MPC860DEZQ50D4 vs MC860ENCVR50D4R2 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci MPC860DEZQ50D4 disebabkan oleh NXP Semiconductors dan MC860ENCVR50D4R2 disebabkan oleh NXP. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | MPC860DEZQ50D4 | MC860ENCVR50D4R2 |
|---|---|---|
| Merek | NXP Semiconductors | NXP |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | NRND | Obsolete |
| Processor Type | MPC8xx PowerQUICC, 32-bit | — |
| Core Architecture | Power Architecture (embedded) | PowerPC 32-bit |
| Core Frequency | 50 MHz | — |
| Communications Processor Module | CPM with HDLC, Ethernet, PCMCIA, SCC | — |
| Ethernet MAC | 10/100 Mbps integrated | — |
| HDLC/SDLC Channels | Yes (multi-channel) | — |
| PCMCIA Interface | Yes | — |
| Supply Voltage (I/O) | 3.3 V | — |
| Kemasan | 357-Ball PBGA (25x25 mm) | — |
| Jenis Pemasangan | Surface Mount (BGA) | Surface Mount, BGA |
| Suhu Operasi | 0 C to +95 C | [DATA_NEEDED: Operating Temperature] |
| Status RoHS | Contains Lead (legacy BGA) | RoHS compliant |
| Lead-Free Status | Contains Lead | — |
| Packaging | Tray | Digi-Reel / Tape and Reel |
| Sub-Brand Heritage | Freescale / NXP PowerQUICC | — |
| Processor Family | — | MPC8xx PowerQUICC |
| Core Count | — | 1 |
| Frekuensi Klock Maksimum | — | 50 MHz |
| Tegangan Pemberi Arus Operasi | — | 3.3 V |
| Kemasan / Case | — | 357-BBGA (PBGA, 25 x 25 mm) |
| Pitch | — | 1.27 mm |
| Lead Free Status | — | Lead Free |
| Communications Module | — | CPM (SCC/SMC/UART/SPI) |
| JTAG / Debug Interface | — | Yes (BDM/JTAG) |
| Memory Controller | — | Integrated DRAM/SRAM/Flash + PCMCIA |
| Process Technology | — | 0.32 um CMOS |