EP1S60F1020C6NGB - Stratix FPGA 57K LE 1020-BGA | Intel
MPN: EP1S60F1020C6NGB ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $256.5 | $2,565.00 |
| 100 | $228 | $22,800.00 |
| 500 | $199.5 | $99,750.00 |
| 1,000 | $171 | $171,000.00 |
Drop-in alternatives for EP1S60F1020C6NGB — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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View Datasheet →EP1S60F1020C6NGB Maximum Ratings & Electrical Characteristics
| Family | Stratix |
| Logic Elements (LE) | 57,120 |
| System Gates | ~5,215,104 |
| Maximum User I/O | 773 |
| DSP Blocks | 18 |
| PLLs | 12 |
| Package | 1020-ball FBGA |
| Package Dimensions | 33 x 33 mm, 1.0 mm pitch |
| Process Technology | 0.13 µm CMOS |
| Speed Grade | -6 (commercial) |
| Operating Temperature | 0 °C to 85 °C (commercial) |
| I/O Standard Support | LVTTL, LVCMOS, LVDS, SSTL, HSTL |
| Mounting Type | Surface Mount (BGA) |
EP1S60F1020C6NGB Pin Configuration
| Pin A1 | IO — User I/O (function assigned by Quartus pin planner) |
| Pin A2 | IO — User I/O |
| Pin B1 | IO — User I/O |
| Pin B2 | GND — Ground |
| Pin C1 | VCCIO1 — I/O bank 1 supply voltage |
| Pin C2 | VCCINT — Core supply voltage |
| Pin D1 | VCCPD — Pre-driver supply voltage |
| Pin D2 | IO — User I/O |
| Pin E1 | CLK0 — Dedicated clock input 0 |
| Pin E2 | CLK1 — Dedicated clock input 1 |
| Pin F1 | GND — Ground |
| Pin F2 | IO — User I/O |
| Pin G1 | VCCA_PLL — PLL analog supply voltage |
| Pin G2 | GNDA_PLL — PLL analog ground |
| Pin H1 | IO — User I/O |
| Pin H2 | VCCIO2 — I/O bank 2 supply voltage |
| Pin J1 | MSEL0 — Configuration mode select 0 |
| Pin J2 | MSEL1 — Configuration mode select 1 |
| Pin K1 | nCONFIG — Configuration control (active low) |
| Pin K2 | nSTATUS — Configuration status (active low) |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1S60F1020C6NGB is suitable for 6 applications: Telecommunications Baseband Processing, High-Speed Networking Line Cards, ASIC Prototyping, Military and Aerospace Signal Processing, Broadcast Video Infrastructure, Test and Measurement Equipment.
Telecommunications Baseband Processing
The EP1S60F1020C6NGB's 57,120 logic elements and 18 dedicated DSP blocks make it well-suited for WCDMA and early LTE baseband processing where channel cards demand dense FIR filtering, Viterbi decoding, and FFT/IFFT operations. The Stratix DSP blocks accelerate 9-bit signed multiplications, allowing many parallel taps in a single chip. With 12 PLLs and 773 user I/O, the device handles multiple antenna streams and IQ datapaths while keeping all baseband processing on one FPGA, eliminating the inter-FPGA routing that degrades timing margin in high-speed designs.
Recommended
High-Speed Networking Line Cards
Stratix EP1S60 devices are widely deployed in OC-192 / 10 Gbps line cards where the FPGA performs packet classification, traffic management, and SERDES aggregation. The 1020-ball FBGA variant of the EP1S60F1020C6NGB provides the I/O density required to connect multiple SFP+ optical modules, XAUI interfaces, and backplane SERDES simultaneously. The 12 PLLs synthesize independent clocks for ingress and egress paths, supporting line-rate processing without external clock buffers. Per-bank VCCIO pins simplify mixed-voltage interfacing to PHYs operating at 1.5 V or 1.8 V.
Recommended
ASIC Prototyping
The EP1S60F1020C6NGB is frequently used to prototype large ASIC RTL pre-silicon because the Stratix 4-LUT architecture maps cleanly to standard-cell netlists. With 57,120 LEs, ~5.2 M system gates, and 6.6 Mbit of block RAM, the device can hold meaningful sub-blocks of a multi-million-gate ASIC. The 1020-ball FBGA package provides abundant user I/O for partitioning the prototype across multiple FPGAs, and Quartus II floorplanning tools allow pin-accurate mapping between the prototype and the final ASIC pads.
Recommended
Military and Aerospace Signal Processing
The Stratix family has long been deployed in military radar and electronic-warfare subsystems, and the EP1S60F1020C6NGB in its commercial 0-85 °C variant serves as a cost-effective development platform with migration paths to industrial or military temperature grades. The 18 DSP blocks accelerate pulse-Doppler radar FFTs and beamforming, while the large TriMatrix memory absorbs multi-microsecond radar returns without external SRAM. Designers should note that the EP1S60F1020C6NGB itself is commercial temperature, so production flight hardware typically migrates to the I-grade variants (EP1S60F1020I6N).
