K9NUGY8R6B-BCQ0 - Samsung NAND Flash Memory | Samsung Electronics
MPN: K9NUGY8R6B-BCQ0 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $0 | $0.00 |
| 10 | $0 | $0.00 |
| 100 | $0 | $0.00 |
| 500 | $0 | $0.00 |
| 1,000 | $0 | $0.00 |
Drop-in alternatives for K9NUGY8R6B-BCQ0 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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K9MUGY8R4A-BCQ0
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View Datasheet →K9MUGY8R4A-CCQ0
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View Datasheet →K9LUGY8J7D-BCK0
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View Datasheet →K9KUGY8J7C-BCK0
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$9.55 / Unit
View Datasheet →K9JUGY8J5C-BCK0
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View Datasheet →K9NUGY8R6B-BCQ0 Maximum Ratings & Electrical Characteristics
| Manufacturer | Samsung Electronics |
| Product Family | K9NUGY series NAND flash |
| Memory Type | NAND Flash |
| Interface | Asynchronous NAND I/O (command/address/data multiplexed) |
| Mounting Type | Surface Mount |
| RoHS Status | unknown |
K9NUGY8R6B-BCQ0 [data_needed: package code] Pin Configuration Guide
Complete pinout information for K9NUGY8R6B-BCQ0 ([data_needed: package code] package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
![[data_needed: package code] package pinout diagram for K9NUGY8R6B-BCQ0](/assets/package-diagrams/default.svg?v=1788069619)
No detailed pinout data available for K9NUGY8R6B-BCQ0.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
K9NUGY8R6B-BCQ0 is suitable for 6 applications: Solid-State Drive (SSD) Storage, Embedded Storage Modules (eMMC/eUFS-class systems), Digital TV and Set-Top Box Firmware Storage, Industrial Data Loggers, Network Attached Storage and Routers, Removable Media and USB Storage.
Solid-State Drive (SSD) Storage
Raw NAND flash devices of this class form the storage core of client and enterprise SSDs, where multiple NAND packages are connected to a single SSD controller that manages wear leveling, garbage collection, and ECC. The K9NUGY8R6B-BCQ0's BGA surface-mount package enables high board density, and the standard asynchronous NAND interface integrates directly with mainstream SSD controller silicon. In this role the NAND's program/erase endurance and page program time directly determine drive write endurance and sustained throughput. Designers should match the controller's supported NAND generations and ECC strength to the datasheet requirements, and verify thermal design so that sustained write workloads keep the package within its specified operating temperature range.
Recommended
Embedded Storage Modules (eMMC/eUFS-class systems)
Embedded storage designs combine raw NAND with a controller on a single module to provide managed flash storage for smart TVs, set-top boxes, industrial PCs, and networking equipment. The K9NUGY8R6B-BCQ0 serves as the non-volatile data store, while the module controller hides NAND-specific behaviors such as bad-block management and wear leveling from the host. Its high per-package density reduces component count and board area compared with lower-density alternatives. When designing such modules, firmware must implement the Samsung-specified bad-block marker scheme, and power-fail protection must ensure that interrupted program operations do not corrupt previously written pages. Verify the exact page and block organization from the Samsung datasheet before porting existing firmware.
Recommended
Digital TV and Set-Top Box Firmware Storage
Digital televisions and set-top boxes use raw NAND to store firmware, channel databases, application images, and user recordings. The K9NUGY8R6B-BCQ0 fits this application because its high density accommodates increasingly large firmware images and DVR buffers, while its standard NAND interface connects to the SoC's built-in memory controller. Consumer SoCs typically include hardware ECC engines sized for the NAND generation they were designed against, so the NAND generation must match the SoC support list. Typical designs place the NAND on short, matched traces to the SoC and use the manufacturer's recommended decoupling network, since program operations inject current pulses onto shared supply rails during video recording.
