K4A8G165WC-BCRC vs K4A8G165WB-BCTD Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci K4A8G165WC-BCRC disebabkan oleh Samsung Electro-Mechanics dan K4A8G165WB-BCTD disebabkan oleh Samsung Electronics. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Samsung Electro-Mechanics
K4A8G165WC-BCRC - 8Gb DDR4 SDRAM 2400Mbps x16 | Samsung
K4A8G165WC-BCRC ✓ AktifSamsung Electronics
K4A8G165WB-BCTD - 8Gb DDR4 SDRAM 512Mx16 2666Mbps | Samsung
K4A8G165WB-BCTD ✓ AktifPengandingan Spesifikasi
| Parametr | K4A8G165WC-BCRC | K4A8G165WB-BCTD |
|---|---|---|
| Merek | Samsung Electro-Mechanics | Samsung Electronics |
| Kategori | EEPROM | DRAM |
| Status Lingkungan Hidup | Aktif | Aktif |
| Status Stok | In Stock | — |
| Harga Unit (USD) | $19.69 | — |
| Jenis Ingatan | DDR4 SDRAM | DDR4 SDRAM |
| Saiz Ingatan | 8 Gbit | — |
| Organisasi | 512M x 16 | 512M x 16 |
| Kadar Data | 2400 Mbps | 2666 Mbps |
| Clock Frequency | 1333 MHz | — |
| Tegangan Pemberi Arus | 1.2 V (1.14 V to 1.26 V) | — |
| Antaramuka | Parallel, 16-bit DDR | DDR4 (parallel, double data rate) |
| Standby Current (Idle) | 2 mA | — |
| Operating Current | 64 mA | — |
| Suhu Operasi | 0 C to +95 C | 0C to +85C |
| Kemasan | 96-FBGA (TFBGA) | 96FBGA |
| Jenis Pemasangan | Surface Mount | Surface Mount (BGA) |
| Ciri-ciri | Auto precharge, asynchronous reset, CRC, ZQ calibration, dynamic ODT, data mask | — |
| Die Generation | C-die | B-die |
| Memory Format | DRAM | — |
| Status RoHS | Compliant | Compliant (per JLCPCB listing: ROHS) |
| Density | — | 8 Gb |
| Supply Voltage (VDD) | — | 1.2 V |
| Data Mask | — | Supported (DM per x16 lane) |
| ZQ Calibration | — | Supported |
| Dynamic On-Die Termination | — | Supported |
| Latensi CAS | — | [DATA_NEEDED: CAS Latency] |
| Refresh Rate | — | [DATA_NEEDED: Refresh Rate] |
| Moisture Sensitivity Level | — | [DATA_NEEDED: MSL Level] |