Recommended
Broadcast Video Infrastructure
Broadcast studios and video routers leverage the EP1S60F1020C6NGB for SDI and HD-SDI cross-point switching, format conversion, and chroma keying. The 773 user I/O pins accommodate dozens of SDI data streams running at 270 Mbps or 1.485 Gbps, with the Stratix LVDS support enabling direct connection to SDI serializer/deserializer chips. The device's block RAM is well-suited to line-store buffers used in de-interlacing and frame-rate conversion. The 1020-ball FBGA package supports the high pin-count required for broadcast matrix routers without resorting to multi-FPGA partitioning.
Recommended
Test and Measurement Equipment
Test equipment manufacturers used the EP1S60F1020C6NGB in logic analyzers, protocol exercisers, and high-speed BERT systems where FPGA flexibility lets one platform support multiple standards. The 12 PLLs synthesize test-specific frequencies on demand, and the abundant DSP blocks accelerate real-time PRBS generation and error counting. The 1020-ball FBGA exposes 773 user I/O, allowing direct probing of wide parallel buses and protocol interfaces without external multiplexing. The -6 speed grade provides sufficient Fmax for 200+ MHz state-machines typical of protocol analyzers.
Recommended
Recommended Products Summary
Engineering reference data for EP1S60F1020C6NGB — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1S60F1020C6N | EP1S60F1020C6 | EP1S60F1020C6NAA | EP1S60F1020C5N | EP1S40F1020C6 |
|---|---|---|---|---|---|---|
| Package | 1020-ball FBGA (33x33 mm, 1.0 mm pitch) | 1020-ball FBGA - same | 1020-ball FBGA - same | 1020-ball FBGA - same | 1020-ball FBGA - same | 1020-ball FBGA - same |
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 57,120 LE | 57,120 LE | 57,120 LE | 57,120 LE | 57,120 LE | ~41,250 LE (-28%) |
| Speed Grade | -6 | -6 | -6 | -6 | -5 (slower) | -6 |
| Maximum User I/O | 773 | 773 | 773 | 773 | 773 | [DATA_NEEDED] |
| DSP Blocks | 18 | 18 | 18 | 18 | 18 | [DATA_NEEDED] |
| Process Technology | 0.13 µm CMOS | 0.13 µm CMOS | 0.13 µm CMOS | 0.13 µm CMOS | 0.13 µm CMOS | 0.13 µm CMOS |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Key Differentiators
- Highest-density Stratix variant on the 1020-ball FBGA footprint (vs EP1S40F1020C6)
- Speed grade -6 is the volume-production sweet spot for Stratix (vs EP1S60F1020C5N)
- Same 1020-ball FBGA pinout across all EP1S60F1020 suffixes (vs EP2S60F1020C5N (Stratix II))
Design Notes
Estimated: Stratix EP1S60 designs typically require at least 3-4 separate supply rails (VCCINT for core, VCCIO per bank, VCCPD for pre-drivers, and VCCA_PLL for PLL analog), each sequenced according to the Stratix Family Data Sheet. Use a multi-rail controller such as the LTC3418 or TI TPS74xxx series to enforce the power-on sequence and prevent excessive inrush current on the core rail. Decoupling requires dozens of 0.1 µF and 0.01 µF X7R ceramics distributed across the BGA underside, plus bulk polymer or tantalum capacitors on each rail.
Estimated: at full utilization (57,120 LEs, 18 DSP blocks, 773 I/O switching at 100 MHz), the EP1S60F1020C6NGB can dissipate 5-8 W depending on toggle rate and I/O drive strength. The 1020-ball FBGA package has theta_JA in the 12-15 C/W range with a properly designed thermal via array under the package. Design a 6×6 or 8×8 thermal via farm on inner PCB layers connected to an internal ground plane. For full-power operation, attach a heatsink with thermal interface material to the package top.
Estimated: the 1020-ball FBGA at 1.0 mm pitch requires a 4-6 layer PCB with HDI (microvia) stack-up; standard 8/8 mil via-in-pad or laser-drilled microvias are mandatory. Escape routing from the inner balls uses 4 mil traces with 4 mil spacing on the top microvia layer, fanning into 5 mil traces on internal layers. Maintain 50 Ω impedance on LVDS pairs by tuning trace width and dielectric spacing. Use a 33 × 33 mm land pattern with 0.5 mm solder-mask-defined (SMD) or non-solder-mask-defined (NSMD) pads per Stratix design guidelines.
Estimated: common design mistakes with the EP1S60F1020C6NGB include (1) omitting VCCPD decoupling, which causes configuration failures; (2) using incorrect MSEL[2:0] settings for the intended configuration mode (AS, AP, PS, JTAG); (3) connecting JTAG TCK too long without proper termination, causing boundary-scan failures; (4) ignoring per-bank VCCIO voltage constraints when mixing LVDS (2.5 V) and LVCMOS (3.3 V) on adjacent banks. Refer to AN 346: Using the Stratix Device Configuration Bit Stream Error Correction feature and the Quartus II configuration handbook.
Compliance Information
EP1S60F1020C6NGB is from the original Stratix family (0.13 µm CMOS). The Intel/Altera legacy datasheet does not surface explicit RoHS / REACH compliance in the verified web snippets; verify on the official Intel PSG documentation portal before using in RoHS-bound designs. Not AEC-Q100 qualified (FPGA, not an automotive analog IC).
