K4B4G1646D-BCH90 - 4Gb DDR3L SDRAM x16 96FBGA | Samsung
MPN: K4B4G1646D-BCH90 ✓ AktifK4B4G1646D-BCH90 Ringkasan
DDR3L (Low Voltage DDR3) is a type of synchronous dynamic random-access memory that operates at a lower voltage (1.35V) compared to standard DDR3 (1.5V), reducing power consumption by about 20% while maintaining similar performance. It is part of the DDR3 SDRAM family, which uses double data rate architecture to transfer data on both edges of the clock, and is widely used in computing, networking, and embedded systems.
Key features include programmable CAS latency, write latency, on-die termination (ODT), and internal calibration (ZQ calibration) for signal integrity. The device supports auto precharge, asynchronous reset, and data mask functions. It is lead-free and halogen-free, RoHS compliant, and operates over a temperature range of 0°C to +85°C.
The K4B4G1646D-BCH90 uses a D-die process, offering improved performance and power efficiency. The 96-ball FBGA package provides a compact footprint with excellent thermal and electrical characteristics. The device supports burst lengths of 8 and 4, and features programmable CAS latency from 9 to 14 clocks.
Typical applications include mobile devices, consumer electronics, networking equipment, and embedded systems where low power and high density are critical. The 1.35V operation makes it ideal for battery-powered devices, while the high-speed interface supports bandwidth-intensive tasks.
When designing with this device, ensure proper decoupling and signal integrity practices, including controlled impedance traces and termination. The ZQ calibration pin requires a 240-ohm resistor to ground for accurate on-die termination calibration.
Alternatif penggantian untuk K4B4G1646D-BCH90 — paket yang sama, pin-pada-pin kompatibel. Bagian paket yang berbeda memerlukan kerja ulang PCB diabaikan.
Variasi di dalam seri ini
Model-series yang sama yang kompatibel dengan penggantian K4B4G1646D-BCH90 (sama faktor bentuk dan footprint) — berbeda di dalam Supply Voltage, CAS Latency, Package, Burst Length, Data Rate.
K4B4G1646D-BHMA
✅ Drop-InKontak untuk harga
Lihat Datasheet →K4B4G1646D-BYK0
✅ Drop-InKontak untuk harga
Lihat Datasheet →K4B4G1646D-BCMA
✅ Drop-In📋 Alternatif referensi (tidak dalam katalog)
K4B4G1646D-BFMA
✅ Drop-InKontak untuk harga
Lihat Datasheet →K4B4G1646E-BMMA
✅ Drop-InKontak untuk harga
Lihat Datasheet →MT41K256M16HA-125
✅ Drop-In ⚠️ Spesifikasi Tidak DisahkanKontak untuk harga
Lihat Datasheet →H5TC4G63AFR
✅ Drop-In ⚠️ Spesifikasi Tidak Disahkan📋 Alternatif referensi (tidak dalam katalog)
K4B4G1646D-BCH90 Rating Maksimal & Karakteristik Listrik
| Tipe Memori | DDR3L SDRAM |
| Density | 4Gb |
| Organisasi | 32M x 16 |
| Number of Banks | 8 |
| Laju Data | 2133 Mb/s per pin |
| Tegangan Pemuat | 1.35V (1.283V to 1.45V) |
| Paket | 96-ball FBGA |
| Suhu Kerja | 0°C to +85°C |
| Latensi CAS | 9-14 clocks (programmable) |
| Burst Length | 8 and 4 |
| On-Die Termination | Yes (ODT) |
| ZQ Calibration | Yes |
| Auto Precharge | Yes |
| Asynchronous Reset | Yes |
| Data Mask | Yes |
| RoHS Compliant | Yes |
| Lead-Free | Yes |
| Bebas Halogen | Yes |
Konfigurasi Pin K4B4G1646D-BCH90
| Pin produk A1 | VDD — Power supply |
| Pin produk A2 | DQ0 — Data input/output 0 |
| Pin produk A3 | DQ1 — Data input/output 1 |
| Pin produk A4 | VSS — Ground |
| Pin produk A5 | DQ2 — Data input/output 2 |
| Pin produk A6 | DQ3 — Data input/output 3 |
| Pin produk A7 | VDD — Power supply |
| Pin produk A8 | DQ4 — Data input/output 4 |
| Pin produk A9 | DQ5 — Data input/output 5 |
| Pin produk A10 | VSS — Ground |
| Pin produk A11 | DQ6 — Data input/output 6 |
| Pin produk A12 | DQ7 — Data input/output 7 |
| Pin produk B1 | VSS — Ground |
| Pin produk B2 | DQ8 — Data input/output 8 |
| Pin produk B3 | DQ9 — Data input/output 9 |
