H5TC4G63AFR-PBA vs K4A8G165WB-BIRC Perbandingan
Perbandingan bersamaan detil H5TC4G63AFR-PBA dari SK hynix dan K4A8G165WB-BIRC dari Samsung Electronics. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | H5TC4G63AFR-PBA | K4A8G165WB-BIRC |
|---|---|---|
| Merek | SK hynix | Samsung Electronics |
| Kategori | Memory ICs | Memory ICs |
| Status Lingkungan Hidup | Aktif | Aktif |
| Status Stok | — | In Stock |
| Harga Unit (USD) | $3,98 | $32,50 |
| Tipe Memori | DDR3L SDRAM | DDR4 SDRAM |
| Density | 4Gb | 8 Gb |
| Organisasi | 256M x 16 | 512M x 16 |
| Supply Voltage (VDD/VDDQ) | 1.35V | — |
| Laju Data | 1866 Mbps (PC3L-14900) | 2400 Mbps |
| Paket | 96-ball FBGA | 96-FBGA |
| Ball Pitch | 0.8mm | — |
| Number of Banks | 8 | — |
| Burst Length | 8 and 4 (with burst chop) | 8 (BL8) and 4 (BC4) |
| CAS Latency (CL) | 11, 12, 13 | — |
| Rentang Suhu Kerja | 0°C to +95°C (Tcase) | — |
| Antarmuka | 16-bit I/O | Pseudo-open-drain |
| On-Die Termination (ODT) | Yes | — |
| ZQ Calibration | Yes | — |
| Write Leveling | Yes | — |
| Auto Self-Refresh | Yes | — |
| Partial Array Self-Refresh | Yes | — |
| RoHS | Compliant | Compliant |
| Tegangan Pemuat | — | 1.2 V |
| Suhu Kerja | — | -40°C to +95°C |
| Latensi CAS | — | 15, 16, 17 |
| On-Die Termination | — | Yes |
| Refresh | — | Auto-refresh and self-refresh |
| Row Address | — | 16K |
| Column Address | — | 1K |