AS4C512M16D4B-62BCNTR - 8Gb DDR4 SDRAM 512Mx16 | Alliance Memory
MPN: AS4C512M16D4B-62BCNTR ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $12.5 | $12.50 |
| 10 | $11.2 | $112.00 |
| 100 | $9.8 | $980.00 |
| 500 | $8.9 | $4,450.00 |
| 1,000 | $8.1 | $8,100.00 |
Drop-in alternatives for AS4C512M16D4B-62BCNTR — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
AS4C512M16D4B-62BCN
✅ Drop-In📋 Reference alternative (not in catalog)
AS4C512M16D4A-62BCN
✅ Drop-In✓ 99,999 In Stock
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View Datasheet →MT40A512M16TB-062E:R
✅ Drop-In✓ 99,999 In Stock
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View Datasheet →H5AN8G6NAFR-UHC
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View Datasheet →K4A8G165WB-BCTD
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View Datasheet →AS4C512M16D4B-62BCNTR Maximum Ratings & Electrical Characteristics
| Memory Type | DDR4 SDRAM |
| Memory Size | 8 Gbit (512M x 16) |
| Data Rate | 3200 MT/s |
| Clock Frequency | 1600 MHz |
| CAS Latency | 19 ns |
| Supply Voltage | 1.2 V (1.14V to 1.26V) |
| Interface | Parallel |
| Package | 96-FBGA (7.5x13 mm) |
| Operating Temperature | 0°C to 95°C |
| Mounting Type | Surface Mount |
| JEDEC Standard | Compliant |
| Organization | 512M x 16 |
| Revision | Rev.B |
| RoHS Status | Compliant |
| Lead-Free | Yes |
AS4C512M16D4B-62BCNTR Pin Configuration
| Pin A1 | VDD — Power supply (1.2V) |
| Pin A2 | DQ0 — Data input/output 0 |
| Pin A3 | DQ1 — Data input/output 1 |
| Pin B1 | VSS — Ground |
| Pin B2 | DQ2 — Data input/output 2 |
| Pin B3 | DQ3 — Data input/output 3 |
| Pin C1 | VDDQ — I/O power supply |
| Pin C2 | DQ4 — Data input/output 4 |
| Pin C3 | DQ5 — Data input/output 5 |
| Pin D1 | VSSQ — I/O ground |
| Pin D2 | DQ6 — Data input/output 6 |
| Pin D3 | DQ7 — Data input/output 7 |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
AS4C512M16D4B-62BCNTR is suitable for 6 applications: Server Memory, Networking Equipment, Industrial Computing, Automotive Infotainment, Consumer Electronics, Data Acquisition Systems.
Server Memory
The AS4C512M16D4B-62BCNTR provides high-density 8Gb DDR4 memory for server applications, enabling large memory pools for virtualization, cloud computing, and database workloads. Its 3200 MT/s data rate ensures fast data throughput, while the 1.2V operation reduces power consumption in data centers. The 96-ball FBGA package allows high-density board layouts, and the JEDEC compliance ensures compatibility with standard server memory controllers.
Recommended
Networking Equipment
In networking equipment such as routers and switches, the AS4C512M16D4B-62BCNTR offers high-bandwidth memory for packet buffering and forwarding tables. The 1600 MHz clock speed supports line-rate processing, and the low latency (19 ns) minimizes delays. The commercial temperature range (0-95°C) is suitable for most networking environments, and the compact FBGA package fits in space-constrained line cards.
Recommended
Industrial Computing
For industrial PCs and embedded systems, the AS4C512M16D4B-62BCNTR provides reliable, high-speed memory for real-time control and data acquisition. Its 8Gb density supports complex applications, and the 1.2V supply reduces heat generation in sealed enclosures. The device's JEDEC compliance ensures long-term availability and compatibility with industrial-grade processors.
Recommended
Automotive Infotainment
The AS4C512M16D4B-62BCNTR can be used in automotive infotainment systems for navigation, multimedia, and instrument clusters. Its high data rate supports smooth graphics rendering, and the 8Gb capacity accommodates large maps and media files. However, the commercial temperature range (0-95°C) limits use to cabin environments, not under-hood applications. For automotive-grade, consider AEC-Q100 qualified parts.
Recommended
Consumer Electronics
In high-end consumer electronics like gaming consoles and set-top boxes, the AS4C512M16D4B-62BCNTR delivers the memory bandwidth needed for immersive experiences. The 3200 MT/s data rate supports 4K video streaming and complex game physics. The low power consumption extends battery life in portable devices, and the compact package enables slim designs.
Recommended
Data Acquisition Systems
For high-speed data acquisition systems, the AS4C512M16D4B-62BCNTR provides large buffer memory to store sampled data before processing. Its fast write speed ensures no data loss during continuous sampling, and the 8Gb capacity allows extended recording times. The parallel interface simplifies integration with FPGAs and DSPs, and the low voltage reduces noise in sensitive analog front-ends.
Recommended
Recommended Products Summary
Engineering reference data for AS4C512M16D4B-62BCNTR — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | AS4C512M16D4B-62BCN | MT40A512M16TB-062E:R | H5AN8G6NAFR-UHC |
|---|---|---|---|---|
| Package | 96-FBGA (7.5x13) | 96-FBGA (7.5x13) | 96-FBGA (7.5x13) | 96-FBGA (7.5x13) |
| Brand | Alliance Memory | Alliance Memory | Micron Technology | SK Hynix |
| Memory Size | 8 Gbit | 8 Gbit | 8 Gbit | 8 Gbit |
| Data Rate | 3200 MT/s | 3200 MT/s | 3200 MT/s | 3200 MT/s |
| Supply Voltage | 1.2V | 1.2V | 1.2V | 1.2V |
| Operating Temperature | 0 to 95°C | 0 to 95°C | 0 to 95°C | 0 to 95°C |
| CAS Latency | 19 ns | 19 ns | 19 ns | 19 ns |
| JEDEC Compliance | Yes | Yes | Yes | Yes |
Key Differentiators
- Drop-in replacement for major brands (vs MT40A512M16TB-062E:R)
- Tape-and-reel packaging for automated assembly (vs AS4C512M16D4B-62BCN)
- Commercial temperature range for cost savings (vs H5AN8G6NAFR-UHC)
Design Notes
The AS4C512M16D4B-62BCNTR requires a stable 1.2V supply (VDD) and 1.2V I/O supply (VDDQ). Use low-ESR ceramic capacitors (0.1uF and 1uF) placed close to each power pin to decouple high-frequency noise. The total decoupling capacitance should be at least 2uF per device.
For high-speed DDR4 signals, maintain controlled impedance of 40-50 ohms for DQ/DQS lines and 40 ohms for address/command lines. Keep trace lengths matched within +/- 0.5mm for each byte lane. Use ground planes beneath the memory area to reduce EMI and signal crosstalk.
The AS4C512M16D4B-62BCNTR has a maximum operating temperature of 95°C. Ensure adequate airflow or heatsinking in high-ambient environments. The 96-ball FBGA package has a thermal resistance of approximately 20°C/W; calculate junction temperature to avoid exceeding the limit.
Compliance Information
RoHS compliant per distributor listings. No AEC-Q100 qualification for this commercial-temperature part.