| Pin produk B4 | VDD — Power supply |
| Pin produk B5 | DQ10 — Data input/output 10 |
| Pin produk B6 | DQ11 — Data input/output 11 |
| Pin produk B7 | VSS — Ground |
| Pin produk B8 | DQ12 — Data input/output 12 |
| Pin produk B9 | DQ13 — Data input/output 13 |
| Pin produk B10 | VDD — Power supply |
| Pin produk B11 | DQ14 — Data input/output 14 |
| Pin produk B12 | DQ15 — Data input/output 15 |
| Pin produk C1 | VDDQ — I/O power supply |
| Pin produk C2 | VSSQ — I/O ground |
| Pin produk C3 | VDDQ — I/O power supply |
| Pin produk C4 | VSSQ — I/O ground |
| Pin produk C5 | VDDQ — I/O power supply |
| Pin produk C6 | VSSQ — I/O ground |
| Pin produk C7 | VDDQ — I/O power supply |
| Pin produk C8 | VSSQ — I/O ground |
| Pin produk C9 | VDDQ — I/O power supply |
| Pin produk C10 | VSSQ — I/O ground |
| Pin produk C11 | VDDQ — I/O power supply |
| Pin produk C12 | VSSQ — I/O ground |
| Pin produk D1 | A0 — Address input 0 |
| Pin produk D2 | A1 — Address input 1 |
| Pin produk D3 | A2 — Address input 2 |
| Pin produk D4 | A3 — Address input 3 |
| Pin produk D5 | A4 — Address input 4 |
| Pin produk D6 | A5 — Address input 5 |
| Pin produk D7 | A6 — Address input 6 |
| Pin produk D8 | A7 — Address input 7 |
| Pin produk D9 | A8 — Address input 8 |
| Pin produk D10 | A9 — Address input 9 |
| Pin produk D11 | A10/AP — Address input 10 / auto precharge |
| Pin produk D12 | A11 — Address input 11 |
| Pin produk E1 | A12 — Address input 12 |
| Pin produk E2 | A13 — Address input 13 |
| Pin produk E3 | A14 — Address input 14 |
| Pin produk E4 | BA0 — Bank address 0 |
| Pin produk E5 | BA1 — Bank address 1 |
| Pin produk E6 | BA2 — Bank address 2 |
| Pin produk E7 | RAS# — Row address strobe |
| Pin produk E8 | CAS# — Column address strobe |
| Pin produk E9 | WE# — Write enable |
| Pin produk E10 | CS# — Chip select |
| Pin produk E11 | CKE — Clock enable |
| Pin produk E12 | ODT — On-die termination |
| Pin produk F1 | CK — Clock |
| Pin produk F2 | CK# — Complementary clock |
| Pin produk F3 | VDD — Power supply |
| Pin produk F4 | VSS — Ground |
| Pin produk F5 | VDD — Power supply |
| Pin produk F6 | VSS — Ground |
| Pin produk F7 | VDD — Power supply |
| Pin produk F8 | VSS — Ground |
| Pin produk F9 | VDD — Power supply |
| Pin produk F10 | VSS — Ground |
| Pin produk F11 | VDD — Power supply |
| Pin produk F12 | VSS — Ground |
| Pin produk G1 | DM0 — Data mask 0 |
| Pin produk G2 | DM1 — Data mask 1 |
| Pin produk G3 | VSS — Ground |
| Pin produk G4 | VDD — Power supply |
| Pin produk G5 | VSS — Ground |
| Pin produk G6 | VDD — Power supply |
| Pin produk G7 | VSS — Ground |
| Pin produk G8 | VDD — Power supply |
| Pin produk G9 | VSS — Ground |
| Pin produk G10 | VDD — Power supply |
| Pin produk G11 | VSS — Ground |
| Pin produk G12 | VDD — Power supply |
| Pin produk H1 | ZQ — Calibration reference |
| Pin produk H2 | VSS — Ground |
| Pin produk H3 | VDD — Power supply |
| Pin produk H4 | VSS — Ground |
| Pin produk H5 | VDD — Power supply |
| Pin produk H6 | VSS — Ground |
| Pin produk H7 | VDD — Power supply |
| Pin produk H8 | VSS — Ground |
| Pin produk H9 | VDD — Power supply |
| Pin produk H10 | VSS — Ground |
| Pin produk H11 | VDD — Power supply |
| Pin produk H12 | VSS — Ground |
| Pin produk J1 | NC — No connect |
| Pin produk J2 | NC — No connect |
| Pin produk J3 | NC — No connect |
| Pin produk J4 | NC — No connect |
| Pin produk J5 | NC — No connect |
| Pin produk J6 | NC — No connect |
| Pin produk J7 | NC — No connect |
| Pin produk J8 | NC — No connect |
| Pin produk J9 | NC — No connect |
| Pin produk J10 | NC — No connect |
| Pin produk J11 | NC — No connect |
| Pin produk J12 | NC — No connect |
Aplikasi Umum
K4B4G1646D-BCH90 cocok untuk 6 aplikasis: Mobile Devices, Consumer Electronics, Networking Equipment, Embedded Systems, Computing Systems, Automotive Infotainment.
