MPC860DEZQ50D4 vs MC860ENCVR50D4R2 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng MPC860DEZQ50D4 sa pamamagitan ng NXP Semiconductors at MC860ENCVR50D4R2 sa pamamagitan ng NXP. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | MPC860DEZQ50D4 | MC860ENCVR50D4R2 |
|---|---|---|
| Brand | NXP Semiconductors | NXP |
| Kategorya | Microcontrollers | Microcontrollers |
| Katayuan ng Lifecycle | NRND | Obsolete |
| Processor Type | MPC8xx PowerQUICC, 32-bit | — |
| Core Architecture | Power Architecture (embedded) | PowerPC 32-bit |
| Core Frequency | 50 MHz | — |
| Communications Processor Module | CPM with HDLC, Ethernet, PCMCIA, SCC | — |
| Ethernet MAC | 10/100 Mbps integrated | — |
| HDLC/SDLC Channels | Yes (multi-channel) | — |
| PCMCIA Interface | Yes | — |
| Supply Voltage (I/O) | 3.3 V | — |
| Packhaging | 357-Ball PBGA (25x25 mm) | — |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount, BGA |
| Temperature na Operasyon | 0 C to +95 C | [DATA_NEEDED: Operating Temperature] |
| Tindminan RoHS | Contains Lead (legacy BGA) | RoHS compliant |
| Lead-Free Status | Contains Lead | — |
| Packaging | Tray | Digi-Reel / Tape and Reel |
| Sub-Brand Heritage | Freescale / NXP PowerQUICC | — |
| Processor Family | — | MPC8xx PowerQUICC |
| Core Count | — | 1 |
| Maksimum na Taktiko ng Oras | — | 50 MHz |
| Supply Voltage na Operasyon | — | 3.3 V |
| Packhaging / Kaso | — | 357-BBGA (PBGA, 25 x 25 mm) |
| Pitch | — | 1.27 mm |
| Lead Free Status | — | Lead Free |
| Communications Module | — | CPM (SCC/SMC/UART/SPI) |
| JTAG / Debug Interface | — | Yes (BDM/JTAG) |
| Memory Controller | — | Integrated DRAM/SRAM/Flash + PCMCIA |
| Process Technology | — | 0.32 um CMOS |