MPC860DEZQ50D4 vs MC860ENCVR50D4R2 Perbandingan
Perbandingan bersamaan detil MPC860DEZQ50D4 dari NXP Semiconductors dan MC860ENCVR50D4R2 dari NXP. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | MPC860DEZQ50D4 | MC860ENCVR50D4R2 |
|---|---|---|
| Merek | NXP Semiconductors | NXP |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | NRND | Obsolete |
| Processor Type | MPC8xx PowerQUICC, 32-bit | — |
| Core Architecture | Power Architecture (embedded) | PowerPC 32-bit |
| Core Frequency | 50 MHz | — |
| Communications Processor Module | CPM with HDLC, Ethernet, PCMCIA, SCC | — |
| Ethernet MAC | 10/100 Mbps integrated | — |
| HDLC/SDLC Channels | Yes (multi-channel) | — |
| PCMCIA Interface | Yes | — |
| Supply Voltage (I/O) | 3.3 V | — |
| Paket | 357-Ball PBGA (25x25 mm) | — |
| Tipe Mounting | Surface Mount (BGA) | Surface Mount, BGA |
| Suhu Kerja | 0 C to +95 C | [DATA_NEEDED: Operating Temperature] |
| Status RoHS | Contains Lead (legacy BGA) | RoHS compliant |
| Lead-Free Status | Contains Lead | — |
| Packaging | Tray | Digi-Reel / Tape and Reel |
| Sub-Brand Heritage | Freescale / NXP PowerQUICC | — |
| Processor Family | — | MPC8xx PowerQUICC |
| Core Count | — | 1 |
| Frekuensi Bawah Maximum | — | 50 MHz |
| Tegangan Pemuat Kerja | — | 3.3 V |
| Paket / Case | — | 357-BBGA (PBGA, 25 x 25 mm) |
| Pitch | — | 1.27 mm |
| Lead Free Status | — | Lead Free |
| Communications Module | — | CPM (SCC/SMC/UART/SPI) |
| JTAG / Debug Interface | — | Yes (BDM/JTAG) |
| Memory Controller | — | Integrated DRAM/SRAM/Flash + PCMCIA |
| Process Technology | — | 0.32 um CMOS |