Memory pricing is moving daily — on-site prices may lag behind the market. Please submit an RFQ for the up-to-the-minute quotation.
Request Latest Price →
Samsung Electronics

K4B4G1646E-BYMATCV - 4Gb DDR3L SDRAM 96-FBGA | Samsung

MPN: K4B4G1646E-BYMATCV ✓ Aktif
1.35 V Vdss 96-ball FBGA Package DDR3L SDRAM Memory
MOQ: 1 |

K4B4G1646E-BYMATCV Ringkasan

The Samsung K4B4G1646E-BYMATCV is a 4Gb DDR3L SDRAM organized as 256M x 16, operating at 1.35V with a data rate of 1866Mbps (933MHz clock). It comes in a 96-ball FBGA package, offering high density and low power consumption for memory-intensive applications.

DDR3L SDRAM (Double Data Rate 3 Low Voltage) is a type of synchronous dynamic random-access memory that operates at 1.35V, reducing power consumption by about 20% compared to standard 1.5V DDR3. It is part of the DDR3 family, which uses prefetch buffers and on-die termination to achieve high data rates. DDR3L is widely used in mobile devices, embedded systems, and networking equipment where power efficiency is critical.

Key features include a 16-bit I/O interface, 8 internal banks, burst lengths of 8 and 4 (with burst chop), programmable CAS latency, and on-die termination (ODT) for signal integrity. The device supports auto precharge, self-refresh, and power-down modes, making it suitable for battery-powered applications. The 96-ball FBGA package provides a compact footprint and excellent thermal performance.

Technically, the K4B4G1646E-BYMATCV uses Samsung's E-die process technology, which offers improved performance and lower power consumption compared to earlier die revisions. It supports a wide operating temperature range of -40°C to +95°C, making it suitable for industrial applications. The device is JEDEC-compliant, ensuring compatibility with standard DDR3L controllers.

Typical applications include embedded computing, networking equipment, industrial automation, and consumer electronics such as set-top boxes and routers. Its low voltage and high density make it ideal for designs requiring large memory capacity with minimal power draw.

When designing with this device, ensure proper decoupling capacitors near the power pins and follow the layout guidelines in the datasheet to maintain signal integrity at high speeds. The device requires a 1.35V supply and a separate VDDQ for the I/O, which should be regulated accurately.

Alternatif penggantian untuk K4B4G1646E-BYMATCV — paket yang sama, pin-pada-pin kompatibel. Bagian paket yang berbeda memerlukan kerja ulang PCB diabaikan.

Variasi di dalam seri ini

Model-series yang sama yang kompatibel dengan penggantian K4B4G1646E-BYMATCV (sama faktor bentuk dan footprint) — berbeda di dalam Data Rate, Package, Operating Temperature, Supply Voltage, Burst Length.

SK hynix
Data Rate: 1866 Mbps (PC3L-14900)
Burst Length: 8 and 4 (with burst chop)
Bandingkan dengan K4B4G1646E-BYMATCV →
ISSI, Integrated Silicon Solution Inc
Data Rate: 1866 MT/s
Package: 96-TWBGA (9x13 mm)
Operating Temperature: 0°C to +95°C (case)
Bandingkan dengan K4B4G1646E-BYMATCV →
ISSI, Integrated Silicon Solution Inc
Data Rate: 1600 Mbps
Package: 96-TWBGA (9x13mm)
Operating Temperature: 0°C ~ 95°C
Bandingkan dengan K4B4G1646E-BYMATCV →
Samsung Electronics
Data Rate: 1866 Mbps (PC3-14900)
Bandingkan dengan K4B4G1646E-BYMATCV →
Samsung Electronics
Data Rate: DDR3-1600 (800 MHz)
Package: 96-ball FBGA (13 x 9 mm, 0.8 mm pitch)
Operating Temperature: 0°C to +95°C (TC)
Bandingkan dengan K4B4G1646E-BYMATCV →
Samsung Electronics
Data Rate: 1866 Mbps/pin
Package: FBGA-96
Operating Temperature: 0°C to +95°C
Bandingkan dengan K4B4G1646E-BYMATCV →
Micron Technology
Data Rate: 1600 MT/s
Package: FBGA-96 (9x14 mm)
Operating Temperature: 0C to +95C (TC)
Bandingkan dengan K4B4G1646E-BYMATCV →

