EPM3512AFC256-7/AFI256-10 - MAX 3000A CPLD 512 Macrocells 256-BGA | Altera
MPN: EPM3512AFC256-7/AFI256-10 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $28.5 | $28.50 |
| 10 | $25.4 | $254.00 |
| 100 | $22.1 | $2,210.00 |
| 500 | $19.75 | $9,875.00 |
| 1,000 | $17.2 | $17,200.00 |
Drop-in alternatives for EPM3512AFC256-7/AFI256-10 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EPM3512AFC256-10N
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View Datasheet →EPM3512AFC256-3N
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View Datasheet →EPM3512AFC256-7/AFI256-10 Maximum Ratings & Electrical Characteristics
| Family | MAX 3000A |
| Logic Elements | 512 macrocells |
| Usable Gates | 10,000 |
| User I/O Pins | 208 |
| Supply Voltage (VCCINT) | 3.3 V |
| MultiVolt I/O Voltage (VCCIO) | 2.5 V / 3.3 V / 5 V tolerant |
| Pin-to-Pin Delay (tPD, -7 grade) | 7.5 ns |
| Pin-to-Pin Delay (tPD, -10 grade) | 10 ns |
| Internal Counter Frequency | Up to 227.3 MHz |
| Technology | EEPROM-based, 0.30 µm CMOS |
| Package | 256-ball FineLine BGA |
| Mounting Type | Surface Mount |
| Programming Interface | JTAG (IEEE Std. 1149.1) / ISP |
| Output Enables | 10 |
EPM3512AFC256-7/AFI256-10 Pin Configuration
| Pin A1 | I/O — User I/O (bank 1) |
| Pin A2 | GND — Ground |
| Pin B1 | I/O — User I/O (bank 1) |
| Pin B2 | VCCIO1 — I/O bank 1 supply (2.5V/3.3V/5V) |
| Pin C1 | I/O — User I/O (bank 1) |
| Pin C2 | I/O — User I/O (bank 1) |
| Pin D1 | I/O — User I/O (bank 2) |
| Pin D2 | VCCIO2 — I/O bank 2 supply |
| Pin E1 | GND — Ground |
| Pin E2 | I/O — User I/O (bank 2) |
| Pin F1 | TDI — JTAG Test Data In |
| Pin F2 | TMS — JTAG Test Mode Select |
| Pin G1 | TCK — JTAG Test Clock |
| Pin G2 | TDO — JTAG Test Data Out |
| Pin H1 | I/O — User I/O (bank 3) |
| Pin H2 | VCCIO3 — I/O bank 3 supply |
| Pin J1 | GND — Ground |
| Pin J2 | I/O — User I/O (bank 3) |
| Pin K1 | I/O — User I/O (bank 4) |
| Pin K2 | VCCIO4 — I/O bank 4 supply |
| Pin L1 | I/O — User I/O (bank 4) |
| Pin L2 | I/O — User I/O (bank 4) |
| Pin M1 | I/O — User I/O (bank 5) |
| Pin M2 | VCCINT — Core supply (3.3 V) |
| Pin N1 | GLOBALCLK — Global clock input |
| Pin N2 | OE1 — Output enable 1 |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EPM3512AFC256-7/AFI256-10 is suitable for 6 applications: Bus Address Decoding and Glue Logic, 5 V to 3.3 V Mixed-Voltage Level Translation, FPGA Configuration and Power Sequencing Controller, High-Speed State Machine and FIFO Controller, JTAG-Boundary Scan Test Infrastructure, Industrial Automation and Process Control.
Bus Address Decoding and Glue Logic
The EPM3512AFC256-7/AFI256-10 is widely deployed as a board-level glue-logic device between microprocessors, memories, and peripherals. Its 512 macrocells can hold dense address decode trees for ISA, PCI, VME, and VXI backplanes, replacing dozens of 74-series TTL gates. The 208 user I/Os and ten output enables let the device fan out chip-selects to multiple peripherals without external buffering. With 7.5 ns tPD on the -7 grade, address-to-chip-select latency is deterministic and well below typical memory access budgets, so designers can rely on the CPLD to meet AC timing without inserting wait states.
Recommended
5 V to 3.3 V Mixed-Voltage Level Translation
Thanks to MultiVolt I/O on the VCCIO pins, the EPM3512AFC256-7/AFI256-10 can be configured with VCCINT=3.3 V and VCCIO=5 V, allowing it to bridge 5 V microcontrollers or legacy peripherals with 3.3 V ASICs and DSPs without external level-shifters. Each I/O bank is independently configurable, so designers can host both 5 V and 3.3 V domains on the same chip. The 208 I/O count and JTAG-controlled in-system programmability also make it suitable as a reconfigurable voltage-bridging hub during prototype bring-up.
