MPC8250ACZUMHBC vs MPC8255ACZUMHBB Karşılaştırma
Ayrıntılı yan yana karşılaştırma MPC8250ACZUMHBC tarafından NXP Semiconductors ve MPC8255ACZUMHBB tarafından NXP SemiconductorsAnahtar özellikleri, elektriksel parametreleri, ambalajı, yaşam döngüsü durumu, fiyatlandırma ve mevcudiyeti karşılaştırarak tasarım gereksinimleriniz için en iyi bileşeni belirleyin.
NXP Semiconductors
MPC8250ACZUMHBC - PowerPC G2 MPU 266MHz 480-TBGA | NXP
MPC8250ACZUMHBC ⚠ Son Satın AlmaNXP Semiconductors
MPC8255ACZUMHBB - PowerQUICC II HIP4, 266MHz, 480-TBGA | NXP
MPC8255ACZUMHBB ObsoleteÖzellik Karşılaştırması
| Parametre | MPC8250ACZUMHBC | MPC8255ACZUMHBB |
|---|---|---|
| Marka | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Yaşam Döngüsü Durumu | Son Alış Zamanı | Obsolete |
| Manufacturer | NXP Semiconductors (formerly Freescale/Motorola) | NXP Semiconductors |
| Series | MPC82xx (PowerQUICC II) | PowerQUICC II HIP4 |
| Core Processor | PowerPC G2 | — |
| Number of Cores | 1 Core, 32-Bit | 1 |
| Co-Processors / DSP | Communications; RISC CPM | — |
| Speed | 266 MHz | — |
| Process Technology | 0.25 micron | 0.25 micron (HiP4) silicon revision |
| Supply Voltage (I/O) | 3.3 V | — |
| Core Voltage | 1.8 V | — |
| Paket / Kas | 480-TBGA (37.5 x 37.5 mm) | — |
| Pin Sayısı | 480 | — |
| Veri Bus Genişliği | 32-bit internal / 64-bit external | 64-Bit |
| Architecture | RISC | — |
| RAM Controllers | DRAM, SDRAM | — |
| Graphics Acceleration | No | — |
| İşletim Sıcaklığı | [DATA_NEEDED: operating temperature range] | [DATA_NEEDED: operating temperature range] |
| Montaj Türü | Surface Mount (BGA) | Surface Mount |
| Yaşam Döngüsü Durumu | Last Time Buy (NXP EOL announced) | — |
| Lead Free | Yes (per BGA-516 datasheet note: LEAD FREE, PLASTIC) | — |
| RoHS Durumu | [DATA_NEEDED: RoHS compliance status] | [DATA_NEEDED: RoHS compliance status] |
| Core Architecture | — | PowerPC G2 |
| Core Supply Voltage | — | 1.8 V |
| Maximum Clock Speed | — | 266 MHz |
| Instruction Set | — | 32-Bit RISC |
| Core | — | MPC82xx |
| Package Type | — | T-BGA |
| Pin/Ball Count | — | 480 |
| Package Size | — | 37.50 x 37.50 mm |
| Package Height | — | 1.55 mm |
| Ball Pitch | — | 1.27 mm |
| Integrated CPM | — | Yes (dual communications processor modules) |
| Ethernet MACs | — | Dual 10/100 MAC |