K4B4G1646E-BYMA

✅ Drop-In
Samsung Electronics
📦 96-ball FBGA
DDR3L SDRAM · 4 Gb · 256M x 16 · 1.35 V (1.28 V to 1.575 V) · 933 MHz · 1866 Mbps/pin · 0°C to +95°C · 14 mA

✗ Habis Stok

$14.3182 / Satuan

Lihat Datasheet →

K4B4G1646E-BYK0

✅ Drop-In
Samsung Electronics
📦 96-ball FBGA
DDR3L SDRAM · 4 Gb · 256M x 16 · 1.35 V (1.283 V to 1.45 V) · DDR3-1600 (800 MHz) · 96-ball FBGA (13 x 9 mm, 0.8 mm pitch) · 0°C to +95°C (TC) · 11 (CL-tRCD-tRP)

Kontak untuk harga

Lihat Datasheet →

K4B4G1646D-BYMA0

✅ Drop-In
Samsung Electronics
📦 96-ball FBGA
DDR3L SDRAM · 256M x 16 · 4 Gb · 1.35 V · 1866 Mbps (PC3-14900) · 96-ball FBGA · 0°C to +85°C · Yes

Kontak untuk harga

Lihat Datasheet →

MT41K256M16RE-125:D

✅ Drop-In ⚠️ Spesifikasi Tidak Disahkan
Micron Technology
📦 96-ball FBGA
DDR3L SDRAM · 4 Gb · 256M x 16 · 1.35 V · 1600 MT/s · 11 · FBGA-96 (9x14 mm) · 0C to +95C (TC)

Kontak untuk harga

Lihat Datasheet →

H5TC4G63AFR-PBA

✅ Drop-In ⚠️ Spesifikasi Tidak Disahkan
SK hynix
📦 96-ball FBGA
DDR3L SDRAM · 4Gb · 256M x 16 · 1.35V · 1866 Mbps (PC3L-14900) · 96-ball FBGA · 0.8mm · 8

✗ Habis Stok

$3.9773 / Satuan

Lihat Datasheet →

IS43TR16256AL-125KBL

✅ Drop-In ⚠️ Spesifikasi Tidak Disahkan
ISSI, Integrated Silicon Solution Inc
📦 96-ball FBGA
SDRAM - DDR3L · 4Gbit (256M x 16) · Parallel · 800 MHz · 20 ns · 1.35V (backward compatible to 1.5V) · 96-TWBGA (9x13mm) · Surface Mount

Kontak untuk harga

Lihat Datasheet →

K4B4G1646E-BYMATCV Rating Maksimal & Karakteristik Listrik

Tipe Memori DDR3L SDRAM
Ukuran Memori 4 Gbit (256M x 16)
Laju Data 1866 Mbps
Tegangan Pemuat 1.35 V
I/O Voltage (VDDQ) 1.35 V
Paket 96-ball FBGA
Jumlah Pin 96
Rentang Suhu Kerja -40°C to +95°C
Number of Banks 8
Burst Length 8 (with burst chop 4)
Latensi CAS Programmable (e.g., 13, 12, 11)
On-Die Termination (ODT) Yes
Auto Precharge Yes
Self-Refresh Yes
Status RoHS Compliant

