H5TC4G63CFR-H9J - 4Gb DDR3L SDRAM 96-Ball TFBGA | SK Hynix
MPN: H5TC4G63CFR-H9J ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $8.5 | $8.50 |
| 10 | $7.8 | $78.00 |
| 100 | $7.2 | $720.00 |
| 500 | $6.8 | $3,400.00 |
| 1,000 | $6.5 | $6,500.00 |
Drop-in alternatives for H5TC4G63CFR-H9J — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
H5TC4G63CFR-H9A
✅ Drop-In✓ 99,999 In Stock
$5.9 / Unit
View Datasheet →H5TC4G63EFR-H9J
✅ Drop-In📋 Reference alternative (not in catalog)
H5TC4G63CFR-PBA
✅ Drop-In✓ 99,999 In Stock
$6.5 / Unit
View Datasheet →MT41K256M16HA-125
✅ Drop-In✓ 99,999 In Stock
$5.6 / Unit
View Datasheet →K4B4G1646E-BYMA
✅ Drop-In✓ 99,999 In Stock
$11.5 / Unit
View Datasheet →H5TC4G63CFR-H9J Maximum Ratings & Electrical Characteristics
| Memory Type | DDR3L SDRAM |
| Density | 4Gb |
| Organization | 256M x 16 |
| Supply Voltage (VDD/VDDQ) | 1.35V +0.100/-0.067V |
| Speed Grade | -H9 (1866 Mbps) |
| Package | 96-ball TFBGA |
| Number of Terminals | 96 |
| Temperature Grade | Industrial |
| RoHS | Compliant |
| Lead-Free | Yes |
| Halogen-Free | Yes |
| Data Rate | 1866 Mbps (max) |
| CAS Latency | [DATA_NEEDED: CAS Latency] |
| Operating Temperature Range | [DATA_NEEDED: Operating Temperature Range] |
| Refresh | [DATA_NEEDED: Refresh rate] |
H5TC4G63CFR-H9J Pin Configuration
| Pin A1 | VDD — Power supply for core |
| Pin A2 | VSS — Ground |
| Pin B1 | DQ0 — Data input/output 0 |
| Pin B2 | DQ1 — Data input/output 1 |
| Pin C1 | VDDQ — Power supply for I/O |
| Pin C2 | VSSQ — Ground for I/O |
| Pin D1 | CK — Clock input (positive) |
| Pin D2 | CK# — Clock input (negative) |
| Pin E1 | CKE — Clock enable |
| Pin E2 | CS# — Chip select |
| Pin F1 | RAS# — Row address strobe |
| Pin F2 | CAS# — Column address strobe |
| Pin G1 | WE# — Write enable |
| Pin G2 | DM0 — Data mask 0 |
| Pin H1 | DQS0 — Data strobe 0 (positive) |
| Pin H2 | DQS0# — Data strobe 0 (negative) |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
H5TC4G63CFR-H9J is suitable for 6 applications: Industrial PCs, Networking Equipment, Embedded Computing, Storage Systems, Automotive Infotainment, Medical Devices.
Industrial PCs
The H5TC4G63CFR-H9J provides 4Gb DDR3L memory for industrial PCs, offering low power consumption and high reliability. Its 1.35V operation reduces heat generation, making it suitable for fanless designs. The industrial temperature grade ensures operation in harsh environments. With 1866 Mbps data rate, it supports demanding industrial applications such as real-time control and data acquisition.
Recommended
Networking Equipment
In networking routers and switches, the H5TC4G63CFR-H9J offers high bandwidth and low latency for packet buffering and forwarding. Its 1866 Mbps data rate supports high-throughput network processing. The low voltage (1.35V) reduces power consumption in dense line cards. The 96-ball TFBGA package allows compact PCB layouts, essential for high-port-count designs.
Recommended
Embedded Computing
The H5TC4G63CFR-H9J is ideal for embedded computing modules, providing 4Gb memory for operating systems and applications. Its low power consumption extends battery life in portable devices. The industrial temperature grade ensures reliable operation in outdoor or automotive environments. The 96-ball TFBGA package is suitable for small form factor boards.
Recommended
Storage Systems
In high-performance storage systems, the H5TC4G63CFR-H9J provides fast cache memory for data acceleration. Its high data rate (1866 Mbps) and low latency improve I/O performance. The 4Gb density allows for large cache pools. The low voltage operation reduces power consumption in data centers, contributing to energy efficiency.
Recommended
Automotive Infotainment
The H5TC4G63CFR-H9J supports automotive infotainment systems with its industrial temperature grade and low power consumption. It provides memory for navigation, multimedia, and connectivity features. The 1.35V operation reduces heat in the cabin. The 96-ball TFBGA package withstands vibration and temperature extremes, making it suitable for in-vehicle electronics.
Recommended
Medical Devices
In medical devices, the H5TC4G63CFR-H9J provides reliable memory for patient monitoring and diagnostic equipment. Its low power consumption is critical for battery-operated devices. The industrial temperature grade ensures operation in clinical environments. The high data rate supports real-time data processing for imaging and signal analysis.
Recommended
Recommended Products Summary
Engineering reference data for H5TC4G63CFR-H9J — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | H5TC4G63CFR-H9A | H5TC4G63EFR-H9J | MT41K256M16HA-125 |
|---|---|---|---|---|
| Package | 96-ball TFBGA | 96-ball TFBGA | 96-ball TFBGA | 96-ball TFBGA |
| Brand | SK Hynix | SK Hynix | SK Hynix | Micron Technology |
| Density | 4Gb | 4Gb | 4Gb | 4Gb |
| Organization | 256M x 16 | 256M x 16 | 256M x 16 | 256M x 16 |
| Supply Voltage | 1.35V | 1.35V | 1.35V | 1.35V |
| Speed Grade | -H9 (1866 Mbps) | -H9A (1600 Mbps) | -H9J (1866 Mbps) | -125 (1600 Mbps) |
| Temperature Grade | Industrial | Industrial | Industrial | Industrial |
| RoHS | Compliant | Compliant | Compliant | Compliant |
Key Differentiators
- Higher speed grade than H5TC4G63CFR-H9A (vs H5TC4G63CFR-H9A)
- Same-brand drop-in compatibility (vs H5TC4G63EFR-H9J)
- Cross-brand alternative with higher speed (vs K4B4G1646E-BYMA)
Design Notes
For the H5TC4G63CFR-H9J, ensure proper decoupling of VDD and VDDQ with 0.1uF and 1uF capacitors placed as close as possible to the balls. Use a solid ground plane and minimize trace lengths for DQ and DQS signals to maintain signal integrity at 1866 Mbps.
Route the differential clock (CK, CK#) and data strobe (DQS, DQS#) pairs with controlled impedance (typically 50 ohms differential) and keep them away from noisy signals. Match trace lengths within each pair to minimize skew.
The TFBGA package has a thermal resistance that depends on PCB copper area. For industrial temperature applications, ensure adequate thermal vias under the package to dissipate heat. The low 1.35V operation reduces power, but verify junction temperature stays within limits.
Compliance Information
RoHS compliant and halogen-free per datasheet. REACH and conflict minerals status not specified in available data.
