelian Terakhir | Obsolete |
| Manufacturer | NXP Semiconductors (formerly Freescale/Motorola) | NXP Semiconductors |
| Series | MPC82xx (PowerQUICC II) | PowerQUICC II HIP4 |
| Core Processor | PowerPC G2 | — |
| Number of Cores | 1 Core, 32-Bit | 1 |
| Co-Processors / DSP | Communications; RISC CPM | — |
| Speed | 266 MHz | — |
| Process Technology | 0.25 micron | 0.25 micron (HiP4) silicon revision |
| Supply Voltage (I/O) | 3.3 V | — |
| Core Voltage | 1.8 V | — |
| Paket / Case | 480-TBGA (37.5 x 37.5 mm) | — |
| Jumlah Pin | 480 | — |
| Lebar Bus Data | 32-bit internal / 64-bit external | 64-Bit |
| Architecture | RISC | — |
| RAM Controllers | DRAM, SDRAM | — |
| Graphics Acceleration | No | — |
| Suhu Kerja | [DATA_NEEDED: operating temperature range] | [DATA_NEEDED: operating temperature range] |
| Tipe Mounting | Surface Mount (BGA) | Surface Mount |
| Status Lingkungan Hidup | Last Time Buy (NXP EOL announced) | — |
| Lead Free | Yes (per BGA-516 datasheet note: LEAD FREE, PLASTIC) | — |
| Status RoHS | [DATA_NEEDED: RoHS compliance status] | [DATA_NEEDED: RoHS compliance status] |
| Core Architecture | — | PowerPC G2 |
| Core Supply Voltage | — | 1.8 V |
| Maximum Clock Speed | — | 266 MHz |
| Instruction Set | — | 32-Bit RISC |
| Core | — | MPC82xx |
| Package Type | — | T-BGA |
| Pin/Ball Count | — | 480 |
| Package Size | — | 37.50 x 37.50 mm |
| Package Height | — | 1.55 mm |
| Ball Pitch | — | 1.27 mm |
| Integrated CPM | — | Yes (dual communications processor modules) |
| Ethernet MACs | — | Dual 10/100 MAC |