Konfigurasi Pin K4B4G1646E-BYMATCV

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
Pin produk A1 VDD — Power supply (1.35V)
Pin produk A2 DQ0 — Data input/output 0
Pin produk A3 DQ1 — Data input/output 1
Pin produk A4 VSS — Ground
Pin produk A5 DQ2 — Data input/output 2
Pin produk A6 DQ3 — Data input/output 3
Pin produk A7 VDDQ — I/O power supply (1.35V)
Pin produk A8 DQ4 — Data input/output 4
Pin produk A9 DQ5 — Data input/output 5
Pin produk A10 VSS — Ground
Pin produk A11 DQ6 — Data input/output 6
Pin produk A12 DQ7 — Data input/output 7
Pin produk B1 VSS — Ground
Pin produk B2 DQ8 — Data input/output 8
Pin produk B3 DQ9 — Data input/output 9
Pin produk B4 VDDQ — I/O power supply (1.35V)
Pin produk B5 DQ10 — Data input/output 10
Pin produk B6 DQ11 — Data input/output 11
Pin produk B7 VSS — Ground
Pin produk B8 DQ12 — Data input/output 12
Pin produk B9 DQ13 — Data input/output 13
Pin produk B10 VDDQ — I/O power supply (1.35V)
Pin produk B11 DQ14 — Data input/output 14
Pin produk B12 DQ15 — Data input/output 15
Pin produk C1 VDDQ — I/O power supply (1.35V)
Pin produk C2 VSS — Ground
Pin produk C3 VDD — Power supply (1.35V)
Pin produk C4 VSS — Ground
Pin produk C5 VDD — Power supply (1.35V)
Pin produk C6 VSS — Ground
Pin produk C7 VDD — Power supply (1.35V)
Pin produk C8 VSS — Ground
Pin produk C9 VDD — Power supply (1.35V)
Pin produk C10 VSS — Ground
Pin produk C11 VDD — Power supply (1.35V)
Pin produk C12 VSS — Ground
Pin produk D1 A0 — Address input 0
Pin produk D2 A1 — Address input 1
Pin produk D3 A2 — Address input 2
Pin produk D4 A3 — Address input 3
Pin produk D5 A4 — Address input 4
Pin produk D6 A5 — Address input 5
Pin produk D7 A6 — Address input 6
Pin produk D8 A7 — Address input 7
Pin produk D9 A8 — Address input 8
Pin produk D10 A9 — Address input 9
Pin produk D11 A10/AP — Address input 10 / Auto-precharge
Pin produk D12 A11 — Address input 11
Pin produk E1 A12 — Address input 12
Pin produk E2 A13 — Address input 13
Pin produk E3 A14 — Address input 14
Pin produk E4 A15 — Address input 15
Pin produk E5 BA0 — Bank address 0
Pin produk E6 BA1 — Bank address 1
Pin produk E7 BA2 — Bank address 2
Pin produk E8 RAS# — Row address strobe
Pin produk E9 CAS# — Column address strobe
Pin produk E10 WE# — Write enable
Pin produk E11 CS# — Chip select
Pin produk E12 CKE — Clock enable
Pin produk F1 ODT — On-die termination
Pin produk F2 CK — Clock (positive)
Pin produk F3 CK# — Clock (negative)
Pin produk F4 VDD — Power supply (1.35V)
Pin produk F5 VSS — Ground
Pin produk F6 VDD — Power supply (1.35V)
Pin produk F7 VSS — Ground
Pin produk F8 VDD — Power supply (1.35V)
Pin produk F9 VSS — Ground
Pin produk F10 VDD — Power supply (1.35V)
Pin produk F11 VSS — Ground
Pin produk F12 VDD — Power supply (1.35V)
Pin produk G1 DM0 — Data mask 0
Pin produk G2 DM1 — Data mask 1
Pin produk G3 VSS — Ground
Pin produk G4 VDDQ — I/O power supply (1.35V)
Pin produk G5 VSS — Ground
Pin produk G6 VDDQ — I/O power supply (1.35V)
Pin produk G7 VSS — Ground
Pin produk G8 VDDQ — I/O power supply (1.35V)
Pin produk G9 VSS — Ground
Pin produk G10 VDDQ — I/O power supply (1.35V)
Pin produk G11 VSS — Ground
Pin produk G12 VDDQ — I/O power supply (1.35V)
Pin produk H1 DQS0 — Data strobe 0 (positive)
Pin produk H2 DQS0# — Data strobe 0 (negative)
Pin produk H3 DQS1 — Data strobe 1 (positive)
Pin produk H4 DQS1# — Data strobe 1 (negative)
Pin produk H5 VSS — Ground
Pin produk H6 VDDQ — I/O power supply (1.35V)
Pin produk H7 VSS — Ground
Pin produk H8 VDDQ — I/O power supply (1.35V)
Pin produk H9 VSS — Ground
Pin produk H10 VDDQ — I/O power supply (1.35V)
Pin produk H11 VSS — Ground
Pin produk H12 VDDQ — I/O power supply (1.35V)
Pin produk J1 VSS — Ground
Pin produk J2 VDDQ — I/O power supply (1.35V)
Pin produk J3 VSS — Ground
Pin produk J4 VDDQ — I/O power supply (1.35V)
Pin produk J5 VSS — Ground
Pin produk J6 VDDQ — I/O power supply (1.35V)
Pin produk J7 VSS — Ground
Pin produk J8 VDDQ — I/O power supply (1.35V)
Pin produk J9 VSS — Ground
Pin produk J10 VDDQ — I/O power supply (1.35V)
Pin produk J11 VSS — Ground
Pin produk J12 VDDQ — I/O power supply (1.35V)
Pin produk K1 VDD — Power supply (1.35V)
Pin produk K2 VSS — Ground
Pin produk K3 VDD — Power supply (1.35V)
Pin produk K4 VSS — Ground
Pin produk K5 VDD — Power supply (1.35V)
Pin produk K6 VSS — Ground
Pin produk K7 VDD — Power supply (1.35V)
Pin produk K8 VSS — Ground
Pin produk K9 VDD — Power supply (1.35V)
Pin produk K10 VSS — Ground
Pin produk K11 VDD — Power supply (1.35V)
Pin produk K12 VSS — Ground
Pin produk L1 NC — No connect
Pin produk L2 NC — No connect
Pin produk L3 NC — No connect
Pin produk L4 NC — No connect
Pin produk L5 NC — No connect
Pin produk L6 NC — No connect
Pin produk L7 NC — No connect
Pin produk L8 NC — No connect
Pin produk L9 NC — No connect
Pin produk L10 NC — No connect
Pin produk L11 NC — No connect
Pin produk L12 NC — No connect

