RTAX4000S-1LG1272PROTO - 4M-Gate Rad-Tolerant FPGA | Microchip
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Drop-in alternatives for RTAX4000S-1LG1272PROTO — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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RTAX4000SL-1LG1272PROTO
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View Datasheet →RTAX4000SL-1LG1272PROTO
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View Datasheet →RTAX4000S-1LG1272PROTO Maximum Ratings & Electrical Characteristics
| Manufacturer | Microchip Technology (Actel/Microsemi) |
| Family | RTAX-S/SL and RTAX-DSP Radiation-Tolerant FPGAs |
| Equivalent System Gates | 4,000,000 |
| Configurable Logic Blocks (CLBs) | 40,320 |
| Logic Cells | 60,480 |
| Technology | CMOS, antifuse (non-volatile) |
| Core Supply Voltage | 1.5 V (range 1.425 V to 1.575 V) |
| Package | 1272-ball Ceramic Column Grid Array (CCGA, LG1272) |
| Package Dimensions | 37.5 mm x 37.5 mm |
| Terminal Pitch | 1.00 mm |
| Embedded Memory | Embedded SRAM with built-in FIFO control logic |
| Clock Features | Segmentable clocks, chip-wide highway routing |
| Configuration | Live at power-up, single chip (no external config memory) |
| Variant Grade | PROTO (same silicon and packaging as flight units, without some flight-model tests) |
| Target Market | Spaceflight systems (radiation-tolerant) |
RTAX4000S-1LG1272PROTO 37.5 mm x 37.5 mm Pin Configuration Guide
Complete pinout information for RTAX4000S-1LG1272PROTO (37.5 mm x 37.5 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for RTAX4000S-1LG1272PROTO.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
RTAX4000S-1LG1272PROTO is suitable for 6 applications: Satellite Onboard Data Handling, Payload Data Processing, Spacecraft Avionics and Telemetry, Radiation-Tolerant Prototyping and HDL Validation, Communications Satellite Transponder Electronics, Space Science Instruments and Deep-Space Probes.
Satellite Onboard Data Handling
The RTAX4000S-1LG1272PROTO fits spacecraft onboard data handling (OBDH) units where a single radiation-tolerant FPGA must implement telemetry formatting, command decoding, and memory controllers within one live-at-power-up chip. Its 4,000,000 equivalent gates, 40,320 CLBs, and 60,480 logic cells absorb bus protocol interfaces and housekeeping logic that would otherwise require several commercial devices, improving board reliability in single-string avionics. Because the antifuse fabric configures instantly without external boot flash, the FPGA is operational as soon as the 1.5V core (1.425V to 1.575V) rises, simplifying power-on sequencing for satellite cold-start. In prototyping phases the PROTO grade provides flight-identical silicon and the same 37.5mm x 37.5mm LG1272 CCGA footprint, so firmware validated on this part transfers directly to flight units.
Recommended
Payload Data Processing
High-throughput imaging and radar payloads rely on the RTAX-S family's up to four million system gates for real-time pre-processing, compression staging, and formatter pipelines. The RTAX4000S-1LG1272PROTO supplies embedded SRAM blocks with built-in FIFO control logic, which are ideal for buffering high-rate sensor streams, and segmentable clocks that let designers isolate timing domains for ADC interfaces and processing engines. The chip-wide highway routing resource distributes global control signals with low skew across the 60,480 logic cells. Using the PROTO variant lets payload teams execute algorithm-to-silicon iterations on the exact 1272-ball LG1272 package (1.00mm pitch) destined for flight, de-risking signal integrity on the dense ceramic column array before committing to flight-grade RTAX4000S/SL orderable codes.
Recommended
Spacecraft Avionics and Telemetry
Spacecraft avionics modules benefit from the RTAX4000S-1LG1272PROTO's low-power CMOS operation at a nominal 1.5V core, which reduces power budget pressure on limited satellite rails. The device consolidates CAN/UART-style telemetry framing, discrete I/O conditioning, and watchdog logic into the single CCGA package, and Microchip identifies live-at-power-up operation and true single-chip form factor as family hallmarks for space-flight designers. The ceramic column package withstands launch vibration better than plastic BGA alternatives. In PROTO grade, this part enables avionics teams to validate power sequencing (1.425V to 1.575V core window), connector pin maps, and board-level thermal design on hardware that is electrically and mechanically identical to the eventual flight device from Microchip's RT-PROTO line.
Recommended
Radiation-Tolerant Prototyping and HDL Validation
Dedicated prototyping is the primary designed purpose of RTAX4000S-1LG1272PROTO. According to Microchip's Prototyping Solutions documentation, RT-PROTO devices use the same silicon and packaging as flight units without some flight-model tests, giving engineers realistic timing, I/O behavior, and footprint mechanics at prototyping cost. Teams compile designs in Microchip Libero, program the antifuse one time, and run hardware validation on the 4,000,000-gate fabric. The same LG1272 CCGA footprint as flight parts means PCB revisions are not needed when migrating to flight silicon. For iterations that must be reprogrammable, Microchip and Aldec jointly offer a flash-based ProASIC3E prototyping adaptor for RTAX designs, which complements rather than replaces the one-time-programmable PROTO device in the validation flow.
