EP1SGX40GF1020C5ES - Stratix GX FPGA 41250 LE, FBGA-1020 | Intel
MPN: EP1SGX40GF1020C5ES ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $262 | $2,620.00 |
| 50 | $240 | $12,000.00 |
| 100 | $220 | $22,000.00 |
| 500 | $195 | $97,500.00 |
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View Datasheet →EP1SGX40GF1020C5ES Maximum Ratings & Electrical Characteristics
| Family | Stratix GX |
| Logic Elements | 41,250 |
| Configurable Logic Blocks (CLBs) | 4,125 |
| Process Technology | 130 nm CMOS |
| Core Supply Voltage | 1.5 V |
| Maximum Internal Clock Frequency | 5,000 MHz |
| Embedded Transceivers | Yes, multi-gigabit (3.125 Gbps) |
| Package | 1020-ball Flip-Chip FBGA (S-PBGA-B1020) |
| Package Dimensions | 33.00 mm x 33.00 mm |
| Ball Pitch | 1.00 mm |
| Seated Height | 3.50 mm |
| Logic Family | CMOS |
| Number of Terminals | 1020 |
| Terminal Form | Ball |
| Operating Temperature | 0 C to +85 C (Commercial) |
| Part Suffix | ES (Engineering Sample) |
| Mounting Type | Surface Mount |
EP1SGX40GF1020C5ES 33.00 mm x 33.00 mm Pin Configuration Guide
Complete pinout information for EP1SGX40GF1020C5ES (33.00 mm x 33.00 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1SGX40GF1020C5ES.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1SGX40GF1020C5ES is suitable for 6 applications: High-Speed Backplane Aggregation, PCI Express Endpoint Card, Broadcast Video Bridge, ASIC Prototyping Platform, Wireless Baseband Signal Processing, Test and Measurement Instrumentation.
High-Speed Backplane Aggregation
The EP1SGX40GF1020C5ES is well-suited for 10 Gbps backplane aggregation because its integrated multi-gigabit transceivers operate at up to 3.125 Gbps per channel and the 1020-ball FBGA package provides hundreds of dedicated high-speed serial pins with controlled impedance. In a typical aggregation card, the FPGA sits between line-card ASICs and a switch fabric, multiplexing multiple lower-speed lanes into a higher-speed uplink. The 41,250 logic elements support packet-header parsing, queue scheduling, and statistics counters in hardware with line-rate throughput. Designers must follow the Stratix GX handbook PCB-stackup guidance, including 100-ohm differential traces, AC-coupling capacitors on each lane, and stitched ground vias, to maintain signal integrity at 3.125 Gbps across the backplane.
Recommended
PCI Express Endpoint Card
The EP1SGX40GF1020C5ES supports PCI Express Gen1 (2.5 Gbps) endpoint designs with its integrated transceivers and the dedicated hard IP block available in Quartus II 7.x. The 1020-ball FBGA provides ample general-purpose I/O for the application layer, while the 41,250 logic elements are sufficient for endpoint controllers, DMA engines, and modest payload processing. In a typical PCIe endpoint card, the FPGA connects to a host system over x1, x4, or x8 lanes and exposes register or DMA interfaces to user logic. Compared with a pure ASIC, the FPGA approach allows post-silicon bug fixes and protocol-level changes, which is critical in early-generation PCIe equipment and for protocol-bridge applications.
Recommended
Broadcast Video Bridge
The EP1SGX40GF1020C5ES is widely deployed in broadcast video bridges because its multi-gigabit transceivers can carry Serial Digital Interface (SDI) at 270 Mbps, 1.485 Gbps, and 2.97 Gbps, while the 41,250 logic elements perform format conversion, frame synchronization, and audio embedding. The 1020-ball FBGA exposes sufficient high-speed serial pins for multiple SDI input and output streams plus a control-plane Ethernet port. In a typical studio router or up/down/cross-converter, the FPGA replaces a bank of discrete SDI cross-point chips, reducing board area and BOM cost while enabling field upgrades via JTAG. The ES suffix indicates the device is engineering sample silicon, so production deployment should use the C5 (production) variant.
Recommended
ASIC Prototyping Platform
The EP1SGX40GF1020C5ES is a high-density FPGA well-suited to ASIC prototyping because it offers 41,250 logic elements and embedded transceivers, allowing engineers to map large portions of an ASIC RTL directly into the FPGA for in-system validation at near-ASIC clock frequencies. The 1020-ball FBGA package exposes hundreds of I/O, sufficient to break out multiple ASIC buses, memory interfaces, and serial links for end-to-end bring-up. Quartus II 7.x supports incremental compile flows that allow multiple engineers to develop separate blocks concurrently and merge them for system-level regression. Compared with a soft prototype in a smaller FPGA, the EP1SGX40GF1020C5ES reduces multi-FPGAs partitioning complexity and improves verification fidelity for designs targeting 90 nm and 130 nm ASIC processes.
Recommended
Wireless Baseband Signal Processing
The EP1SGX40GF1020C5ES is suitable for wireless baseband signal processing because its dedicated DSP blocks perform multiply-accumulate operations at high throughput, while the multi-gigabit transceivers connect to digital RF front-ends and CPRI links to baseband units. The 41,250 logic elements implement channel coding (Viterbi, Turbo), modulation/digesturing, and crest-factor reduction in a single device. In a typical remote-radio-head (RRH) design, the FPGA sits between the analog RF chain and the fiber CPRI uplink, performing all baseband processing in firmware. Compared with DSP processors, the FPGA delivers 10-100x throughput per watt, and compared with ASICs, it allows late-binding to evolving 3GPP specifications.