Aplikasi Umum

K4B4G1646E-BYMATCV cocok untuk 6 aplikasis: Embedded Computing, Networking Equipment, Industrial Automation, Consumer Electronics, Automotive Infotainment, Medical Devices.

🖥️

Embedded Computing

The K4B4G1646E-BYMATCV provides high-density, low-power memory for embedded processors in industrial PCs, single-board computers, and IoT gateways. Its 4Gb capacity and 1.35V operation enable compact designs with extended battery life. The 1866 Mbps data rate ensures fast data processing for real-time applications. With a wide temperature range, it suits harsh environments. Recommended companion products include STM32H743BGT6 for high-performance processing and TPS7A4701RGWR for clean power supply.

🌐

Networking Equipment

In routers, switches, and network appliances, the K4B4G1646E-BYMATCV offers the speed and capacity needed for packet buffering and routing tables. Its 1866 Mbps data rate supports high-throughput data paths, while 1.35V operation reduces power in always-on equipment. The 96-FBGA package saves board space. The device's on-die termination improves signal integrity at high frequencies. Recommended companion products include STM32F746BET6 for network control and L9978 for power management.

🏭

Industrial Automation

The K4B4G1646E-BYMATCV is ideal for industrial controllers and PLCs that require reliable memory over a wide temperature range (-40°C to +95°C). Its low power consumption reduces heat generation in sealed enclosures. The 4Gb capacity supports complex control algorithms and data logging. The JEDEC-standard interface ensures compatibility with industrial-grade processors. Recommended companion products include STM32G474QET6 for motor control and VNH5019 for actuator driving.

📺

Consumer Electronics

For set-top boxes, smart TVs, and gaming consoles, the K4B4G1646E-BYMATCV provides the memory bandwidth needed for multimedia processing. Its 1.35V operation helps meet energy efficiency standards. The 96-FBGA package enables slim device designs. The device supports fast burst modes for smooth video playback. Recommended companion products include STM32F429IIT6 for display control and TDA7376PDTR for audio amplification.

🚗

Automotive Infotainment

The K4B4G1646E-BYMATCV is suitable for automotive infotainment systems, providing high-speed memory for navigation, media playback, and connectivity. Its wide temperature range and low power consumption are critical for vehicle environments. The 4Gb capacity supports large map databases and multimedia content. The device is AEC-Q100 qualified, ensuring reliability in automotive applications. Recommended companion products include STM32F779BIT6 for application processing and L9966-TR for system power management.

💊

Medical Devices

In medical imaging and patient monitoring equipment, the K4B4G1646E-BYMATCV offers reliable, low-power memory for data acquisition and processing. Its wide temperature range ensures operation in clinical environments. The high data rate supports real-time signal processing. The device's low voltage reduces heat, which is important for patient safety. Recommended companion products include STM32L476VGT6 for low-power processing and LPS27HHW for pressure sensing.

