M29F160FB55N3F2 vs M29F800FB55N3F2 比較

詳細並排比較 M29F160FB55N3F2 由 Micron Technology 與 M29F800FB55N3F2 由 Micron Technology. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

Micron Technology
M29F160FB55N3F2 M29F160FB55N3F2 - 16Mbit 5V NOR Flash 55ns | Micron

M29F160FB55N3F2 - 16Mbit 5V NOR Flash 55ns | Micron

M29F160FB55N3F2 Obsolete
Micron Technology
M29F800FB55N3F2 M29F800FB55N3F2 - 8Mbit 5V Parallel NOR Flash 55ns | Micron

M29F800FB55N3F2 - 8Mbit 5V Parallel NOR Flash 55ns | Micron

M29F800FB55N3F2 ✓ 啟用中

規格比較

參數 M29F160FB55N3F2 M29F800FB55N3F2
品牌 Micron Technology Micron Technology
類別 Memory ICs Memory ICs
生命週期狀態 Obsolete 啟用中
記憶體類型 Parallel NOR Flash —
Density 16777 kbits (16 Mbit) —
組織 1 Mword x 16 bits / 2 Mbyte x 8 bits 1M x 8 / 512K x 16
Number of Words 1000 k —
Bits per Word 16 bits —
Access Time 55 ns 55 ns
供應電壓 5 V 5 V
Boot Block Architecture Bottom Boot Block Bottom Boot Block
工作溫度 -40 to +125 C -40C to +125C
介面 Parallel —
Package Type 48-TSOP 48-pin TSOP1
安裝類型 Surface Mount Surface Mount
Termination Finish Lead-free (F2 suffix) —
Program/Erase Controller Embedded byte/word program algorithms Embedded byte/word program algorithms
Block Protection Hardware boot block protection —
RoHS 狀態 Compliant (lead-free) Compliant (lead-free terminations)
Speed Grade (from MPN) 55 (55 ns) —
Memory Density — 8389 kbits (8 Mbit)
介面類型 — Parallel NOR
Temperature Grade — Automotive (AEC-Q100)
Package Shape — Rectangular (JESD designation TSOP1)
Terminal Count — 48
JESD-609 Termination Code — e3 (lead-free)
Packaging — Tape & Reel (T/R)

資料表與資源

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