M29F160FB55N3F2 vs M29F800FB55N3F2 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci M29F160FB55N3F2 disebabkan oleh Micron Technology dan M29F800FB55N3F2 disebabkan oleh Micron Technology. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Micron Technology
M29F800FB55N3F2 - 8Mbit 5V Parallel NOR Flash 55ns | Micron
M29F800FB55N3F2 ✓ AktifPengandingan Spesifikasi
| Parametr | M29F160FB55N3F2 | M29F800FB55N3F2 |
|---|---|---|
| Merek | Micron Technology | Micron Technology |
| Kategori | Memory ICs | Memory ICs |
| Status Lingkungan Hidup | Obsolete | Aktif |
| Jenis Ingatan | Parallel NOR Flash | — |
| Density | 16777 kbits (16 Mbit) | — |
| Organisasi | 1 Mword x 16 bits / 2 Mbyte x 8 bits | 1M x 8 / 512K x 16 |
| Number of Words | 1000 k | — |
| Bits per Word | 16 bits | — |
| Access Time | 55 ns | 55 ns |
| Tegangan Pemberi Arus | 5 V | 5 V |
| Boot Block Architecture | Bottom Boot Block | Bottom Boot Block |
| Suhu Operasi | -40 to +125 C | -40C to +125C |
| Antaramuka | Parallel | — |
| Package Type | 48-TSOP | 48-pin TSOP1 |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Termination Finish | Lead-free (F2 suffix) | — |
| Program/Erase Controller | Embedded byte/word program algorithms | Embedded byte/word program algorithms |
| Block Protection | Hardware boot block protection | — |
| Status RoHS | Compliant (lead-free) | Compliant (lead-free terminations) |
| Speed Grade (from MPN) | 55 (55 ns) | — |
| Memory Density | — | 8389 kbits (8 Mbit) |
| Jenis Antaramuka | — | Parallel NOR |
| Temperature Grade | — | Automotive (AEC-Q100) |
| Package Shape | — | Rectangular (JESD designation TSOP1) |
| Terminal Count | — | 48 |
| JESD-609 Termination Code | — | e3 (lead-free) |
| Packaging | — | Tape & Reel (T/R) |