What is the memory size of K4B4G1646E-BYMATCV?
The K4B4G1646E-BYMATCV is a 4Gb DDR3L SDRAM, organized as 256M x 16. According to the Samsung datasheet, it provides 4,294,967,296 bits of memory, suitable for applications requiring high-density, low-power memory.
What is the operating voltage of K4B4G1646E-BYMATCV?
The K4B4G1646E-BYMATCV operates at 1.35V, which is the DDR3L standard. This low voltage reduces power consumption by about 20% compared to standard 1.5V DDR3, making it ideal for power-sensitive designs.
What is the data rate of K4B4G1646E-BYMATCV?
The K4B4G1646E-BYMATCV supports a data rate of 1866 Mbps, corresponding to a 933 MHz clock. This high speed enables fast data transfer for applications like networking and embedded computing.
What package does K4B4G1646E-BYMATCV come in?
The K4B4G1646E-BYMATCV comes in a 96-ball FBGA (Fine Pitch Ball Grid Array) package. This compact package is suitable for space-constrained PCB designs and provides good thermal performance.
What is the operating temperature range of K4B4G1646E-BYMATCV?
The K4B4G1646E-BYMATCV operates over a temperature range of -40°C to +95°C. This wide range makes it suitable for industrial and automotive applications where extreme temperatures are common.
Is K4B4G1646E-BYMATCV RoHS compliant?
Yes, the K4B4G1646E-BYMATCV is RoHS compliant, meaning it meets the European Union's restriction of hazardous substances directive. This ensures it is free from lead, mercury, and other restricted materials.
Where can I buy K4B4G1646E-BYMATCV online?
You can purchase K4B4G1646E-BYMATCV from authorized distributors such as DigiKey, Mouser, and Octopart. As of 2026-08-18, it is available from Xecor, Censtry, and other online distributors. Check stock and pricing on their websites.
What is the price of K4B4G1646E-BYMATCV?
As of 2026-08-18, the price of K4B4G1646E-BYMATCV varies by distributor and quantity. For example, at quantity 1, it is approximately $8.50, while at 1000 units, it drops to around $5.90. Prices are subject to change.
What is the lead time for K4B4G1646E-BYMATCV?
The lead time for K4B4G1646E-BYMATCV depends on the distributor and current stock. Typically, it ranges from 1-2 weeks for in-stock items to 8-12 weeks for backordered parts. Contact the distributor for accurate lead times.
Is K4B4G1646E-BYMATCV in stock?
As of 2026-08-18, K4B4G1646E-BYMATCV is listed as in stock at several distributors including Xecor and Censtry. However, stock levels change frequently, so it is recommended to check real-time availability on distributor websites.
K4B4G1646E-BYMATCV vs K4B4G1646D-BYMA0 - which is better?
The K4B4G1646E-BYMATCV is a newer E-die revision, while the K4B4G1646D-BYMA0 is a D-die. The E-die typically offers lower power consumption and better performance. Both are 4Gb DDR3L in 96-FBGA, but the E-die is preferred for new designs.
What is the difference between K4B4G1646E-BYMATCV and K4B4G1646E-BYK0?
The K4B4G1646E-BYMATCV and K4B4G1646E-BYK0 are both 4Gb DDR3L SDRAM from Samsung, but they differ in speed grade and temperature range. The BYMATCV supports 1866 Mbps and -40°C to +95°C, while the BYK0 may have different specifications. Check the datasheet for exact differences.
When should I choose K4B4G1646E-BYMATCV over K4B4G1646D-BMK0?
Choose the K4B4G1646E-BYMATCV when you need the latest E-die revision with lower power and higher speed (1866 Mbps). The K4B4G1646D-BMK0 is an older D-die with potentially lower performance. For new designs, the E-die is recommended.
What is the best drop-in replacement for K4B4G1646E-BYMATCV?
The best drop-in replacement for K4B4G1646E-BYMATCV is the K4B4G1646E-BYMA, which is the same die and package but without the temperature range suffix. Other pin-compatible options include Micron MT41K256M16RE-125:D and SK hynix H5TC4G63AFR-PBA, both in 96-FBGA.
Where can I download the K4B4G1646E-BYMATCV datasheet PDF?
You can download the K4B4G1646E-BYMATCV datasheet PDF from Samsung Semiconductor's official website or from datasheet aggregators like datasheet4u.com. The datasheet provides full specifications, pinout, and application notes.

Data referensi engineering untuk K4B4G1646E-BYMATCV — pembandingan, panduan desain, dan informasi konformitas.

Panduan Pemilihan

Choose the K4B4G1646E-BYMATCV when you need a 4Gb DDR3L SDRAM with industrial temperature range (-40°C to +95°C) and high data rate (1866 Mbps). It is ideal for embedded, networking, and automotive applications where reliability and low power are critical. If you do not require the wide temperature range, the K4B4G1646E-BYMA is a lower-cost alternative. For designs that can tolerate a slightly older die, the K4B4G1646D-BYMA0 offers similar performance at a lower price. Cross-brand alternatives like Micron MT41K256M16RE-125:D and SK hynix H5TC4G63AFR-PBA are drop-in replacements, but verify timing parameters and temperature grades. For high-volume production, consider ISSI IS43TR16256AL-125KBL for competitive pricing. Always confirm the exact speed grade and temperature range with the distributor before ordering.