Mobile Devices
The K4B4G1646D-BCH90's low 1.35V operation and 4Gb density make it ideal for smartphones and tablets where power efficiency and compact size are critical. Its 2133Mb/s data rate supports high-bandwidth applications like HD video and gaming. The 96-ball FBGA package fits tight PCB layouts, and the commercial temperature range covers typical mobile use cases.
Direkomendasikan
Consumer Electronics
In consumer devices like smart TVs, set-top boxes, and gaming consoles, the K4B4G1646D-BCH90 provides the memory bandwidth needed for smooth multimedia playback and responsive user interfaces. Its 4Gb density supports multiple applications simultaneously, while the low voltage reduces overall system power. The FBGA package enables slim product designs.
Direkomendasikan
Networking Equipment
Routers, switches, and network appliances require high-speed memory for packet buffering and routing tables. The K4B4G1646D-BCH90's 2133Mb/s data rate and 4Gb density provide ample bandwidth and capacity. Its low power consumption is beneficial in always-on networking gear, and the commercial temperature range suits indoor environments.
Direkomendasikan
Embedded Systems
For industrial and embedded applications, the K4B4G1646D-BCH90 offers reliable DDR3L memory with a wide operating temperature range (0°C to +85°C). Its 4Gb density supports complex firmware and data logging. The 96-ball FBGA package is robust for harsh environments, and the low voltage reduces heat generation.
Direkomendasikan
Computing Systems
In laptops, mini-PCs, and servers, the K4B4G1646D-BCH90 provides high-density, low-power memory for multitasking and data-intensive workloads. Its 2133Mb/s speed ensures fast data access, while the 1.35V operation extends battery life in portable devices. The FBGA package is standard for SODIMM and board-down designs.
Direkomendasikan
Automotive Infotainment
Although the K4B4G1646D-BCH90 has a commercial temperature range, it can be used in automotive infotainment systems with proper thermal management. Its 4Gb density supports navigation, multimedia, and connectivity features. The low power consumption is beneficial for vehicle electrical systems, and the FBGA package withstands vibration.
Direkomendasikan
Ringkasan Produk Direkomendasikan
Data referensi engineering untuk K4B4G1646D-BCH90 — pembandingan, panduan desain, dan informasi konformitas.
Panduan Pemilihan
Pembandingan dengan Alternatif
| Parameter Umum | Produk Ini | K4B4G1646D-BHMA | K4B4G1646D-BYK0 | K4B4G1646E-BMMA | MT41K256M16HA-125 |
|---|---|---|---|---|---|
| Package | 96-ball FBGA | 96-ball FBGA | 96-ball FBGA | 96-ball FBGA | 96-ball FBGA |
| Brand | Samsung Electronics | Samsung Electronics | Samsung Electronics | Samsung Electronics | Micron Technology |
| Density | 4Gb | 4Gb | 4Gb | 4Gb | 4Gb |
| Organization | 32M x 16 | 32M x 16 | 32M x 16 | 32M x 16 | 32M x 16 |
| Supply Voltage | 1.35V | 1.35V | 1.35V | 1.35V | 1.35V |
| Operating Temperature | 0°C to +85°C | 0°C to +85°C | 0°C to +85°C | 0°C to +85°C | 0°C to +95°C |
| RoHS Compliant | Yes | Yes | Yes | Yes | Yes |
Diferensiator Kunci
- Low voltage operation at 1.35V (vsMT41K256M16HA-125)
- High data rate of 2133Mb/s (vsMT41K256M16HA-125)
- D-die process technology (vsK4B4G1646E-BMMA)
Catatan Desain
For reliable DDR3L operation, maintain controlled impedance of 40-50 ohms for data lines and 50-60 ohms for address/control lines. Keep trace lengths matched within 100 mils for each byte lane. Place decoupling capacitors (0.1uF and 0.01uF) close to each VDD and VDDQ pin, and a 10uF bulk capacitor near the memory power supply.
Use on-die termination (ODT) settings to match the memory bus impedance. The ZQ pin requires a 240-ohm resistor to ground for calibration. Ensure the reference voltage (VREF) is clean and stable, typically generated by a resistor divider or dedicated regulator. Follow the layout guidelines in the Samsung datasheet for optimal signal integrity.
The K4B4G1646D-BCH90 operates up to +85°C. In high-density designs, ensure adequate airflow or a thermal pad to dissipate heat. The FBGA package has a thermal resistance that should be considered; refer to the datasheet for theta_JA values. For automotive or industrial environments, consider a wider temperature grade if available.
Informasi Konformitas
RoHS compliant, lead-free, and halogen-free per Samsung datasheet. AEC-Q100 not applicable for memory components.