Recommended
Industrial Data Loggers
Industrial data loggers record sensor readings, machine health data, and event logs over multi-year service lives, requiring storage that retains data through power loss and harsh temperatures. A raw NAND device such as the K9NUGY8R6B-BCQ0 provides the required endurance and density when paired with a controller performing wear leveling, power-fail recovery, and error correction. The page-program architecture allows efficient sequential logging, and the BGA package withstands vibration better than socketed media. Designers must confirm the industrial temperature range and retention specifications from the Samsung datasheet, implement brown-out detection to stop program operations cleanly, and reserve spare blocks to sustain write endurance across the product's service life.
Recommended
Network Attached Storage and Routers
Networking equipment uses NAND flash for boot images, configuration stores, firmware upgrades, and local caching. The K9NUGY8R6B-BCQ0's high density supports dual-firmware banking for safe over-the-air upgrades, where a failure during update leaves the previous image intact. Its standard NAND interface works with the memory controllers integrated into networking SoCs, and the surface-mount BGA package suits the compact layouts of router and NAS boards. Reliability is the primary requirement here: the design should implement read-retry and scrubbing in firmware to correct read disturbances over long powered-on periods, and the PCB should route the NAND bus away from switching regulator nodes to preserve signal integrity on the multiplexed I/O lines.
Recommended
Removable Media and USB Storage
USB flash drives and memory card products use raw NAND die combined with compact single-chip controllers. The K9NUGY8R6B-BCQ0 can serve this market when its package outline and density align with the drive's form factor and capacity targets. In this cost-sensitive segment the NAND's cell technology determines cost per gigabyte, while its page program time influences sequential write speed as perceived by end users. Controllers for removable media implement simplified wear leveling sized to typical consumer duty cycles. Design teams should verify the NAND's voltage range matches the controller's power tree, typically a single low-voltage rail in portable products, and confirm that the controller ECC strength satisfies the Samsung datasheet requirement for this NAND generation.
Recommended
Recommended Products Summary
Engineering reference data for K9NUGY8R6B-BCQ0 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | K9MUGY8R4A-BCQ0 | K9MUGY8R4A-CCQ0 | K9LUGY8J7D-BCK0 |
|---|---|---|---|---|
| Package | [DATA_NEEDED] | BGA (BCQ0 code) | BGA (CCQ0 code) | BGA (BCK0 code) |
| Brand | Samsung Electronics | Samsung Electronics | Samsung Electronics | Samsung Electronics |
| Memory Type | NAND Flash | NAND Flash | NAND Flash | NAND Flash |
| Density | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
| Cell Technology | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
| Supply Voltage | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
| Page Program Time | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
| Price Tier (Qty 1) | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
Key Differentiators
- Newer UGY generation designation (vs K9JUGY8J5C-BCK0)
- Same-family substitution path (vs K9MUGY8R4A-BCQ0)
- Standard NAND interface compatibility (vs K9MUGY8R4A-CCQ0)
Design Notes
Raw NAND devices draw pulsed supply current during program and erase operations, with the erase phase typically the highest-current event. Place 100 nF ceramic decoupling capacitors immediately adjacent to each VCC and VCCQ ball, plus bulk capacitance per the Samsung datasheet recommendation. Confirm the exact VCC/VCCQ ranges from the official datasheet before finalizing the power tree, since NAND generations differ in their core versus I/O voltage domains. Shared rails with other memory should be locally regulated or well decoupled to prevent program-time droop.
The NAND interface multiplexes command, address, and data on one 8-bit or 16-bit bus with control signals (CLE, ALE, RE, WE). Keep these traces short and length-matched within the group, and route away from switching regulator inductors and clock lines. For BGA-packaged NAND, fan out with controlled-impedance breakout and reference the bus to a solid ground plane. Verify setup/hold compliance at your maximum clock rate using the datasheet AC timing table; derate for the full operating temperature range, not just room temperature.
The most frequent raw NAND integration errors are (1) firmware ECC strength below the datasheet requirement for the NAND cell technology, causing field data corruption over time, (2) missing power-fail handling that corrupts pages during brown-outs mid-program, and (3) PCB footprints drawn from an older package revision. Always pull the footprint and ball map from the current Samsung datasheet, implement the specified bad-block management scheme, and validate read-retry behavior across the full temperature range before mass production.
Compliance Information
Compliance data was not present in verified web data as of 2026-09-04. Check Samsung's product page for environmental declarations.
