K4A4G165WD-BCTD vs H5AN4G6NBJR-UHC Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng K4A4G165WD-BCTD sa pamamagitan ng Samsung Electronics at H5AN4G6NBJR-UHC sa pamamagitan ng SK hynix. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Samsung Electronics
K4A4G165WD-BCTD - 4Gb DDR4 SDRAM x16 2666Mbps | Samsung
K4A4G165WD-BCTD ✓ NakahandaPagsanggunian na paghahambing
| Parametro | K4A4G165WD-BCTD | H5AN4G6NBJR-UHC |
|---|---|---|
| Brand | Samsung Electronics | SK hynix |
| Kategorya | Memory ICs | Memory ICs |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Uri ng Memory | DDR4 SDRAM | DDR4 SDRAM |
| Density | 4 Gbit | — |
| Organisasyon | 256M x 16 | 256M x 16 |
| Rate ng Data | 2666 Mbps/pin (-BCTD speed grade) | — |
| Supply Voltage (VDD) | 1.2 V | 1.14 V to 1.26 V |
| Core Supply (VPP) | 2.5 V | — |
| Interface | SSTL-12 | — |
| Data Mask | Yes (DM per byte lane) | — |
| Bank Architecture | 16 banks / 4 bank groups | — |
| Packhaging | 96-ball FBGA | FBGA-96 (PBGA-96) |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount |
| Temperature na Operasyon | 0C to +85C (commercial) | -40C to +95C |
| On-Die Termination | Dynamic ODT | Dynamic ODT |
| ZQ Calibration | Yes (external RZQ resistor) | Yes |
| CRC / CA Parity | CRC read/write support | — |
| Reset | Asynchronous reset (RESET_n) | — |
| Tindminan RoHS | [DATA_NEEDED: RoHS status] | Compliant |
| Laki ng Memory | — | 4 Gbit |
| Clock Frequency | — | 1.6 GHz |
| Technology | — | CMOS |
| Self Refresh | — | Auto self-refresh |
| Data Mask Function | — | Yes (DM) |
| Asynchronous Reset | — | Yes (RESET_n) |
| Write Leveling | — | Yes |
| CRC Function | — | Yes (command/address CRC) |