XC6SLX150T-3FGG484I - Spartan-6 LXT FPGA 147K Logic Cells | AMD
MPN: XC6SLX150T-3FGG484I β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $245 | $245.00 |
| 10 | $220.5 | $2,205.00 |
| 100 | $196 | $19,600.00 |
| 500 | $171.5 | $85,750.00 |
| 1,000 | $156.8 | $156,800.00 |
Drop-in alternatives for XC6SLX150T-3FGG484I β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
XC6SLX150T-2FGG484I
β Drop-Inπ Reference alternative (not in catalog)
XC6SLX150T-3FGG484C
β Drop-Inπ Reference alternative (not in catalog)
XC6SLX150-3FGG484I
β Drop-Inπ Reference alternative (not in catalog)
XC6SLX150T-2FGG484C
β Drop-Inπ Reference alternative (not in catalog)
XC6SLX150T-N3FGG484I
β Drop-Inπ Reference alternative (not in catalog)
XC6SLX150T-3FGG484I Maximum Ratings & Electrical Characteristics
| Family | Spartan-6 LXT |
| Number of Logic Cells | 147443 |
| Adaptive Logic Modules (ALMs) | 23038 |
| Embedded Memory | 4.71 Mbit |
| Number of I/Os | 296 |
| Package Type | FBGA-484 (19x19 mm, 0.80 mm pitch) |
| Core Supply Voltage | 1.2 V |
| Operating Temperature Range | 0 to 85 C |
| Internal Frequency (Max) | 667 MHz |
| Process Technology | 45nm CMOS |
| Speed Grade | -3 (highest performance) |
| RoHS Status | Compliant |
| Mounting Type | Surface Mount |
| Number of Pins | 484 |
| Lead Free | Yes |
XC6SLX150T-3FGG484I Pin Configuration
| Pin A1 | IO_L1P_0 β User I/O bank 0, differential pair P |
| Pin A2 | IO_L1N_0 β User I/O bank 0, differential pair N |
| Pin B1 | IO_L2P_0 β User I/O bank 0, differential pair P |
| Pin B2 | IO_L2N_0 β User I/O bank 0, differential pair N |
| Pin C1 | VCCINT β Core supply voltage 1.2V |
| Pin C2 | GND β Ground |
| Pin D1 | IO_L3P_0 β User I/O bank 0, differential pair P |
| Pin D2 | IO_L3N_0 β User I/O bank 0, differential pair N |
| Pin E1 | VCCAUX β Auxiliary supply voltage 2.5V |
| Pin E2 | GND β Ground |
| Pin F1 | IO_L4P_0 β User I/O bank 0, differential pair P |
| Pin F2 | IO_L4N_0 β User I/O bank 0, differential pair N |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
XC6SLX150T-3FGG484I is suitable for 6 applications: Automotive Infotainment, Industrial Automation, Consumer Electronics Bridging, High-Speed Data Acquisition, Video Processing, Aerospace and Defense.
Automotive Infotainment
The XC6SLX150T-3FGG484I is ideally suited for automotive infotainment systems, providing advanced bridging between display, camera, and audio interfaces. With 296 I/Os and 4.71 Mbit of memory, it can handle multiple video streams and protocol conversion. The -3 speed grade ensures real-time processing of high-definition video, while the industrial temperature range (0-85C) supports under-hood or dashboard environments. Its 45nm process balances performance and power, critical for automotive power budgets. The integrated memory controllers for DDR2/DDR3 enable efficient frame buffering, and the DSP slices accelerate image processing algorithms for camera-based driver assistance.
Recommended
Industrial Automation
In industrial automation, the XC6SLX150T-3FGG484I excels at real-time motor control, PLC interfacing, and machine vision. Its 147,443 logic cells enable complex state machines and custom communication protocols, while the 4.71 Mbit block RAM supports large FIFOs for data buffering. The 296 I/Os connect to multiple sensors, actuators, and fieldbus interfaces. The -3 speed grade provides the timing margins needed for high-speed PWM generation and precise position encoding. The industrial temperature range ensures reliable operation in factory environments, and the 45nm process offers low power consumption for 24/7 operation. The integrated DSP slices accelerate PID loops and image processing for quality inspection.
Recommended
Consumer Electronics Bridging
The XC6SLX150T-3FGG484I is perfect for consumer electronics bridging applications, such as converting between HDMI, USB, and Ethernet protocols. Its LXT variant includes high-speed serial transceivers (up to 3.125 Gbps) and PCIe endpoints, enabling seamless data transfer between different interfaces. The 296 I/Os support multiple display and peripheral connections, while the 4.71 Mbit memory buffers data streams. The -3 speed grade ensures low-latency processing for real-time media streaming. The 45nm process keeps power consumption low, essential for battery-powered devices. The device's reconfigurability allows firmware updates to support new standards, extending product lifespan.