Recommended
FPGA Configuration and Power Sequencing Controller
Designers frequently use the EPM3512AFC256-7/AFI256-10 as a configuration manager that loads SRAM-based FPGAs from SPI or parallel Flash, monitors DONE and INIT_B flags, and sequences peripheral power rails at board bring-up. Its non-volatile EEPROM configuration means the CPLD is operational within microseconds of VCCINT ramp, well before FPGAs complete their load cycle. With up to 227.3 MHz internal counter frequency, it can also generate precise reset delays, watchdog timers, and clock-glitch-free reset distribution across the board.
Recommended
High-Speed State Machine and FIFO Controller
The EPM3512AFC256-7/AFI256-10's deterministic 7.5 ns tPD and 227.3 MHz counter ceiling make it well suited for high-speed state machines, FIFO pointer logic, and SDRAM/DDR address multiplexers. The deterministic timing allows designers to close timing budgets without pessimism margins typical of FPGAs. Parallel expander chains in the MAX 3000A architecture also help fit wide decode equations into a single macrocell, reducing latency in deep state transitions common in industrial communication protocols.
Recommended
JTAG-Boundary Scan Test Infrastructure
The EPM3512AFC256-7/AFI256-10 implements IEEE Std. 1149.1 (JTAG) boundary-scan on every user I/O, making it valuable as a board-level test access port and chain element. Multiple MAX 3000A devices can be JTAG-chained with FPGAs and boundary-scan controllers to provide interconnect test coverage between BGAs where bed-of-nails probing is impractical. The dedicated TCK, TMS, TDI, TDO pins and BSDL file provided by Altera simplify integration into ATE workflows such as JTAG Technologies and Corelis platforms.
Recommended
Industrial Automation and Process Control
Industrial control systems frequently use the EPM3512AFC256-7/AFI256-10 to implement deterministic pulse-train generators, encoder quadrature decoders, and PWM controllers for motor drives. Its non-volatile EEPROM configuration ensures instant-on behavior required for fail-safe machine logic, while the 208 I/Os support multi-axis control loops without external bus expanders. The -10 industrial temperature variant (AFI suffix) covers -40 °C to +85 °C operation, making it suitable for factory-floor and outdoor cabinet installations.
Recommended
Recommended Products Summary
Engineering reference data for EPM3512AFC256-7/AFI256-10 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPM3512AFC256-10N | EPM3512AFI256-10 | EPM3512AFC256-10 | EPM3512AFC256-5C | EPM3256AFC256-10 |
|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | 256-ball FineLine BGA | 256-ball FineLine BGA - same | 256-ball FineLine BGA - same | 256-ball FineLine BGA - same | 256-ball FineLine BGA - same | 256-ball FineLine BGA - same |
| Macrocells | 512 | 512 | 512 | 512 | 512 | 256 |
| Pin-to-Pin Delay (tPD) | 7.5 ns (-7) | 10 ns | 10 ns | 10 ns | 5 ns | 10 ns |
| User I/O | 208 | 208 | 208 | 208 | 208 | 158 |
| Supply Voltage (VCCINT) | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| Operating Temperature | [DATA_NEEDED] | [DATA_NEEDED] | Industrial -40C to +85C | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Key Differentiators
- Same 256-BGA footprint across all speed grades (vs EPM3512AFC256-10N)
- Industrial temperature variant available (vs EPM3512AFI256-10)
- Higher macrocell density than EPM3256A family (vs EPM3256AFC256-10)
Design Notes
The EPM3512AFC256-7/AFI256-10 requires a clean 3.3 V core supply on VCCINT, with bulk decoupling of 100 µF tantalum + 0.1 µF + 0.01 µF ceramics placed within 1 cm of the supply balls. VCCIO can be set independently per I/O bank to 2.5 V, 3.3 V, or 5 V to support MultiVolt interfaces; tie unused VCCIO balls to VCCINT (3.3 V). During power-up, VCCINT must ramp monotonically; a POR (power-on-reset) circuit holds the device in reset until VCCINT reaches the datasheet-mandated threshold.
The 256-ball FineLine BGA requires a 4-layer (or more) PCB with microvia or via-in-pad stackups to fan out the 1.0 mm ball pitch. Maintain a continuous ground plane directly under the device and route high-speed clocks (GCLK, TCK) on the top layer with matched lengths to avoid skew. ESD protection on JTAG lines is recommended if the connector is user-accessible, and unused I/O balls should be left floating per Altera's recommendation to minimize quiescent current.
Common pitfalls when designing with the EPM3512AFC256-7/AFI256-10 include: (1) mixing speed grades in a JTAG chain - all chain devices must support the same TCK frequency or the chain must be reconfigured; (2) forgetting that the device is non-volatile but uses ISP via JTAG, so designers must keep JTAG pins accessible for field updates; (3) choosing the wrong speed grade - the -7 grade (7.5 ns tPD) is 25% faster than the -10 but at higher cost; verify timing closure before substituting. Unused I/Os should be left floating, not pulled up/down.
Compliance Information
Compliance information not specified in the verified web data; all compliance fields set to unknown except AEC-Q100 (not qualified - industrial grade only). The -10N variants indicate lead-free finishes, but explicit RoHS/REACH certificates were not retrieved.