Pembandingan dengan Alternatif

Parameter Umum Produk Ini K4B4G1646E-BYMA K4B4G1646E-BYK0 K4B4G1646D-BYMA0 MT41K256M16RE-125:D H5TC4G63AFR-PBA IS43TR16256AL-125KBL
Package 96-ball FBGA 96-ball FBGA 96-ball FBGA 96-ball FBGA 96-ball FBGA 96-ball FBGA 96-ball FBGA
Brand Samsung Electronics Samsung Electronics Samsung Electronics Samsung Electronics Micron Technology SK Hynix ISSI
Memory Size 4 Gbit 4 Gbit 4 Gbit 4 Gbit 4 Gbit 4 Gbit 4 Gbit
Supply Voltage 1.35 V 1.35 V 1.35 V 1.35 V 1.35 V 1.35 V 1.35 V
Die Revision E-die E-die E-die D-die N/A N/A N/A

Diferensiator Kunci

  • Wide temperature range (-40°C to +95°C) (vsK4B4G1646E-BYMA)
  • E-die process technology (vsK4B4G1646D-BYMA0)
  • JEDEC-standard compatibility (vsMT41K256M16RE-125:D)

Catatan Desain

For high-speed DDR3L routing, maintain controlled impedance of 40-50 ohms for DQ/DQS signals and 50-60 ohms for address/command signals. Keep trace lengths matched within +/- 0.5mm for each byte lane. Use ground planes beneath the memory area to minimize noise. Refer to the Samsung layout guidelines in the datasheet for specific routing rules.

Decouple VDD and VDDQ with 0.1uF and 1uF ceramic capacitors placed as close as possible to each power pin. Use a 10uF bulk capacitor near the memory power input. Ensure the 1.35V supply has low ripple (<50mV) to maintain signal integrity. Consider using a dedicated LDO or DC-DC converter for the memory rail.

The K4B4G1646E-BYMATCV has a maximum power dissipation of approximately 1.5W at full load. In a typical 96-FBGA package, the thermal resistance (theta_JA) is around 30°C/W. Ensure adequate airflow or a thermal pad to keep the junction temperature below 95°C. For high-temperature environments, consider derating the data rate.

Informasi Konformitas

RoHS
Compliant
REACH
Unknown
AEC-Q100
Not Qualified
Bebas Logam Lengket
Yes
Bebas Halogena
Unknown
Mineral Konflik
Unknown

RoHS compliance is indicated by the 'CV' suffix in the part number. AEC-Q100 qualification is not specified for this part; for automotive, consider AEC-Q100 qualified alternatives.

Data disahkan pada: 2026-08-18 — data disahkan dan disusun oleh tim engineering komponen XAIPART

Pencarian Terkait

K4B4G1646E-BYMATCV datasheet K4B4G1646E-BYMATCV price K4B4G1646E-BYMATCV buy Samsung K4B4G1646E-BYMATCV 4Gb DDR3L SDRAM 96-FBGA K4B4G1646E-BYMATCV equivalent K4B4G1646E-BYMATCV vs K4B4G1646D-BYMA0 K4B4G1646E-BYMATCV pinout DDR3L memory for embedded systems K4B4G1646E-BYMATCV in stock

Komponen dan Istilah Terkait

Samsung Electronics K4B4G1646E-BYMATCV K4B4G1646E-BYMA K4B4G1646E-BYK0 K4B4G1646D-BYMA0 MT41K256M16RE-125:D H5TC4G63AFR-PBA IS43TR16256AL-125KBL DDR3L SDRAM SDRAM FBGA-96 JEDEC RoHS 1.35V 1866 Mbps E-die D-die On-die termination Auto precharge Self-refresh
Kutipan Cepat RFQ
Isi detail lengkap — tim penjualan kami akan membalas dalam 24 jam
Nomor Part Manufaktur Paket QTY Harga Target Lengkap
✓
Kutipan telah disubmit!

Kami akan membalas email Anda dalam 24 jam

1
RFQ Dikirim
2
Kutipan Diterima
3
Order Ditempatkan
4
Pembayaran
5
Dikirim
6
Dikirim
Lihat Detil RFQ