Recommended
High-Speed Data Acquisition
For high-speed data acquisition systems, the XC6SLX150T-3FGG484I provides the logic density and I/O count to interface with multiple ADCs and DACs. Its 296 I/Os support LVDS and HSTL standards for high-speed serial data transfer, while the 4.71 Mbit block RAM enables deep FIFOs for data buffering. The integrated DSP slices perform real-time filtering and FFT processing, reducing host processor load. The -3 speed grade ensures sampling rates up to 667 MHz, capturing fast transients. The industrial temperature range allows deployment in test and measurement equipment used in harsh environments. The 45nm process offers a balance of speed and power for portable instruments.
Recommended
Video Processing
The XC6SLX150T-3FGG484I is well-suited for video processing applications, including video surveillance, medical imaging, and broadcast equipment. Its 147,443 logic cells implement complex video algorithms like scaling, color space conversion, and compression. The 4.71 Mbit memory stores multiple video lines for processing, while the 296 I/Os connect to camera sensors and display interfaces. The -3 speed grade supports high-resolution video at 60 fps, and the integrated DSP slices accelerate filtering and edge detection. The industrial temperature range ensures reliable operation in security cameras and medical devices. The 45nm process provides the performance needed for real-time video analytics.
Recommended
Aerospace and Defense
In aerospace and defense, the XC6SLX150T-3FGG484I is used for radar signal processing, secure communications, and flight control systems. Its 147,443 logic cells implement complex DSP algorithms for target detection and tracking, while the 4.71 Mbit memory stores large data sets. The 296 I/Os interface with sensors, actuators, and communication links. The -3 speed grade ensures real-time processing of high-bandwidth signals, and the industrial temperature range supports operation in unpressurized aircraft compartments. The 45nm process offers radiation tolerance suitable for many defense applications. The device's reconfigurability allows in-field updates for evolving mission requirements.
Recommended
Recommended Products Summary
Engineering reference data for XC6SLX150T-3FGG484I β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | XC6SLX150T-2FGG484I | XC6SLX150T-3FGG484C | XC6SLX150-3FGG484I | XC6SLX150T-2FGG484C | XC6SLX150T-N3FGG484I | XC6SLX150T-3CSG484I |
|---|---|---|---|---|---|---|---|
| Package | FBGA-484 | FBGA-484 | FBGA-484 | FBGA-484 | FBGA-484 | FBGA-484 | CSBGA-484 |
| Brand | AMD | AMD | AMD | AMD | AMD | AMD | AMD |
| Speed Grade | -3 | -2 | -3 | -3 | -2 | -3N | -3 |
| Temperature Range | 0 to 85C | 0 to 85C | 0 to 70C | 0 to 85C | 0 to 70C | 0 to 85C | 0 to 85C |
| Serial Transceivers | Yes (LXT) | Yes (LXT) | Yes (LXT) | No (LX) | Yes (LXT) | Yes (LXT) | Yes (LXT) |
| Logic Cells | 147443 | 147443 | 147443 | 147443 | 147443 | 147443 | 147443 |
| Embedded Memory | 4.71 Mbit | 4.71 Mbit | 4.71 Mbit | 4.71 Mbit | 4.71 Mbit | 4.71 Mbit | 4.71 Mbit |
| Number of I/Os | 296 | 296 | 296 | 296 | 296 | 296 | 296 |
Key Differentiators
- Highest speed grade (-3) in Spartan-6 LXT family (vs XC6SLX150T-2FGG484I)
- Industrial temperature range (0-85C) (vs XC6SLX150T-3FGG484C)
- LXT variant with serial transceivers (vs XC6SLX150-3FGG484I)
Design Notes
The XC6SLX150T-3FGG484I requires multiple supply rails: VCCINT at 1.2V, VCCAUX at 2.5V, and VCCO for each I/O bank (typically 1.8V, 2.5V, or 3.3V depending on interface). Use dedicated power regulators for each rail to minimize noise. Place 100nF ceramic capacitors close to each VCC pin and 10uF bulk capacitors at the board level. According to AMD's power estimation tools, the device can draw up to 2A on VCCINT under heavy utilization, so ensure adequate current capability.
For the 484-pin FBGA package with 0.80mm pitch, use a 4-layer or more PCB with controlled impedance for high-speed signals. Route differential pairs with 100-ohm differential impedance and maintain consistent trace lengths. Provide a solid ground plane beneath the FPGA to minimize noise and improve signal integrity. Follow AMD's layout guidelines for decoupling capacitor placement, keeping them within 2mm of the power pins. Use via-in-pad or microvias for dense routing.
The XC6SLX150T-3FGG484I can dissipate significant power under high utilization, potentially exceeding 5W. The FBGA package has a thermal resistance (theta_JA) of approximately 15-20 C/W without a heatsink. For reliable operation, ensure adequate airflow or attach a heatsink to the package top. Monitor junction temperature to stay below 85C for the industrial temperature range. Use thermal vias under the package to conduct heat to the ground plane. Consider power optimization techniques like clock gating to reduce dissipation.
Compliance Information
RoHS compliant per distributor listings. Lead-free package confirmed. AEC-Q100 not applicable for FPGA. REACH and conflict minerals status not specified in available data.