Recommended
Communications Satellite Transponder Electronics
Communications satellites use RTAX-S FPGAs for baseband framing, forward error correction interfacing, and switch-matrix control. The RTAX4000S-1LG1272PROTO offers enough logic cells (60,480) and embedded FIFO-managed SRAM to implement multiple channel controllers in a single device, while segmentable clocks support simultaneous handling of uplink and downlink timing domains. The 1.5V CMOS core limits power draw in thermally constrained transponder shelves, and the 37.5mm x 37.5mm, 1.00mm-pitch LG1272 ceramic column package supports the solder-column assembly processes standard in high-reliability space electronics manufacturing. Prototype the full transponder logic on this PROTO part, then migrate the same bitstream configuration flow to flight-grade RTAX4000S/SL LG1272 devices for qualification and flight builds.
Recommended
Space Science Instruments and Deep-Space Probes
Deep-space and science instruments require logic that tolerates ionizing radiation over multi-year missions. Microchip positions the RTAX-S family as the FPGA of choice for space-flight systems owing to low power consumption, true single-chip form factor, and live-at-power-up operation - properties that matter for instruments that cannot rely on external configuration devices or frequent resets. The RTAX4000S-1LG1272PROTO lets instrument teams implement detector sequencers, high-speed acquisition pipelines, and science-data formatting across 4,000,000 equivalent gates of antifuse fabric. Because the PROTO device shares silicon and the 1272-ball LG1272 package with flight units, radiation test campaigns and instrument-level environmental testing can be performed on representative hardware before flight-grade RTAX4000S/SL parts are procured for the mission build.
Recommended
Recommended Products Summary
Engineering reference data for RTAX4000S-1LG1272PROTO — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | RTAX4000SL-1LG1272PROTO | RTAX4000SL-LG1272V | RTAX4000SL-CG1272B |
|---|---|---|---|---|
| Package | 1272-ball CCGA (LG1272), 37.5mm x 37.5mm, 1.00mm pitch | 1272-ball CCGA (LG1272) - same | 1272-ball CCGA (LG1272) - same | 1272-column CCGA (CG1272) - related ceramic column package |
| Brand | Microchip Technology (Actel/Microsemi) | Microchip Technology | Microchip Technology | Microchip Technology |
| Equivalent System Gates | 4,000,000 | 4,000,000 | 4,000,000 | 4,000,000 |
| Logic Cells | 60,480 | 60,480 | 60,480 | 60,480 |
| CLBs | 40,320 | 40,320 | 40,320 | 40,320 |
| Core Supply Voltage | 1.5 V (1.425 V to 1.575 V) | 1.5 V nominal | 1.5 V nominal | 1.5 V nominal |
| Screening Grade | PROTO (no some flight-model tests) | PROTO | Flight grade (V) | Flight grade (B) |
| Configuration | Antifuse, live at power-up, single chip | Antifuse, live at power-up | Antifuse, live at power-up | Antifuse, live at power-up |
| Technology | CMOS | CMOS | CMOS | CMOS |
Key Differentiators
- Flight-identical silicon at prototyping cost (vs RTAX4000SL-LG1272V)
- Largest RTAX-S density for space designs (vs RTAX2000SL-1LG1152V)
- Single-chip configuration without external flash (vs SRAM-based space FPGAs)
Design Notes
Regulate the core rail tightly to the 1.5V nominal window of 1.425V to 1.575V specified by Microchip USA product data. Space power buses are typically 28V or 100V, so use a radiation-tolerant point-of-load converter plus an LDO stage for clean 1.5V sequencing. Because antifuse FPGAs draw no configuration current at power-up (live at power-up), inrush is governed mainly by decoupling capacitance - size it for bus stability rather than boot behavior.
The LG1272 CCGA uses solder columns at a 1.00mm pitch on a 37.5mm x 37.5mm body. Follow the column land pattern from the RTAX-S/SL datasheet (DS2169) exactly, and remember Microchip support notes that the RTAX-DSP CG/LG1272 body is slightly larger than the RTAX4000S/SL version - footprints are NOT interchangeable across those device types. Design an escape fan-out that permits column inspection and rework per typical high-reliability space assembly practice.
Antifuse FPGAs are one-time programmable: a design change requires a new device, so complete full timing simulation and sign-off in Microchip Libero before programming RTAX4000S-1LG1272PROTO units. Also, PROTO parts lack some flight-model tests - never fly them. Track which device you have: same-family RTAX4000D parts use a larger CG/LG1272 body, so ordering errors can break footprint compatibility late in the program.
At 1.00mm pitch with 1272 columns, impedance control and stub length matter for high-speed I/O. Assign banks per the datasheet bank rules, keep reference planes unbroken beneath high-speed nets, and simulate the CCGA column interconnect for switch-backplane or payload-data rates. Use series termination on fast single-ended outputs and confirm I/O bank voltages against the DS2169 electrical tables before layout freeze.
Compliance Information
This is an aerospace/space-flight component; AEC-Q100 is not applicable. RoHS/REACH status not stated in verified data - ceramic CCGA packages commonly use high-lead solder columns under defense/aerospace exemptions; request material declarations from Microchip.