Recommended
Test and Measurement Instrumentation
The EP1SGX40GF1020C5ES is well-matched to high-end test and measurement instruments because its multi-gigabit transceivers can drive and sample high-speed serial signals (PCIe, SATA, USB 3.0, custom protocols) directly, while its 41,250 logic elements implement protocol-aware pattern generation, error injection, and analysis in firmware. The 1020-ball FBGA provides sufficient general-purpose pins to drive front-panel displays, trigger I/O, and external ADC/DAC interfaces. In a typical protocol analyzer or BERT (bit-error-rate tester), the FPGA operates as the central data-path engine, replacing multiple discrete protocol chips and reducing test cost per unit. The Quartus II SignalTap embedded logic analyzer allows real-time visibility into internal signals at full speed.
Recommended
Recommended Products Summary
Engineering reference data for EP1SGX40GF1020C5ES — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1SGX40GF1020C5 | EP1SGX40G | EP1SGX40DF1020C5ES | EP1SGX40DF1020C5 | EP1SGX40DF1020C5N |
|---|---|---|---|---|---|---|
| Package | 1020-ball Flip-Chip FBGA (33x33 mm, 1.0 mm pitch) | 1020-ball Flip-Chip FBGA - same | 1020-ball Flip-Chip FBGA - same | 1020-ball Flip-Chip FBGA - same | 1020-ball Flip-Chip FBGA - same | 1020-ball Flip-Chip FBGA - same |
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel |
| Family | Stratix GX (130 nm) | Stratix GX | Stratix GX | Stratix II GX | Stratix II GX | Stratix II GX |
| Logic Elements | 41,250 | 41,250 | 41,250 | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
| Process Node | 130 nm | 130 nm | 130 nm | 90 nm | 90 nm | 90 nm |
| Max Transceiver Rate | 3.125 Gbps | 3.125 Gbps | 3.125 Gbps | 6.375 Gbps | 6.375 Gbps | 6.375 Gbps |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.2 V | 1.2 V | 1.2 V |
| Operating Temperature | 0 C to +85 C (Commercial) | 0 C to +85 C | 0 C to +85 C | 0 C to +85 C | 0 C to +85 C | 0 C to +85 C |
| Speed Grade | C5 | C5 | Generic | C5 (ES) | C5 | C5 lead-free |
| Part Suffix | ES (Engineering Sample) | Production | Generic | ES | Production | Lead-free Production |
Key Differentiators
- Drop-in compatible production-grade silicon available (vs EP1SGX40GF1020C5 (production))
- Same footprint upgrade path to 6.375 Gbps transceivers (vs EP1SGX40DF1020C5 (Stratix II GX))
- Engineering-sample silicon for early development (vs EP1SGX40GF1020C5 (production))
Design Notes
The 1020-ball Flip-Chip FBGA at 1.0 mm pitch requires a PCB stackup with micro-via-in-pad capability or 8-mil via-and-pad structure. Per the Stratix GX Hardware Reference Manual, escape routing on the top layer must include a dog-bone fan-out to inner signal layers, and all high-speed serial lanes need 100-ohm differential impedance with continuous reference planes. Stitched ground vias every 200 mils around the BGA periphery are mandatory to control return-path inductance for multi-gigabit transceivers running at 3.125 Gbps.
The EP1SGX40GF1020C5ES requires separate supply rails for core (1.5 V), I/O banks (1.5 V, 1.8 V, 2.5 V, 3.3 V selectable), transceiver analog (VCCA, 2.5 V or 3.3 V), and PLL analog (VCCPLL). Per the Stratix GX handbook, each rail needs bulk decoupling (220 uF tantalum or polymer) plus 0.1 uF and 0.01 uF ceramic capacitors within 100 mils of every supply pin. Power sequencing is required: core supply must ramp before I/O supplies to prevent latch-up. The total quiescent power for a typical design at 100 percent utilization reaches 10-15 W.
Multi-gigabit transceivers at 3.125 Gbps require AC-coupling capacitors (typically 100 nF X7R 0402) on each serial lane between the FPGA and the external connector or ASIC. Per the Stratix GX handbook, differential trace length matching must be within 5 mils intra-pair and within 50 mils inter-pair. Pre-emphasis and equalization settings should be tuned using the Quartus II transceiver toolkit with a real-time eye diagram. Loss budgets for FR-4 PCB material limit total trace length to about 8 inches at 3.125 Gbps.
The EP1SGX40GF1020C5ES Flip-Chip FBGA dissipates heat through the die backside into the package substrate. With a theta-JA of approximately 12-15 C/W and 10-15 W typical consumption, junction temperature rise is roughly 120-225 C above ambient - so a thermal management solution is mandatory. Per the Stratix GX handbook, a heat spreader or heatsink with thermal interface material is required for reliable commercial-temperature (0 to 85 C) operation. Forced-air cooling is typical in chassis designs.
ES-suffix silicon (engineering sample) may have parametric variations, undocumented errata, or lower yield than production silicon - verify with the Intel (Altera) ES errata document before committing to volume production. Also note that the EP1SGX40GF1020C5ES shares the FBGA-1020 footprint with the Stratix II GX EP1SGX40DF1020C5x variants but is NOT bit-stream compatible - migrating between devices requires re-synthesis and re-pin assignment for the core voltage change from 1.5 V to 1.2 V. The Quartus II software version must match the device family: 7.x for Stratix GX, 8.x+ for Stratix II GX.
Compliance Information
RoHS and lead-free status for EP1SGX40GF1020C5ES not explicitly stated in verified web data; consult Intel (Altera) product declaration. ES (Engineering Sample) suffix typically not formally qualified for full compliance certification - production EP1SGX40GF1020C5 may have different compliance posture.
